Year |
Citation |
Score |
2020 |
Sun J, Cho J, Huang A, Kim H, Fan J. Accurate Rectifier Characterization and Improved Modeling of Constant Power Load Wireless Power Transfer Systems Ieee Transactions On Power Electronics. 35: 7840-7852. DOI: 10.1109/Tpel.2019.2961359 |
0.395 |
|
2020 |
Zheng Y, Weng Z, Qi Y, Fan J, Li F, Yang Z, Drewniak JL. Calibration Loop Antenna for Multiple Probe Antenna Measurement System Ieee Transactions On Instrumentation and Measurement. 69: 5745-5754. DOI: 10.1109/Tim.2019.2963507 |
0.588 |
|
2020 |
Li J, Qi Y, Yu W, Li F, Fan J, Yang Z, Wu S, Drewniak JL. Total Isotropic Sensitivity Measurement in Switched Beam Antenna Systems Ieee Transactions On Instrumentation and Measurement. 69: 5458-5467. DOI: 10.1109/Tim.2019.2958472 |
0.575 |
|
2020 |
Cai Z, Zhou Y, Liu L, Qi Y, Yu W, Fan J, Yu M, Luo Q. Small Anechoic Chamber Design Method for On-Line and On-Site Passive Intermodulation Measurement Ieee Transactions On Instrumentation and Measurement. 69: 3377-3387. DOI: 10.1109/Tim.2019.2937425 |
0.338 |
|
2020 |
Rezaei H, Meiguni JS, Sorensen M, Jobava RG, Khilkevich V, Fan J, Beetner DG, Pommerenke D. Source Reconstruction in Near-Field Scanning Using Inverse MoM for RFI Application Ieee Transactions On Electromagnetic Compatibility. 62: 1628-1636. DOI: 10.1109/Temc.2020.3006031 |
0.305 |
|
2020 |
Pu B, Fan J, Nah W. Immunity Enhancement of the Power Distribution Network in Integrated Circuits With Coplanar Meander Lines in Package Ieee Transactions On Electromagnetic Compatibility. 1-9. DOI: 10.1109/Temc.2019.2962096 |
0.338 |
|
2020 |
Wang Y, Cao YS, Liu D, Kautz RW, Altunyurt N, Fan J. Evaluating the Crosstalk Current and the Total Radiated Power of a Bent Cable Harness Using the Generalized MTL Method Ieee Transactions On Electromagnetic Compatibility. 62: 1256-1265. DOI: 10.1109/Temc.2019.2927222 |
0.345 |
|
2020 |
Kim H, Cho J, Yoon C, Achkir B, Drewniak J, Fan J. Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer Ieee Transactions On Electromagnetic Compatibility. 62: 880-893. DOI: 10.1109/Temc.2019.2921008 |
0.627 |
|
2020 |
Yong S, Khilkevich V, Cai X, Sui C, Sen B, Fan J. Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines With Lossy Conductor and Dielectric Ieee Transactions On Electromagnetic Compatibility. 62: 510-520. DOI: 10.1109/Temc.2019.2902070 |
0.343 |
|
2020 |
Ye L, Sun X, Huang T, Sun Y, Jin S, Chen B, Fan J. Modeling Stripline With Slotted Ground Plane in Multilayered Circuit Board Using PEEC Formulation Ieee Transactions On Electromagnetic Compatibility. 62: 280-284. DOI: 10.1109/Temc.2018.2889701 |
0.38 |
|
2020 |
Fan J. Signal integrity and power integrity Ieee Electromagnetic Compatibility Magazine. 9: 60-60. DOI: 10.1109/Memc.2020.9133245 |
0.31 |
|
2020 |
Chi L, Weng Z, Meng S, Qi Y, Fan J, Zhuang W, Drewniak JL. Rugged Linear Array for IoT Applications Ieee Internet of Things Journal. 7: 5078-5087. DOI: 10.1109/Jiot.2020.2976857 |
0.587 |
|
2019 |
Kim D, Kim H, Huang A, He Q, Zhang H, Ahn S, Zhu Y, Fan J. Analysis and Introduction of Effective Permeability with Additional Air-Gaps on Wireless Power Transfer Coils for Electric Vehicle Based on SAE J2954 Recommended Practice Energies. 12: 4797. DOI: 10.3390/En12244797 |
0.336 |
|
2019 |
Shu Y, Wei X, Fan J, Yang R, Yang Y. An Equivalent Dipole Model Hybrid With Artificial Neural Network for Electromagnetic Interference Prediction Ieee Transactions On Microwave Theory and Techniques. 67: 1790-1797. DOI: 10.1109/Tmtt.2019.2905238 |
0.366 |
|
2019 |
Wang J, Yan Z, Liu W, Su D, Yan X, Fan J. A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun Ieee Transactions On Instrumentation and Measurement. 68: 3042-3044. DOI: 10.1109/Tim.2019.2920700 |
0.353 |
|
2019 |
