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Jun Fan, Ph.D. - Publications

Affiliations: 
2000 University of Missouri-Rolla, Rolla, MO, United States 
Area:
Electronics and Electrical Engineering
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132 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Sun J, Cho J, Huang A, Kim H, Fan J. Accurate Rectifier Characterization and Improved Modeling of Constant Power Load Wireless Power Transfer Systems Ieee Transactions On Power Electronics. 35: 7840-7852. DOI: 10.1109/Tpel.2019.2961359  0.395
2020 Zheng Y, Weng Z, Qi Y, Fan J, Li F, Yang Z, Drewniak JL. Calibration Loop Antenna for Multiple Probe Antenna Measurement System Ieee Transactions On Instrumentation and Measurement. 69: 5745-5754. DOI: 10.1109/Tim.2019.2963507  0.588
2020 Li J, Qi Y, Yu W, Li F, Fan J, Yang Z, Wu S, Drewniak JL. Total Isotropic Sensitivity Measurement in Switched Beam Antenna Systems Ieee Transactions On Instrumentation and Measurement. 69: 5458-5467. DOI: 10.1109/Tim.2019.2958472  0.575
2020 Cai Z, Zhou Y, Liu L, Qi Y, Yu W, Fan J, Yu M, Luo Q. Small Anechoic Chamber Design Method for On-Line and On-Site Passive Intermodulation Measurement Ieee Transactions On Instrumentation and Measurement. 69: 3377-3387. DOI: 10.1109/Tim.2019.2937425  0.338
2020 Rezaei H, Meiguni JS, Sorensen M, Jobava RG, Khilkevich V, Fan J, Beetner DG, Pommerenke D. Source Reconstruction in Near-Field Scanning Using Inverse MoM for RFI Application Ieee Transactions On Electromagnetic Compatibility. 62: 1628-1636. DOI: 10.1109/Temc.2020.3006031  0.305
2020 Pu B, Fan J, Nah W. Immunity Enhancement of the Power Distribution Network in Integrated Circuits With Coplanar Meander Lines in Package Ieee Transactions On Electromagnetic Compatibility. 1-9. DOI: 10.1109/Temc.2019.2962096  0.338
2020 Wang Y, Cao YS, Liu D, Kautz RW, Altunyurt N, Fan J. Evaluating the Crosstalk Current and the Total Radiated Power of a Bent Cable Harness Using the Generalized MTL Method Ieee Transactions On Electromagnetic Compatibility. 62: 1256-1265. DOI: 10.1109/Temc.2019.2927222  0.345
2020 Kim H, Cho J, Yoon C, Achkir B, Drewniak J, Fan J. Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer Ieee Transactions On Electromagnetic Compatibility. 62: 880-893. DOI: 10.1109/Temc.2019.2921008  0.627
2020 Yong S, Khilkevich V, Cai X, Sui C, Sen B, Fan J. Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines With Lossy Conductor and Dielectric Ieee Transactions On Electromagnetic Compatibility. 62: 510-520. DOI: 10.1109/Temc.2019.2902070  0.343
2020 Ye L, Sun X, Huang T, Sun Y, Jin S, Chen B, Fan J. Modeling Stripline With Slotted Ground Plane in Multilayered Circuit Board Using PEEC Formulation Ieee Transactions On Electromagnetic Compatibility. 62: 280-284. DOI: 10.1109/Temc.2018.2889701  0.38
2020 Fan J. Signal integrity and power integrity Ieee Electromagnetic Compatibility Magazine. 9: 60-60. DOI: 10.1109/Memc.2020.9133245  0.31
2020 Chi L, Weng Z, Meng S, Qi Y, Fan J, Zhuang W, Drewniak JL. Rugged Linear Array for IoT Applications Ieee Internet of Things Journal. 7: 5078-5087. DOI: 10.1109/Jiot.2020.2976857  0.587
2019 Kim D, Kim H, Huang A, He Q, Zhang H, Ahn S, Zhu Y, Fan J. Analysis and Introduction of Effective Permeability with Additional Air-Gaps on Wireless Power Transfer Coils for Electric Vehicle Based on SAE J2954 Recommended Practice Energies. 12: 4797. DOI: 10.3390/En12244797  0.336
2019 Shu Y, Wei X, Fan J, Yang R, Yang Y. An Equivalent Dipole Model Hybrid With Artificial Neural Network for Electromagnetic Interference Prediction Ieee Transactions On Microwave Theory and Techniques. 67: 1790-1797. DOI: 10.1109/Tmtt.2019.2905238  0.366
