Yuhai Mei
Affiliations: | 2000 | University of Michigan, Ann Arbor, Ann Arbor, MI |
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"Yuhai Mei"Mean distance: 11.02 | S | N | B | C | P |
Parents
Sign in to add mentor| Albert F. Yee | grad student | 2000 | University of Michigan | |
| (Stress evolution in a conductive adhesive during curing and cooling.) | ||||
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Publications
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| Wang X, Mei Y, Li W, et al. (2016) Influence of Sub-Daily Variation on Multi-Fractal Detrended Fluctuation Analysis of Wind Speed Time Series. Plos One. 11: e0146284 |
| Yang CX, Li X, Kong YF, et al. (2016) High power COB LED modules attached by nanosilver paste Faguang Xuebao/Chinese Journal of Luminescence. 37: 94-99 |
| Kong YF, Li X, Mei YH, et al. (2015) Effects of die-attach material and ambient temperature on properties of high-power COB blue LED module Ieee Transactions On Electron Devices. 62: 2251-2256 |
| Mei Y, Yee AF, Wineman AS, et al. (1998) Stress evolution during thermoset cure Materials Research Society Symposium - Proceedings. 515: 195-202 |