Wang J, Yan Z, Liu W, Yan X, Fan J. Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure Ieee Transactions On Instrumentation and Measurement. 68: 882-894. DOI: 10.1109/Tim.2018.2857898 |
0.319 |
|
2019 |
Wu C, Kim H, He J, Erickson N, Cho S, Kim D, Hur Y, Pommerenke DJ, Fan J. Analysis and Modeling of Conducted EMI from an AC–DC Power Supply in LED TV up to 1 MHz Ieee Transactions On Electromagnetic Compatibility. 61: 2050-2059. DOI: 10.1109/Temc.2019.2954360 |
0.362 |
|
2019 |
Chen B, Pan S, Wang J, Yong S, Ouyang M, Fan J. Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance Ieee Transactions On Electromagnetic Compatibility. 61: 1385-1394. DOI: 10.1109/Temc.2019.2925757 |
0.343 |
|
2019 |
Huang Q, Enomoto T, Seto S, Araki K, Fan J, Hwang C. A Transfer Function Based Calculation Method for Radio Frequency Interference Ieee Transactions On Electromagnetic Compatibility. 61: 1280-1288. DOI: 10.1109/Temc.2019.2912361 |
0.342 |
|
2019 |
Chen B, He J, Guo Y, Pan S, Ye X, Fan J. Multi-Ports ( [$2^{n}$ ) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization Ieee Transactions On Electromagnetic Compatibility. 61: 1261-1270. DOI: 10.1109/Temc.2019.2908782 |
0.698 |
|
2019 |
Yang H, Zhu L, Gao F, Fan J, Wen H. Measurement and Analysis of Passive Intermodulation Induced by Additional Impedance in Loose Contact Coaxial Connector Ieee Transactions On Electromagnetic Compatibility. 61: 1876-1883. DOI: 10.1109/Temc.2019.2892458 |
0.311 |
|
2019 |
Pan J, Gao X, Fan J. Identifying Interference From Multiple Noise Sources by Magnetic Near Fields Only Ieee Transactions On Electromagnetic Compatibility. 61: 1560-1567. DOI: 10.1109/Temc.2018.2871043 |
0.31 |
|
2019 |
Sun X, Huang T, Ye L, Sun Y, Jin S, Fan J. Analyzing Multiple Vias in a Parallel-Plate Pair Based on a Nonorthogonal PEEC Method Ieee Transactions On Electromagnetic Compatibility. 61: 1602-1611. DOI: 10.1109/Temc.2018.2870645 |
0.331 |
|
2019 |
Chen X, He Y, Yang S, Huang A, Zhang Y, Pommerenke DJ, Fan J. Coplanar Intermodulation Reference Generator using Substrate Integrated Waveguide with Integrated Artificial Nonlinear Dipole Ieee Transactions On Electromagnetic Compatibility. 61: 969-972. DOI: 10.1109/Temc.2018.2849965 |
0.316 |
|
2019 |
Wang Y, Cao YS, Liu D, Kautz RW, Altunyurt N, Fan J. A Generalized Multiple-Scattering Method for Modeling a Cable Harness With Ground Connections to a Nearby Metal Surface Ieee Transactions On Electromagnetic Compatibility. 61: 261-270. DOI: 10.1109/Temc.2018.2806320 |
0.327 |
|
2019 |
Liu W, Yan Z, Wang J, Yan X, Fan J. An Ultrawideband Electric Probe Based on U-Shaped Structure for Near-Field Measurement From 9 kHz to 40 GHz Ieee Antennas and Wireless Propagation Letters. 18: 1283-1287. DOI: 10.1109/Lawp.2019.2915258 |
0.351 |
|
2019 |
Shen P, Qi Y, Yu W, Fan J, Li F. OTA Measurement for IoT Wireless Device Performance Evaluation: Challenges and Solutions Ieee Internet of Things Journal. 6: 1223-1237. DOI: 10.1109/Jiot.2018.2868787 |
0.32 |
|
2018 |
Shen P, Qi Y, Yu W, Fan J, Yang Z, Wu S. A Decomposition Method for MIMO OTA Performance Evaluation Ieee Transactions On Vehicular Technology. 67: 8184-8191. DOI: 10.1109/Tvt.2018.2839726 |
0.355 |
|
2018 |
Yan Z, Liu W, Wang J, Su D, Yan X, Fan J. Noncontact Wideband Current Probes With High Sensitivity and Spatial Resolution for Noise Location on PCB Ieee Transactions On Instrumentation and Measurement. 67: 2881-2891. DOI: 10.1109/Tim.2018.2830859 |
0.347 |
|
2018 |
Li J, Qi Y, Yu W, Li F, Fan J, Orlandi A, Yang Z, Wu S. Notice of Retraction: Objective MIMO Measurement Ieee Transactions On Electromagnetic Compatibility. 60: 1190-1197. DOI: 10.1109/Temc.2018.2804041 |
0.355 |
|
2018 |
Huang Q, Fan J. Machine Learning Based Source Reconstruction for RF Desense Ieee Transactions On Electromagnetic Compatibility. 60: 1640-1647. DOI: 10.1109/Temc.2018.2797132 |
0.323 |