2019 Wang J, Yan Z, Liu W, Su D, Yan X, Fan J. A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun Ieee Transactions On Instrumentation and Measurement. 68: 3042-3044. DOI: 10.1109/Tim.2019.2920700  0.353
2019 Wang J, Yan Z, Liu W, Yan X, Fan J. Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure Ieee Transactions On Instrumentation and Measurement. 68: 882-894. DOI: 10.1109/Tim.2018.2857898  0.319
2019 Wu C, Kim H, He J, Erickson N, Cho S, Kim D, Hur Y, Pommerenke DJ, Fan J. Analysis and Modeling of Conducted EMI from an AC–DC Power Supply in LED TV up to 1 MHz Ieee Transactions On Electromagnetic Compatibility. 61: 2050-2059. DOI: 10.1109/Temc.2019.2954360  0.362
2019 Chen B, Pan S, Wang J, Yong S, Ouyang M, Fan J. Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance Ieee Transactions On Electromagnetic Compatibility. 61: 1385-1394. DOI: 10.1109/Temc.2019.2925757  0.343
2019 Huang Q, Enomoto T, Seto S, Araki K, Fan J, Hwang C. A Transfer Function Based Calculation Method for Radio Frequency Interference Ieee Transactions On Electromagnetic Compatibility. 61: 1280-1288. DOI: 10.1109/Temc.2019.2912361  0.342
2019 Chen B, He J, Guo Y, Pan S, Ye X, Fan J. Multi-Ports ( [$2^{n}$ ) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization Ieee Transactions On Electromagnetic Compatibility. 61: 1261-1270. DOI: 10.1109/Temc.2019.2908782  0.698
2019 Yang H, Zhu L, Gao F, Fan J, Wen H. Measurement and Analysis of Passive Intermodulation Induced by Additional Impedance in Loose Contact Coaxial Connector Ieee Transactions On Electromagnetic Compatibility. 61: 1876-1883. DOI: 10.1109/Temc.2019.2892458  0.311
2019 Pan J, Gao X, Fan J. Identifying Interference From Multiple Noise Sources by Magnetic Near Fields Only Ieee Transactions On Electromagnetic Compatibility. 61: 1560-1567. DOI: 10.1109/Temc.2018.2871043  0.31
2019 Sun X, Huang T, Ye L, Sun Y, Jin S, Fan J. Analyzing Multiple Vias in a Parallel-Plate Pair Based on a Nonorthogonal PEEC Method Ieee Transactions On Electromagnetic Compatibility. 61: 1602-1611. DOI: 10.1109/Temc.2018.2870645  0.331
2019 Chen X, He Y, Yang S, Huang A, Zhang Y, Pommerenke DJ, Fan J. Coplanar Intermodulation Reference Generator using Substrate Integrated Waveguide with Integrated Artificial Nonlinear Dipole Ieee Transactions On Electromagnetic Compatibility. 61: 969-972. DOI: 10.1109/Temc.2018.2849965  0.316
2019 Wang Y, Cao YS, Liu D, Kautz RW, Altunyurt N, Fan J. A Generalized Multiple-Scattering Method for Modeling a Cable Harness With Ground Connections to a Nearby Metal Surface Ieee Transactions On Electromagnetic Compatibility. 61: 261-270. DOI: 10.1109/Temc.2018.2806320  0.327
2019 Liu W, Yan Z, Wang J, Yan X, Fan J. An Ultrawideband Electric Probe Based on U-Shaped Structure for Near-Field Measurement From 9 kHz to 40 GHz Ieee Antennas and Wireless Propagation Letters. 18: 1283-1287. DOI: 10.1109/Lawp.2019.2915258  0.351
2019 Shen P, Qi Y, Yu W, Fan J, Li F. OTA Measurement for IoT Wireless Device Performance Evaluation: Challenges and Solutions Ieee Internet of Things Journal. 6: 1223-1237. DOI: 10.1109/Jiot.2018.2868787  0.32
2018 Shen P, Qi Y, Yu W, Fan J, Yang Z, Wu S. A Decomposition Method for MIMO OTA Performance Evaluation Ieee Transactions On Vehicular Technology. 67: 8184-8191. DOI: 10.1109/Tvt.2018.2839726  0.355
2018 Yan Z, Liu W, Wang J, Su D, Yan X, Fan J. Noncontact Wideband Current Probes With High Sensitivity and Spatial Resolution for Noise Location on PCB Ieee Transactions On Instrumentation and Measurement. 67: 2881-2891. DOI: 10.1109/Tim.2018.2830859  0.347
2018 Li J, Qi Y, Yu W, Li F, Fan J, Orlandi A, Yang Z, Wu S. Notice of Retraction: Objective MIMO Measurement Ieee Transactions On Electromagnetic Compatibility. 60: 1190-1197. DOI: 10.1109/Temc.2018.2804041  0.355
