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Arkadeep Kumar - Publications

Affiliations: 
2012-2018 Mechanical Engineering Georgia Institute of Technology, The George W. Woodruff School of Mechanical Engineering 
 2018- UC Berkeley/LBNL 
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11 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Bandaru SR, van Genuchten CM, Kumar A, Glade S, Hermandez D, Nahata M, Gadgil A. Rapid and efficient arsenic removal by iron electrocoagulation enabled with in-situ generation of hydrogen peroxide. Environmental Science & Technology. PMID 32315523 DOI: 10.1021/Acs.Est.0C00012  0.413
2020 Melkote SN, Kumar A. A fracture mechanics approach to enhance product and process sustainability in diamond wire sawing of silicon wafers for solar cells through improved wire design International Journal of Sustainable Manufacturing. 4: 186. DOI: 10.1504/Ijsm.2020.10028817  0.527
2019 Tsai S, Kumar A, Kalyan B, Hou C, Chiang P, Gadgil AJ. Additive Manufacturing of Electrodes for Desalination Procedia Manufacturing. 34: 252-259. DOI: 10.1016/J.Promfg.2019.06.147  0.548
2019 Fernandez-Zelaia P, Nguyen V, Zhang H, Kumar A, Melkote SN. The effects of material anisotropy on secondary processing of additively manufactured CoCrMo Additive Manufacturing. 29: 100764. DOI: 10.1016/J.Addma.2019.06.015  0.542
2018 Kumar A, Melkote SN. Wear of diamond in scribing of multi-crystalline silicon Journal of Applied Physics. 124: 065101. DOI: 10.1063/1.5037106  0.544
2018 Kumar A, Melkote SN. Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing Procedia Manufacturing. 21: 549-566. DOI: 10.1016/J.Promfg.2018.02.156  0.583
2017 Kumar A, Melkote SN, Kaminski S, Arcona C. Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon Journal of the American Ceramic Society. 100: 1350-1359. DOI: 10.1111/Jace.14732  0.55
2017 Kumar A, Melkote SN. The chemo-mechanical effect of cutting fluid on material removal in diamond scribing of silicon Applied Physics Letters. 111: 011901. DOI: 10.1063/1.4991536  0.569
2016 Kumar A, Kaminski S, Melkote SN, Arcona C. Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers Wear. 364: 163-168. DOI: 10.1016/J.Wear.2016.07.009  0.55
2016 Kumar A, Prasath R, Pogue V, Skenes K, Yang C, Melkote SN, Danyluk S. Effect of Growth Rate and Wafering on Residual Stress of Diamond Wire Sawn Silicon Wafers Procedia Manufacturing. 5: 1382-1393. DOI: 10.1016/J.Promfg.2016.08.108  0.523
2016 Kumar A, Kovalchenko A, Pogue V, Pashchenko E, Melkote SN. Ductile Mode Behavior of Silicon during Scribing by Spherical Abrasive Particles Procedia Cirp. 45: 147-150. DOI: 10.1016/J.Procir.2016.02.341  0.558
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