|
2018 |
Spadacini G, Fan J. Introduction to the Special Issue for the 2017 IEEE International Symposium on EMC+SIPI Ieee Transactions On Electromagnetic Compatibility. 60: 1036-1037. DOI: 10.1109/Temc.2018.2795358 |
0.304 |
|
2018 |
Yang H, Wen H, Qi Y, Fan J. An Equivalent Circuit Model to Analyze Passive Intermodulation of Loose Contact Coaxial Connectors Ieee Transactions On Electromagnetic Compatibility. 60: 1180-1189. DOI: 10.1109/Temc.2018.2794992 |
0.333 |
|
2018 |
Maghlakelidze G, Yan X, Guan L, Marathe S, Huang Q, Bae B, Hwang C, Khilkevich V, Fan J, Pommerenke D. SNR Analysis and Optimization in Near-Field Scanning and EMI Applications Ieee Transactions On Electromagnetic Compatibility. 60: 1087-1094. DOI: 10.1109/Temc.2018.2792778 |
0.334 |
|
2018 |
Huang Q, Li L, Yan X, Bae B, Park H, Hwang C, Fan J. MoM-Based Ground Current Reconstruction in RFI Application Ieee Transactions On Electromagnetic Compatibility. 60: 1121-1128. DOI: 10.1109/Temc.2018.2791539 |
0.316 |
|
2018 |
Jin S, Liu D, Wang Y, Chen B, Fan J. Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach Ieee Transactions On Electromagnetic Compatibility. 60: 1481-1490. DOI: 10.1109/Temc.2017.2782713 |
0.369 |
|
2018 |
Hwang C, Pommerenke D, Fan J, Enomoto T, Maeshima J, Araki K. Wideband Noise Measurement Technique in Duplex Systems for RF Interference Ieee Transactions On Electromagnetic Compatibility. 60: 1038-1044. DOI: 10.1109/Temc.2017.2782673 |
0.323 |
|
2018 |
Chada A, Mutnury B, Dikhaminjia N, Tsiklauri M, Fan J, Drewniak JL. Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours Using Transient Simulation of Short Bit Patterns Ieee Transactions On Electromagnetic Compatibility. 60: 1520-1528. DOI: 10.1109/Temc.2017.2776080 |
0.585 |
|
2018 |
Qi Y, Wu J, Gong G, Fan J, Orlandi A, Yu W, Ma J, Drewniak JL. Notice of Retraction: Review of the EMC Aspects of Internet of Things Ieee Transactions On Electromagnetic Compatibility. 60: 1152-1160. DOI: 10.1109/Temc.2017.2775651 |
0.567 |
|
2018 |
Kim H, Kim J, Fan J, Hwang C. Precise Analytical Model of Power Supply Induced Jitter Transfer Function at Inverter Chains Ieee Transactions On Electromagnetic Compatibility. 60: 1491-1499. DOI: 10.1109/Temc.2017.2764867 |
0.316 |
|
2018 |
Kim H, Cho J, Achkir B, Fan J. Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator Ieee Transactions On Electromagnetic Compatibility. 60: 1022-1025. DOI: 10.1109/Temc.2017.2759123 |
0.357 |
|
2018 |
Wang Y, Liu D, Cao YS, Kautz RW, Altunyurt N, Chandra S, Fan J. Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach Ieee Transactions On Electromagnetic Compatibility. 60: 971-980. DOI: 10.1109/Temc.2017.2756899 |
0.303 |
|
2018 |
Hwang C, Ouyang M, Fan J. Return Path Discontinuity Analysis of an Edge Mount SMA Launch Structure in Multilayer Boards Ieee Transactions On Electromagnetic Compatibility. 60: 453-458. DOI: 10.1109/Temc.2017.2735802 |
0.367 |
|
2018 |
Jin S, Liu D, Chen B, Brooks R, Qiu K, Lim J, Fan J. Analytical Equivalent Circuit Modeling for BGA in High-Speed Package Ieee Transactions On Electromagnetic Compatibility. 60: 68-76. DOI: 10.1109/Temc.2017.2726560 |
0.377 |
|
2018 |
Chu X, Hwang C, Fan J, Li Y. Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve Ieee Transactions On Electromagnetic Compatibility. 60: 468-477. DOI: 10.1109/Temc.2017.2725270 |
0.377 |
|
2018 |
Xiao Y, Qi Y, Li F, Fan J, Yu W, Lu L. Dual-Band Directional Slot Antenna for Wi-Fi Application Ieee Transactions On Antennas and Propagation. 66: 4277-4281. DOI: 10.1109/Tap.2018.2840843 |
0.304 |
|
2018 |
Chen Y, Deng H, Chen B, Zai R, Hsu J, Ye X, Fan J, Drewniak J. Signal-signal D-probe and unified launch pad designs Ieee Electromagnetic Compatibility Magazine. 7: 101-106. DOI: 10.1109/Memc.2018.8479348 |
0.733 |
|
2018 |