2018 Huang Q, Fan J. Machine Learning Based Source Reconstruction for RF Desense Ieee Transactions On Electromagnetic Compatibility. 60: 1640-1647. DOI: 10.1109/Temc.2018.2797132  0.323
2018 Spadacini G, Fan J. Introduction to the Special Issue for the 2017 IEEE International Symposium on EMC+SIPI Ieee Transactions On Electromagnetic Compatibility. 60: 1036-1037. DOI: 10.1109/Temc.2018.2795358  0.304
2018 Yang H, Wen H, Qi Y, Fan J. An Equivalent Circuit Model to Analyze Passive Intermodulation of Loose Contact Coaxial Connectors Ieee Transactions On Electromagnetic Compatibility. 60: 1180-1189. DOI: 10.1109/Temc.2018.2794992  0.333
2018 Maghlakelidze G, Yan X, Guan L, Marathe S, Huang Q, Bae B, Hwang C, Khilkevich V, Fan J, Pommerenke D. SNR Analysis and Optimization in Near-Field Scanning and EMI Applications Ieee Transactions On Electromagnetic Compatibility. 60: 1087-1094. DOI: 10.1109/Temc.2018.2792778  0.334
2018 Huang Q, Li L, Yan X, Bae B, Park H, Hwang C, Fan J. MoM-Based Ground Current Reconstruction in RFI Application Ieee Transactions On Electromagnetic Compatibility. 60: 1121-1128. DOI: 10.1109/Temc.2018.2791539  0.316
2018 Jin S, Liu D, Wang Y, Chen B, Fan J. Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach Ieee Transactions On Electromagnetic Compatibility. 60: 1481-1490. DOI: 10.1109/Temc.2017.2782713  0.369
2018 Hwang C, Pommerenke D, Fan J, Enomoto T, Maeshima J, Araki K. Wideband Noise Measurement Technique in Duplex Systems for RF Interference Ieee Transactions On Electromagnetic Compatibility. 60: 1038-1044. DOI: 10.1109/Temc.2017.2782673  0.323
2018 Chada A, Mutnury B, Dikhaminjia N, Tsiklauri M, Fan J, Drewniak JL. Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours Using Transient Simulation of Short Bit Patterns Ieee Transactions On Electromagnetic Compatibility. 60: 1520-1528. DOI: 10.1109/Temc.2017.2776080  0.585
2018 Qi Y, Wu J, Gong G, Fan J, Orlandi A, Yu W, Ma J, Drewniak JL. Notice of Retraction: Review of the EMC Aspects of Internet of Things Ieee Transactions On Electromagnetic Compatibility. 60: 1152-1160. DOI: 10.1109/Temc.2017.2775651  0.567
2018 Kim H, Kim J, Fan J, Hwang C. Precise Analytical Model of Power Supply Induced Jitter Transfer Function at Inverter Chains Ieee Transactions On Electromagnetic Compatibility. 60: 1491-1499. DOI: 10.1109/Temc.2017.2764867  0.316
2018 Kim H, Cho J, Achkir B, Fan J. Modeling and Measurement of Ground Bounce Induced by High-Speed Output Buffer With On-Chip Low-Dropout (LDO) Regulator Ieee Transactions On Electromagnetic Compatibility. 60: 1022-1025. DOI: 10.1109/Temc.2017.2759123  0.357
2018 Wang Y, Liu D, Cao YS, Kautz RW, Altunyurt N, Chandra S, Fan J. Evaluating Field Interactions Between Multiple Wires and the Nearby Surface Enabled by a Generalized MTL Approach Ieee Transactions On Electromagnetic Compatibility. 60: 971-980. DOI: 10.1109/Temc.2017.2756899  0.303
2018 Hwang C, Ouyang M, Fan J. Return Path Discontinuity Analysis of an Edge Mount SMA Launch Structure in Multilayer Boards Ieee Transactions On Electromagnetic Compatibility. 60: 453-458. DOI: 10.1109/Temc.2017.2735802  0.367
2018 Jin S, Liu D, Chen B, Brooks R, Qiu K, Lim J, Fan J. Analytical Equivalent Circuit Modeling for BGA in High-Speed Package Ieee Transactions On Electromagnetic Compatibility. 60: 68-76. DOI: 10.1109/Temc.2017.2726560  0.377
2018 Chu X, Hwang C, Fan J, Li Y. Analytic Calculation of Jitter Induced by Power and Ground Noise Based on IBIS I/V Curve Ieee Transactions On Electromagnetic Compatibility. 60: 468-477. DOI: 10.1109/Temc.2017.2725270  0.377
2018 Xiao Y, Qi Y, Li F, Fan J, Yu W, Lu L. Dual-Band Directional Slot Antenna for Wi-Fi Application Ieee Transactions On Antennas and Propagation. 66: 4277-4281. DOI: 10.1109/Tap.2018.2840843  0.304
