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Hai Ding, Ph.D. - Publications

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Packaging Engineering
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Ding H, Ume IC, Zhang J, Baldwin DF. Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study Ieee Transactions On Instrumentation and Measurement. 54: 1898-1904. DOI: 10.1109/Tim.2005.855088  0.376
2005 Ding H, Ume IC, Powell RE, Hanna CR. Parametric study of warpage in printed wiring board assemblies Ieee Transactions On Components and Packaging Technologies. 28: 517-524. DOI: 10.1109/Tcapt.2005.848570  0.52
2004 Ding H, Ume IC, Zhang C. Warpage Analysis of Underfilled Wafers Journal of Electronic Packaging. 126: 265-270. DOI: 10.1115/1.1707036  0.514
2002 Ding H, Powell RE, Hanna CR, Ume IC. Warpage measurement comparison using shadow moiré and projection moiré methods Ieee Transactions On Components and Packaging Technologies. 25: 714-721. DOI: 10.1109/Tcapt.2002.808010  0.529
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