Cai Z, Qi Y, Weng Z, Yu W, Li F, Fan J. DC ground compact wideband omnidirectional vertically polarised slot loop antenna for 4G long-term evolution applications Iet Microwaves Antennas & Propagation. 12: 1087-1092. DOI: 10.1049/Iet-Map.2017.0712 |
0.31 |
|
2017 |
Yan Z, Wang J, Zhang W, Wang Y, Fan J. A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement Ieee Transactions On Instrumentation and Measurement. 66: 2762-2770. DOI: 10.1109/Tim.2017.2681282 |
0.327 |
|
2017 |
Paulis Fd, Piersanti S, Wang Q, Cho J, Erickson N, Achkir B, Fan J, Drewniak J, Orlandi A. TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization Ieee Transactions On Instrumentation and Measurement. 66: 792-801. DOI: 10.1109/Tim.2017.2654068 |
0.624 |
|
2017 |
Qi Y, Wu J, Zhang Z, Liu L, Yu W, Orlandi A, Fan J, Yang Z. Notice of Retraction: Objective Total Isotropic Sensitivity Measurement Ieee Transactions On Electromagnetic Compatibility. 59: 1671-1676. DOI: 10.1109/Temc.2017.2707641 |
0.332 |
|
2017 |
Hwang C, Pommerenke D, Fan J, Enomoto T, Maeshima J, Araki K. Modeling and Estimation of LCD Noise Modulation for Radio Frequency Interference Ieee Transactions On Electromagnetic Compatibility. 59: 1685-1692. DOI: 10.1109/Temc.2017.2705178 |
0.331 |
|
2017 |
Wang Q, Cho J, Erickson N, Hwang C, Paulis FD, Piersanti S, Orlandi A, Achkir B, Fan J. Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer Ieee Transactions On Electromagnetic Compatibility. 59: 1565-1575. DOI: 10.1109/Temc.2017.2696563 |
0.335 |
|
2017 |
Wang Y, Jin S, Penugonda S, Chen J, Fan J. Variability Analysis of Crosstalk Among Differential Vias Using Polynomial-Chaos and Response Surface Methods Ieee Transactions On Electromagnetic Compatibility. 59: 1368-1378. DOI: 10.1109/Temc.2017.2682169 |
0.306 |
|
2017 |
Jin S, Chen B, Fang X, Gao H, Ye X, Fan J. Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 59: 1356-1367. DOI: 10.1109/Temc.2017.2679543 |
0.726 |
|
2017 |
Cao YS, Wang Y, Jiang L, Ruehli AE, Fan J, Drewniak JL. Quantifying EMI: A Methodology for Determining and Quantifying Radiation for Practical Design Guidelines Ieee Transactions On Electromagnetic Compatibility. 59: 1424-1432. DOI: 10.1109/Temc.2017.2677199 |
0.576 |
|
2017 |
Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. 59: 1993-2001. DOI: 10.1109/Temc.2017.2673851 |
0.662 |
|
2017 |
Cao YS, Makharashvili T, Cho J, Bai S, Connor S, Archambeault B, Jiang L, Ruehli AE, Fan J, Drewniak JL. Inductance Extraction for PCB Prelayout Power Integrity Using PMSR Method Ieee Transactions On Electromagnetic Compatibility. 59: 1339-1346. DOI: 10.1109/Temc.2017.2672726 |
0.657 |
|
2017 |
Bi Y, Qi Y, Fan J, Yu W. Notice of Retraction: A Planar Low-Profile Meander Antenna (PLMA) Design for Wireless Terminal Achieving Between Intrasystem EMC and Isolation in Multiantenna Systems Ieee Transactions On Electromagnetic Compatibility. 59: 980-987. DOI: 10.1109/Temc.2016.2634581 |
0.315 |
|
2017 |
Zhang D, Wen Y, Wang Y, Liu D, He X, Fan J. Coupling Analysis for Wires in a Cable Tray Using Circuit Extraction Based on Mixed-Potential Integral Equation Formulation Ieee Transactions On Electromagnetic Compatibility. 59: 862-872. DOI: 10.1109/Temc.2016.2626310 |
0.371 |
|
2017 |
Ye L, Li C, Sun X, Jin S, Chen B, Ye X, Fan J. Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards Ieee Transactions On Electromagnetic Compatibility. 59: 779-788. DOI: 10.1109/Temc.2016.2623813 |
0.694 |
|
2017 |
Piersanti S, Pellegrino E, Paulis Fd, Orlandi A, Jung DH, Kim D, Kim J, Fan J. Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis Ieee Transactions On Electromagnetic Compatibility. 59: 1329-1338. DOI: 10.1109/Temc.2016.2621259 |
0.318 |
|
2017 |