2018 Chen Y, Deng H, Chen B, Zai R, Hsu J, Ye X, Fan J, Drewniak J. Signal-signal D-probe and unified launch pad designs Ieee Electromagnetic Compatibility Magazine. 7: 101-106. DOI: 10.1109/Memc.2018.8479348  0.733
2018 Cai Z, Qi Y, Weng Z, Yu W, Li F, Fan J. DC ground compact wideband omnidirectional vertically polarised slot loop antenna for 4G long-term evolution applications Iet Microwaves Antennas & Propagation. 12: 1087-1092. DOI: 10.1049/Iet-Map.2017.0712  0.31
2017 Yan Z, Wang J, Zhang W, Wang Y, Fan J. A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement Ieee Transactions On Instrumentation and Measurement. 66: 2762-2770. DOI: 10.1109/Tim.2017.2681282  0.327
2017 Paulis Fd, Piersanti S, Wang Q, Cho J, Erickson N, Achkir B, Fan J, Drewniak J, Orlandi A. TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization Ieee Transactions On Instrumentation and Measurement. 66: 792-801. DOI: 10.1109/Tim.2017.2654068  0.624
2017 Qi Y, Wu J, Zhang Z, Liu L, Yu W, Orlandi A, Fan J, Yang Z. Notice of Retraction: Objective Total Isotropic Sensitivity Measurement Ieee Transactions On Electromagnetic Compatibility. 59: 1671-1676. DOI: 10.1109/Temc.2017.2707641  0.332
2017 Hwang C, Pommerenke D, Fan J, Enomoto T, Maeshima J, Araki K. Modeling and Estimation of LCD Noise Modulation for Radio Frequency Interference Ieee Transactions On Electromagnetic Compatibility. 59: 1685-1692. DOI: 10.1109/Temc.2017.2705178  0.331
2017 Wang Q, Cho J, Erickson N, Hwang C, Paulis FD, Piersanti S, Orlandi A, Achkir B, Fan J. Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer Ieee Transactions On Electromagnetic Compatibility. 59: 1565-1575. DOI: 10.1109/Temc.2017.2696563  0.335
2017 Wang Y, Jin S, Penugonda S, Chen J, Fan J. Variability Analysis of Crosstalk Among Differential Vias Using Polynomial-Chaos and Response Surface Methods Ieee Transactions On Electromagnetic Compatibility. 59: 1368-1378. DOI: 10.1109/Temc.2017.2682169  0.306
2017 Jin S, Chen B, Fang X, Gao H, Ye X, Fan J. Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 59: 1356-1367. DOI: 10.1109/Temc.2017.2679543  0.726
2017 Cao YS, Wang Y, Jiang L, Ruehli AE, Fan J, Drewniak JL. Quantifying EMI: A Methodology for Determining and Quantifying Radiation for Practical Design Guidelines Ieee Transactions On Electromagnetic Compatibility. 59: 1424-1432. DOI: 10.1109/Temc.2017.2677199  0.576
2017 Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. 59: 1993-2001. DOI: 10.1109/Temc.2017.2673851  0.662
2017 Cao YS, Makharashvili T, Cho J, Bai S, Connor S, Archambeault B, Jiang L, Ruehli AE, Fan J, Drewniak JL. Inductance Extraction for PCB Prelayout Power Integrity Using PMSR Method Ieee Transactions On Electromagnetic Compatibility. 59: 1339-1346. DOI: 10.1109/Temc.2017.2672726  0.657
2017 Bi Y, Qi Y, Fan J, Yu W. Notice of Retraction: A Planar Low-Profile Meander Antenna (PLMA) Design for Wireless Terminal Achieving Between Intrasystem EMC and Isolation in Multiantenna Systems Ieee Transactions On Electromagnetic Compatibility. 59: 980-987. DOI: 10.1109/Temc.2016.2634581  0.315
2017 Zhang D, Wen Y, Wang Y, Liu D, He X, Fan J. Coupling Analysis for Wires in a Cable Tray Using Circuit Extraction Based on Mixed-Potential Integral Equation Formulation Ieee Transactions On Electromagnetic Compatibility. 59: 862-872. DOI: 10.1109/Temc.2016.2626310  0.371
2017 Ye L, Li C, Sun X, Jin S, Chen B, Ye X, Fan J. Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards Ieee Transactions On Electromagnetic Compatibility. 59: 779-788. DOI: 10.1109/Temc.2016.2623813  0.694
2017 Piersanti S, Pellegrino E, Paulis Fd, Orlandi A, Jung DH, Kim D, Kim J, Fan J. Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis Ieee Transactions On Electromagnetic Compatibility. 59: 1329-1338. DOI: 10.1109/Temc.2016.2621259  0.318
2017 Liu D, Wang Y, Kautz RW, Altunyurt N, Chandra S, Fan J. Accurate Evaluation of Field Interactions Between Cable Harness and Vehicle Body by a Multiple Scattering Method Ieee Transactions On Electromagnetic Compatibility. 59: 383-393. DOI: 10.1109/Temc.2016.2611006  0.323
2017 Zhang Y, Zhao Z, Chen K, Fan J. Load characteristics of wireless power transfer system with different resonant types and resonator numbers Aip Advances. 7: 56601. DOI: 10.1063/1.4972851  0.307
2016 Wei L, Li L, Shringarpure K, Ruehli AE, Wheeler E, Fan J, Archambeault B, Drewniak JL. Plane-Pair PEEC Model for Power Distribution Networks With Sub-Meshing Techniques Ieee Transactions On Microwave Theory and Techniques. DOI: 10.1109/Tmtt.2016.2518164  0.628
2016 Liu Z, Qi Y, Li F, Yu W, Fan J, Chen J. Fast Band-Sweep Total Isotropic Sensitivity Measurement Ieee Transactions On Electromagnetic Compatibility. 58: 1244-1251. DOI: 10.1109/Temc.2016.2579651  0.32
2016 Li J, Fan J. Radiation Physics and Design Guidelines of High-Speed Connectors Ieee Transactions On Electromagnetic Compatibility. 58: 1331-1338. DOI: 10.1109/Temc.2016.2575020  0.318
2016 Li L, Pan J, Hwang C, Fan J. Radiation noise source modeling and application in near-field coupling estimation Ieee Transactions On Electromagnetic Compatibility. 58: 1314-1321. DOI: 10.1109/Temc.2016.2573160  0.366
2016 Shen P, Qi Y, Yu W, Li F, Fan J. Fast method for OTA performance testing of transmit-receive cofrequency mobile terminal Ieee Transactions On Electromagnetic Compatibility. 58: 1367-1374. DOI: 10.1109/Temc.2016.2572092  0.335
2016 Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2535459  0.652
2016 Shen P, Qi Y, Yu W, Li F, Fan J. Fast and Accurate TIS Testing Method for Wireless User Equipment With RSS Reporting Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2524028  0.324
2016 Yan Z, Wang J, Zhang W, Wang Y, Fan J. A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements Ieee Transactions On Antennas and Propagation. 64: 5459-5465. DOI: 10.1109/Tap.2016.2606556  0.302
2016 Hwang C, Achkir B, Fan J. Capacitance-enhanced through-silicon via for power distribution networks in 3D ICs Ieee Electron Device Letters. 37: 478-481. DOI: 10.1109/Led.2016.2535123  0.351
2016 Huang J, Lan X, Zhu W, Cheng B, Fan J, Zhou Z, Xiao H. Interferogram Reconstruction of Cascaded Coaxial Cable Fabry-Perot Interferometers for Distributed Sensing Application Ieee Sensors Journal. 16: 4495-4500. DOI: 10.1109/Jsen.2016.2530839  0.333
2015 Sheng Z, Fan J, Liu CH, Leung VCM, Liu X, Leung KK. Energy-efficient relay selection for cooperative relaying in wireless multimedia networks Ieee Transactions On Vehicular Technology. 64: 1156-1170. DOI: 10.1109/Tvt.2014.2322653  0.301
2015 Pan J, Wang H, Gao X, Hwang C, Song E, Park HB, Fan J. Radio-Frequency Interference Estimation Using Equivalent Dipole-Moment Models and Decomposition Method Based on Reciprocity Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2496210  0.369
2015 Piersanti S, De Paulis F, Orlandi A, Kim DH, Kim J, Fan J. Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2478849  0.318
2015 Chada A, Mutnury B, Fan J, Drewniak JL. Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476700  0.621
2015 Chada A, Mutnury B, Fan J, Drewniak JL. Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476696  0.622
2015 Dikhaminjia N, Rogava J, Tsiklauri M, Zvonkin M, Fan J, Drewniak JL. Fast Approximation of Sine and Cosine Hyperbolic Functions for the Calculation of the Transmission Matrix of a Multiconductor Transmission Line Ieee Transactions On Electromagnetic Compatibility. 57: 1698-1704. DOI: 10.1109/Temc.2015.2470176  0.554