Liu D, Wang Y, Kautz RW, Altunyurt N, Chandra S, Fan J. Accurate Evaluation of Field Interactions Between Cable Harness and Vehicle Body by a Multiple Scattering Method Ieee Transactions On Electromagnetic Compatibility. 59: 383-393. DOI: 10.1109/Temc.2016.2611006 |
0.323 |
|
2017 |
Zhang Y, Zhao Z, Chen K, Fan J. Load characteristics of wireless power transfer system with different resonant types and resonator numbers Aip Advances. 7: 56601. DOI: 10.1063/1.4972851 |
0.307 |
|
2016 |
Wei L, Li L, Shringarpure K, Ruehli AE, Wheeler E, Fan J, Archambeault B, Drewniak JL. Plane-Pair PEEC Model for Power Distribution Networks With Sub-Meshing Techniques Ieee Transactions On Microwave Theory and Techniques. DOI: 10.1109/Tmtt.2016.2518164 |
0.628 |
|
2016 |
Liu Z, Qi Y, Li F, Yu W, Fan J, Chen J. Fast Band-Sweep Total Isotropic Sensitivity Measurement Ieee Transactions On Electromagnetic Compatibility. 58: 1244-1251. DOI: 10.1109/Temc.2016.2579651 |
0.32 |
|
2016 |
Li J, Fan J. Radiation Physics and Design Guidelines of High-Speed Connectors Ieee Transactions On Electromagnetic Compatibility. 58: 1331-1338. DOI: 10.1109/Temc.2016.2575020 |
0.318 |
|
2016 |
Li L, Pan J, Hwang C, Fan J. Radiation noise source modeling and application in near-field coupling estimation Ieee Transactions On Electromagnetic Compatibility. 58: 1314-1321. DOI: 10.1109/Temc.2016.2573160 |
0.366 |
|
2016 |
Shen P, Qi Y, Yu W, Li F, Fan J. Fast method for OTA performance testing of transmit-receive cofrequency mobile terminal Ieee Transactions On Electromagnetic Compatibility. 58: 1367-1374. DOI: 10.1109/Temc.2016.2572092 |
0.335 |
|
2016 |
Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2535459 |
0.652 |
|
2016 |
Shen P, Qi Y, Yu W, Li F, Fan J. Fast and Accurate TIS Testing Method for Wireless User Equipment With RSS Reporting Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2524028 |
0.324 |
|
2016 |
Yan Z, Wang J, Zhang W, Wang Y, Fan J. A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements Ieee Transactions On Antennas and Propagation. 64: 5459-5465. DOI: 10.1109/Tap.2016.2606556 |
0.302 |
|
2016 |
Hwang C, Achkir B, Fan J. Capacitance-enhanced through-silicon via for power distribution networks in 3D ICs Ieee Electron Device Letters. 37: 478-481. DOI: 10.1109/Led.2016.2535123 |
0.351 |
|
2016 |
Huang J, Lan X, Zhu W, Cheng B, Fan J, Zhou Z, Xiao H. Interferogram Reconstruction of Cascaded Coaxial Cable Fabry-Perot Interferometers for Distributed Sensing Application Ieee Sensors Journal. 16: 4495-4500. DOI: 10.1109/Jsen.2016.2530839 |
0.333 |
|
2015 |
Sheng Z, Fan J, Liu CH, Leung VCM, Liu X, Leung KK. Energy-efficient relay selection for cooperative relaying in wireless multimedia networks Ieee Transactions On Vehicular Technology. 64: 1156-1170. DOI: 10.1109/Tvt.2014.2322653 |
0.301 |
|
2015 |
Pan J, Wang H, Gao X, Hwang C, Song E, Park HB, Fan J. Radio-Frequency Interference Estimation Using Equivalent Dipole-Moment Models and Decomposition Method Based on Reciprocity Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2496210 |
0.369 |
|
2015 |
Piersanti S, De Paulis F, Orlandi A, Kim DH, Kim J, Fan J. Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2478849 |
0.318 |
|
2015 |
Chada A, Mutnury B, Fan J, Drewniak JL. Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476700 |
0.621 |
|
2015 |
Chada A, Mutnury B, Fan J, Drewniak JL. Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476696 |
0.622 |
|
2015 |
Dikhaminjia N, Rogava J, Tsiklauri M, Zvonkin M, Fan J, Drewniak JL. Fast Approximation of Sine and Cosine Hyperbolic Functions for the Calculation of the Transmission Matrix of a Multiconductor Transmission Line Ieee Transactions On Electromagnetic Compatibility. 57: 1698-1704. DOI: 10.1109/Temc.2015.2470176 |
0.554 |
|
2015 |
Ren L, Shao P, Qiu K, Lim J, Brooks R, Tian X, Zhang Y, Fan J. A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2453406 |
0.31 |
|
2015 |