2015 Ren L, Shao P, Qiu K, Lim J, Brooks R, Tian X, Zhang Y, Fan J. A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2453406  0.31
2015 Li J, Li X, Toor S, Fan H, Bhobe AU, Fan J, Drewniak JL. EMI Coupling Paths and Mitigation in a Board-to-Board Connector Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2439687  0.596
2015 Ren L, Fan J. Modeling Electromagnetic Field Coupling Through Apertures for Radio-Frequency Interference Applications Ieee Transactions On Electromagnetic Compatibility. 57: 1037-1048. DOI: 10.1109/Temc.2015.2424248  0.362
2015 Piersanti S, Paulis Fd, Orlandi A, Fan J. Impact of Frequency-Dependent and Nonlinear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit Ieee Transactions On Electromagnetic Compatibility. 57: 538-545. DOI: 10.1109/Temc.2015.2391911  0.308
2015 Jing S, Zhang Y, Li J, Liu D, Koledintseva MY, Pommerenke DJ, Fan J, Drewniak JL. Extraction of Permittivity and Permeability for Ferrites and Flexible Magnetodielectric Materials Using a Genetic Algorithm Ieee Transactions On Electromagnetic Compatibility. 57: 349-356. DOI: 10.1109/Temc.2015.2389332  0.58
2015 Yoon C, Tsiklauri M, Zvonkin M, Chen QB, Razmadze A, Aflaki A, Kim J, Fan J, Drewniak JL. Design Criteria and Error Sensitivity of Time-Domain Channel Characterization (TCC) for Asymmetry Fixture De-Embedding Ieee Transactions On Electromagnetic Compatibility. 57: 836-846. DOI: 10.1109/Temc.2014.2379627  0.612
2015 Tian X, Zhang YJ, Liu D, Gui L, Li Q, Fan J. Efficient analysis of power/ground planes loaded with dielectric rods and decoupling capacitors by extended generalized multiple scattering method Ieee Transactions On Electromagnetic Compatibility. 57: 135-144. DOI: 10.1109/Temc.2014.2364269  0.37
2015 Pan S, Fan J. An Efficient Method to Extract Surface-Wave Poles of Green's Functions Near Branch Cut in Lossy Layered Media Ieee Transactions On Antennas and Propagation. 63: 439-442. DOI: 10.1109/Tap.2014.2367545  0.304
2015 Kim H, Kim S, Kim J, Yoon C, Kim J, Achkir B, Fan J. On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer Ieee Electromagnetic Compatibility Magazine. 4: 108-113. DOI: 10.1109/Emcsi.2015.7107653  0.353
2015 Cecchetti R, Piersanti S, Paulis Fd, Orlandi A, Fan J. Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array Electronics Letters. 51: 1025-1027. DOI: 10.1049/El.2015.1265  0.368
2014 Huang J, Wei T, Wang T, Fan J, Xiao H. Control of critical coupling in a coiled coaxial cable resonator. The Review of Scientific Instruments. 85: 054701. PMID 24880389 DOI: 10.1063/1.4873325  0.316
2014 Huang J, Wei T, Fan J, Xiao H. Coaxial cable Bragg grating assisted microwave coupler. The Review of Scientific Instruments. 85: 014703. PMID 24517794 DOI: 10.1063/1.4856695  0.322
2014 Li G, Itou K, Katou Y, Mukai N, Pommerenke D, Fan J. A resonant E-field probe for RFI measurements Ieee Transactions On Electromagnetic Compatibility. 56: 1719-1722. DOI: 10.1109/Temc.2014.2354018  0.365
2014 Lin F, Qi Y, Fan J, Jiao Y. 0.7–20-GHz Dual-Polarized Bilateral Tapered Slot Antenna for EMC Measurements Ieee Transactions On Electromagnetic Compatibility. 56: 1271-1275. DOI: 10.1109/Temc.2014.2330291  0.303
2014 Gao X, Fan J, Zhang Y, Kajbaf H, Pommerenke D. Far-field prediction using only magnetic near-field scanning for EMI test Ieee Transactions On Electromagnetic Compatibility. 56: 1335-1343. DOI: 10.1109/Temc.2014.2322081  0.302
2014 Yu W, Qi Y, Liu K, Xu Y, Fan J. Radiated Two-Stage Method for LTE MIMO User Equipment Performance Evaluation Ieee Transactions On Electromagnetic Compatibility. 56: 1691-1696. DOI: 10.1109/Temc.2014.2320779  0.304
2014 Ren L, Li T, Chandra S, Chen X, Bishnoi H, Sun S, Boyle P, Zamek I, Fan J, Beetner DG, Drewniak JL. Prediction of power supply noise from switching activity in an FPGA Ieee Transactions On Electromagnetic Compatibility. 56: 699-706. DOI: 10.1109/Temc.2013.2293872  0.634
2014 Kim J, Lee J, Cho S, Hwang C, Yoon C, Fan J. Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer With Arbitrary Power-Supply Voltage Fluctuations Ieee Transactions On Circuits and Systems. 61: 2022-2033. DOI: 10.1109/Tcsi.2013.2295933  0.367
2013 Wang H, Fan J. Modeling Local Via Structures Using Innovative PEEC Formulation Based on Cavity Green's Functions With Wave Port Excitation Ieee Transactions On Microwave Theory and Techniques. 61: 1748-1757. DOI: 10.1109/Tmtt.2013.2253791  0.326
2013 Wu S, Fan J. Modeling of Crosstalk Between Two Nonparallel Striplines on Adjacent Layers Ieee Transactions On Electromagnetic Compatibility. 55: 1302-1310. DOI: 10.1109/Temc.2013.2265275  0.302
2013 Wang H, Khilkevich V, Zhang Y, Fan J. Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity Ieee Transactions On Electromagnetic Compatibility. 55: 1125-1131. DOI: 10.1109/Temc.2013.2248090  0.356
2013 Chuang H, Li G, Song E, Park H, Jang H, Park H, Zhang Y, Pommerenke D, Wu T, Fan J. A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications Ieee Transactions On Electromagnetic Compatibility. 55: 991-998. DOI: 10.1109/Temc.2013.2248011  0.361
2013 Wang H, Pan S, Kim J, Ruehli AE, Fan J. Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 2134-2146. DOI: 10.1109/Tcpmt.2013.2272323  0.338
2013 Kim J, Takita Y, Araki K, Fan J. Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1554-1563. DOI: 10.1109/Tcpmt.2012.2232353  0.366
2013 Hwang C, Kim J, Achkir B, Fan J. Analytical Transfer Functions Relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 113-125. DOI: 10.1109/Tcpmt.2012.2226723  0.306
2013 Yao W, Pan S, Achkir B, Fan J, He L. Modeling and Application of Multi-Port TSV Networks in 3-D IC Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 32: 487-496. DOI: 10.1109/Tcad.2012.2228740  0.363
2012 Hu Y, Zhang YJ, Fan J. Equivalent Circuit Model Of Coaxial Probes For Patch Antennas Progress in Electromagnetics Research B. 38: 281-296. DOI: 10.2528/Pierb11121210  0.376
2012 Zhang Y, Fan J. A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair Ieee Transactions On Microwave Theory and Techniques. 60: 2035-2045. DOI: 10.1109/Tmtt.2012.2195195  0.325
2012 Kim J, Li L, Wu S, Wang H, Takita Y, Takeuchi H, Araki K, Fan J, Drewniak JL. Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network Ieee Transactions On Electromagnetic Compatibility. 54: 1112-1124. DOI: 10.1109/Temc.2012.2194786  0.595
2012 Müller S, Duan X, Kotzev M, Zhang YJ, Fan J, Gu X, Kwark YH, Rimolo-Donadio R, Brüns HD, Schuster C. Accuracy of physics-based via models for simulation of dense via arrays Ieee Transactions On Electromagnetic Compatibility. 54: 1125-1136. DOI: 10.1109/Temc.2012.2192123  0.328
2012 Pan S, Fan J. Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model Ieee Transactions On Electromagnetic Compatibility. 54: 1077-1086. DOI: 10.1109/Temc.2012.2187664  0.379
2012 Wu S, Fan J. Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards Ieee Transactions On Electromagnetic Compatibility. 54: 413-420. DOI: 10.1109/Temc.2011.2179658  0.352
2012 Zhang Y, Chada AR, Fan J. An Improved Multiple Scattering Method for Via Structures With Axially Isotropic Modes in an Irregular Plate Pair Ieee Transactions On Electromagnetic Compatibility. 54: 457-465. DOI: 10.1109/Temc.2011.2162524  0.314
2011 Kim J, Fan J, Ruehli AE, Kim J, Drewniak JL. Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Ieee Transactions On Microwave Theory and Techniques. 59: 1909-1924. DOI: 10.1109/Tmtt.2011.2156807  0.625
2011 Feng G, Fan J. An Extended Cavity Method to Analyze Slot Coupling Between Printed Circuit Board Cavities Ieee Transactions On Electromagnetic Compatibility. 53: 140-149. DOI: 10.1109/Temc.2010.2049021  0.369