Li J, Li X, Toor S, Fan H, Bhobe AU, Fan J, Drewniak JL. EMI Coupling Paths and Mitigation in a Board-to-Board Connector Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2439687 |
0.596 |
|
2015 |
Ren L, Fan J. Modeling Electromagnetic Field Coupling Through Apertures for Radio-Frequency Interference Applications Ieee Transactions On Electromagnetic Compatibility. 57: 1037-1048. DOI: 10.1109/Temc.2015.2424248 |
0.362 |
|
2015 |
Piersanti S, Paulis Fd, Orlandi A, Fan J. Impact of Frequency-Dependent and Nonlinear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit Ieee Transactions On Electromagnetic Compatibility. 57: 538-545. DOI: 10.1109/Temc.2015.2391911 |
0.308 |
|
2015 |
Jing S, Zhang Y, Li J, Liu D, Koledintseva MY, Pommerenke DJ, Fan J, Drewniak JL. Extraction of Permittivity and Permeability for Ferrites and Flexible Magnetodielectric Materials Using a Genetic Algorithm Ieee Transactions On Electromagnetic Compatibility. 57: 349-356. DOI: 10.1109/Temc.2015.2389332 |
0.58 |
|
2015 |
Yoon C, Tsiklauri M, Zvonkin M, Chen QB, Razmadze A, Aflaki A, Kim J, Fan J, Drewniak JL. Design Criteria and Error Sensitivity of Time-Domain Channel Characterization (TCC) for Asymmetry Fixture De-Embedding Ieee Transactions On Electromagnetic Compatibility. 57: 836-846. DOI: 10.1109/Temc.2014.2379627 |
0.612 |
|
2015 |
Tian X, Zhang YJ, Liu D, Gui L, Li Q, Fan J. Efficient analysis of power/ground planes loaded with dielectric rods and decoupling capacitors by extended generalized multiple scattering method Ieee Transactions On Electromagnetic Compatibility. 57: 135-144. DOI: 10.1109/Temc.2014.2364269 |
0.37 |
|
2015 |
Pan S, Fan J. An Efficient Method to Extract Surface-Wave Poles of Green's Functions Near Branch Cut in Lossy Layered Media Ieee Transactions On Antennas and Propagation. 63: 439-442. DOI: 10.1109/Tap.2014.2367545 |
0.304 |
|
2015 |
Kim H, Kim S, Kim J, Yoon C, Kim J, Achkir B, Fan J. On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer Ieee Electromagnetic Compatibility Magazine. 4: 108-113. DOI: 10.1109/Emcsi.2015.7107653 |
0.353 |
|
2015 |
Cecchetti R, Piersanti S, Paulis Fd, Orlandi A, Fan J. Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array Electronics Letters. 51: 1025-1027. DOI: 10.1049/El.2015.1265 |
0.368 |
|
2014 |
Huang J, Wei T, Wang T, Fan J, Xiao H. Control of critical coupling in a coiled coaxial cable resonator. The Review of Scientific Instruments. 85: 054701. PMID 24880389 DOI: 10.1063/1.4873325 |
0.316 |
|
2014 |
Huang J, Wei T, Fan J, Xiao H. Coaxial cable Bragg grating assisted microwave coupler. The Review of Scientific Instruments. 85: 014703. PMID 24517794 DOI: 10.1063/1.4856695 |
0.322 |
|
2014 |
Li G, Itou K, Katou Y, Mukai N, Pommerenke D, Fan J. A resonant E-field probe for RFI measurements Ieee Transactions On Electromagnetic Compatibility. 56: 1719-1722. DOI: 10.1109/Temc.2014.2354018 |
0.365 |
|
2014 |
Lin F, Qi Y, Fan J, Jiao Y. 0.7–20-GHz Dual-Polarized Bilateral Tapered Slot Antenna for EMC Measurements Ieee Transactions On Electromagnetic Compatibility. 56: 1271-1275. DOI: 10.1109/Temc.2014.2330291 |
0.303 |
|
2014 |
Gao X, Fan J, Zhang Y, Kajbaf H, Pommerenke D. Far-field prediction using only magnetic near-field scanning for EMI test Ieee Transactions On Electromagnetic Compatibility. 56: 1335-1343. DOI: 10.1109/Temc.2014.2322081 |
0.302 |
|
2014 |
Yu W, Qi Y, Liu K, Xu Y, Fan J. Radiated Two-Stage Method for LTE MIMO User Equipment Performance Evaluation Ieee Transactions On Electromagnetic Compatibility. 56: 1691-1696. DOI: 10.1109/Temc.2014.2320779 |
0.304 |
|
2014 |
Ren L, Li T, Chandra S, Chen X, Bishnoi H, Sun S, Boyle P, Zamek I, Fan J, Beetner DG, Drewniak JL. Prediction of power supply noise from switching activity in an FPGA Ieee Transactions On Electromagnetic Compatibility. 56: 699-706. DOI: 10.1109/Temc.2013.2293872 |