2011 Kim J, Shringarpure K, Fan J, Kim J, Drewniak JL. Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Ieee Microwave and Wireless Components Letters. 21: 62-64. DOI: 10.1109/Lmwc.2010.2100079  0.654
2010 Wu T, Fan J, Paulis Fd, Wang C, Scogna AC, Orlandi A. Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology Ieice Transactions On Communications. 93: 1678-1689. DOI: 10.1587/Transcom.E93.B.1678  0.394
2010 Zhang Y, Feng G, Fan J. A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model Ieee Transactions On Microwave Theory and Techniques. 58: 3780-3789. DOI: 10.1109/Tmtt.2010.2083870  0.327
2010 Kim J, Ren L, Fan J. Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design Ieee Transactions On Microwave Theory and Techniques. 58: 2434-2447. DOI: 10.1109/Tmtt.2010.2058278  0.38
2010 Zhang Y, Fan J. An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis Ieee Transactions On Microwave Theory and Techniques. 58: 2251-2265. DOI: 10.1109/Tmtt.2010.2052956  0.325
2010 Paulis Fd, Zhang Y, Fan J. Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters Ieee Transactions On Electromagnetic Compatibility. 52: 1008-1018. DOI: 10.1109/Temc.2010.2072784  0.406
2010 Feng G, Fan J. Analysis of Simultaneous Switching Noise Coupling in Multilayer Power/Ground Planes With Segmentation Method and Cavity Model Ieee Transactions On Electromagnetic Compatibility. 52: 699-711. DOI: 10.1109/Temc.2010.2046665  0.377
2010 Fan J, Ye X, Kim J, Archambeault B, Orlandi A. Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions Ieee Transactions On Electromagnetic Compatibility. 52: 392-400. DOI: 10.1109/Temc.2010.2045381  0.721
2010 Zhang Y, Oo ZZ, Wei X, Liu E, Fan J, Li E. Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors Ieee Transactions On Electromagnetic Compatibility. 52: 401-409. DOI: 10.1109/Temc.2010.2040389  0.377
2009 Rimolo-Donadio R, Gu X, Kwark YH, Ritter MB, Archambeault B, Paulis Fd, Zhang Y, Fan J, Bruns H-, Schuster C. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz Ieee Transactions On Microwave Theory and Techniques. 57: 2072-2083. DOI: 10.1109/Tmtt.2009.2025470  0.377
2009 Zhang Y, Rimolo-Donadio R, Fan J, Schuster C, Li E. Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method Ieee Microwave and Wireless Components Letters. 19: 275-277. DOI: 10.1109/Lmwc.2009.2017587  0.324
2008 Zhang Y, Fan J, Selli G, Cocchini M, Paulis Fd. Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages Ieee Transactions On Microwave Theory and Techniques. 56: 2118-2128. DOI: 10.1109/Tmtt.2008.2002237  0.315
2006 Wang C, Mao J, Selli G, Luan S, Zhang L, Fan J, Pommerenke DJ, DuBroff RE, Drewniak JL. An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances Ieee Transactions On Advanced Packaging. 29: 320-334. DOI: 10.1109/Tadvp.2006.871202  0.641
2003 Cui W, Fan J, Ren Y, Shi H, Drewniak JL, DuBroff RE. DC power-bus noise isolation with power-plane segmentation Ieee Transactions On Electromagnetic Compatibility. 45: 436-443. DOI: 10.1109/Temc.2003.811296  0.608
2003 Fan J, Drewniak JL, Knighten JL. Lumped-circuit model extraction for vias in multilayer substrates Ieee Transactions On Electromagnetic Compatibility. 45: 272-280. DOI: 10.1109/Temc.2003.810808  0.659
2001 Fan J, Drewniak JL, Knighten JL, Smith NW, Orlandi A, Van Doren TP, Hubing TH, DuBroff RE. Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 43: 588-599. DOI: 10.1109/15.974639  0.654
2001 Fan J, Drewniak JL, Shi H, Knighten JL. DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction Ieee Transactions On Electromagnetic Compatibility. 43: 426-436. DOI: 10.1109/15.974622  0.654
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