0.634 |
|
2014 |
Kim J, Lee J, Cho S, Hwang C, Yoon C, Fan J. Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer With Arbitrary Power-Supply Voltage Fluctuations Ieee Transactions On Circuits and Systems. 61: 2022-2033. DOI: 10.1109/Tcsi.2013.2295933 |
0.367 |
|
2013 |
Wang H, Fan J. Modeling Local Via Structures Using Innovative PEEC Formulation Based on Cavity Green's Functions With Wave Port Excitation Ieee Transactions On Microwave Theory and Techniques. 61: 1748-1757. DOI: 10.1109/Tmtt.2013.2253791 |
0.326 |
|
2013 |
Wu S, Fan J. Modeling of Crosstalk Between Two Nonparallel Striplines on Adjacent Layers Ieee Transactions On Electromagnetic Compatibility. 55: 1302-1310. DOI: 10.1109/Temc.2013.2265275 |
0.302 |
|
2013 |
Wang H, Khilkevich V, Zhang Y, Fan J. Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity Ieee Transactions On Electromagnetic Compatibility. 55: 1125-1131. DOI: 10.1109/Temc.2013.2248090 |
0.356 |
|
2013 |
Chuang H, Li G, Song E, Park H, Jang H, Park H, Zhang Y, Pommerenke D, Wu T, Fan J. A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications Ieee Transactions On Electromagnetic Compatibility. 55: 991-998. DOI: 10.1109/Temc.2013.2248011 |
0.361 |
|
2013 |
Wang H, Pan S, Kim J, Ruehli AE, Fan J. Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 2134-2146. DOI: 10.1109/Tcpmt.2013.2272323 |
0.338 |
|
2013 |
Kim J, Takita Y, Araki K, Fan J. Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1554-1563. DOI: 10.1109/Tcpmt.2012.2232353 |
0.366 |
|
2013 |
Hwang C, Kim J, Achkir B, Fan J. Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 113-125. DOI: 10.1109/Tcpmt.2012.2226723 |
0.306 |
|
2013 |
Yao W, Pan S, Achkir B, Fan J, He L. Modeling and Application of Multi-Port TSV Networks in 3-D IC Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 32: 487-496. DOI: 10.1109/Tcad.2012.2228740 |
0.363 |
|
2012 |
Hu Y, Zhang YJ, Fan J. Equivalent Circuit Model Of Coaxial Probes For Patch Antennas Progress in Electromagnetics Research B. 38: 281-296. DOI: 10.2528/Pierb11121210 |
0.376 |
|
2012 |
Zhang Y, Fan J. A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair Ieee Transactions On Microwave Theory and Techniques. 60: 2035-2045. DOI: 10.1109/Tmtt.2012.2195195 |
0.325 |
|
2012 |
Kim J, Li L, Wu S, Wang H, Takita Y, Takeuchi H, Araki K, Fan J, Drewniak JL. Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network Ieee Transactions On Electromagnetic Compatibility. 54: 1112-1124. DOI: 10.1109/Temc.2012.2194786 |
0.595 |
|
2012 |
Müller S, Duan X, Kotzev M, Zhang YJ, Fan J, Gu X, Kwark YH, Rimolo-Donadio R, Brüns HD, Schuster C. Accuracy of physics-based via models for simulation of dense via arrays Ieee Transactions On Electromagnetic Compatibility. 54: 1125-1136. DOI: 10.1109/Temc.2012.2192123 |
0.328 |
|
2012 |
Pan S, Fan J. Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model Ieee Transactions On Electromagnetic Compatibility. 54: 1077-1086. DOI: 10.1109/Temc.2012.2187664 |
0.379 |
|
2012 |
Wu S, Fan J. Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards Ieee Transactions On Electromagnetic Compatibility. 54: 413-420. DOI: 10.1109/Temc.2011.2179658 |
0.352 |
|
2012 |
Zhang Y, Chada AR, Fan J. An Improved Multiple Scattering Method for Via Structures With Axially Isotropic Modes in an Irregular Plate Pair Ieee Transactions On Electromagnetic Compatibility. 54: 457-465. DOI: 10.1109/Temc.2011.2162524 |
0.314 |
|
2011 |
Kim J, Fan J, Ruehli AE, Kim J, Drewniak JL. Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Ieee Transactions On Microwave Theory and Techniques. 59: 1909-1924. DOI: 10.1109/Tmtt.2011.2156807 |
0.625 |
|
2011 |
Feng G, Fan J. An Extended Cavity Method to Analyze Slot Coupling Between Printed Circuit Board Cavities Ieee Transactions On Electromagnetic Compatibility. 53: 140-149. DOI: 10.1109/Temc.2010.2049021 |
0.369 |
|
2011 |
Kim J, Shringarpure K, Fan J, Kim J, Drewniak JL. Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Ieee Microwave and Wireless Components Letters. 21: 62-64. DOI: 10.1109/Lmwc.2010.2100079 |
0.654 |
|
2010 |
Wu T, Fan J, Paulis Fd, Wang C, Scogna AC, Orlandi A. Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology Ieice Transactions On Communications. 93: 1678-1689. DOI: 10.1587/Transcom.E93.B.1678 |
0.394 |
|
2010 |
Zhang Y, Feng G, Fan J. A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model Ieee Transactions On Microwave Theory and Techniques. 58: 3780-3789. DOI: 10.1109/Tmtt.2010.2083870 |
0.327 |
|
2010 |
Kim J, Ren L, Fan J. Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design Ieee Transactions On Microwave Theory and Techniques. 58: 2434-2447. DOI: 10.1109/Tmtt.2010.2058278 |
0.38 |
|
2010 |
Zhang Y, Fan J. An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis Ieee Transactions On Microwave Theory and Techniques. 58: 2251-2265. DOI: 10.1109/Tmtt.2010.2052956 |
0.325 |
|
2010 |
Paulis Fd, Zhang Y, Fan J. Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters Ieee Transactions On Electromagnetic Compatibility. 52: 1008-1018. DOI: 10.1109/Temc.2010.2072784 |
0.406 |
|
2010 |
Feng G, Fan J. Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model Ieee Transactions On Electromagnetic Compatibility. 52: 699-711. DOI: 10.1109/Temc.2010.2046665 |
0.377 |
|
2010 |
Fan J, Ye X, Kim J, Archambeault B, Orlandi A. Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions Ieee Transactions On Electromagnetic Compatibility. 52: 392-400. DOI: 10.1109/Temc.2010.2045381 |
0.721 |
|
2010 |
Zhang Y, Oo ZZ, Wei X, Liu E, Fan J, Li E. Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors Ieee Transactions On Electromagnetic Compatibility. 52: 401-409. DOI: 10.1109/Temc.2010.2040389 |
0.377 |
|
2009 |
Rimolo-Donadio R, Gu X, Kwark YH, Ritter MB, Archambeault B, Paulis Fd, Zhang Y, Fan J, Bruns H-, Schuster C. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz Ieee Transactions On Microwave Theory and Techniques. 57: 2072-2083. DOI: 10.1109/Tmtt.2009.2025470 |
0.377 |
|
2009 |
Zhang Y, Rimolo-Donadio R, Fan J, Schuster C, Li E. Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method Ieee Microwave and Wireless Components Letters. 19: 275-277. DOI: 10.1109/Lmwc.2009.2017587 |
0.324 |
|
2008 |
Zhang Y, Fan J, Selli G, Cocchini M, Paulis Fd. Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages Ieee Transactions On Microwave Theory and Techniques. 56: 2118-2128. DOI: 10.1109/Tmtt.2008.2002237 |
0.315 |
|
2006 |
Wang C, Mao J, Selli G, Luan S, Zhang L, Fan J, Pommerenke DJ, DuBroff RE, Drewniak JL. An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances Ieee Transactions On Advanced Packaging. 29: 320-334. DOI: 10.1109/Tadvp.2006.871202 |
0.641 |
|
2003 |
Cui W, Fan J, Ren Y, Shi H, Drewniak JL, DuBroff RE. DC power-bus noise isolation with power-plane segmentation Ieee Transactions On Electromagnetic Compatibility. 45: 436-443. DOI: 10.1109/Temc.2003.811296 |
0.608 |
|
2003 |
Fan J, Drewniak JL, Knighten JL. Lumped-circuit model extraction for vias in multilayer substrates Ieee Transactions On Electromagnetic Compatibility. 45: 272-280. DOI: 10.1109/Temc.2003.810808 |
0.659 |
|
2001 |
Fan J, Drewniak JL, Knighten JL, Smith NW, Orlandi A, Van Doren TP, Hubing TH, DuBroff RE. Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 43: 588-599. DOI: 10.1109/15.974639 |
0.654 |
|
2001 |
Fan J, Drewniak JL, Shi H, Knighten JL. DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction Ieee Transactions On Electromagnetic Compatibility. 43: 426-436. DOI: 10.1109/15.974622 |
0.654 |
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