Clay D. Mortensen, Ph.D.

Affiliations: 
University of Oregon, Eugene, OR, United States 
Area:
Solid State Chemistry, Inorganic Chemistry, Electrochemistry and Materials Science
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David C. Johnson grad student 2008 University of Oregon
 (The effect of grain size, alloy composition and turbostratic disorder on the thermal and electrical properties of bismuth telluride-based materials.)
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Lin Q, Tepfer S, Heideman C, et al. (2011) Influence of selenium vapor postannealing on the electrical transport properties of PbSe-WSe2 nanolaminates Journal of Materials Research. 26: 1866-1871
Mortensen C, Beekman M, Johnson DC. (2011) Probing the effects of alloying, grain size, and turbostratic disorder on thermal conductivity Science of Advanced Materials. 3: 639-645
Mortensen C, Zschack P, Johnson DC. (2010) The Evaluation of TiTe2 as a Diffusion Barrier in the Formation of Low Thermal Conductivity Nanolaminates with Bi2Te3 and Sb2Te3 Advances in Science and Technology. 74: 38-47
Zschack P, Heideman C, Lin Q, et al. (2010) D-76 Insights into Thermoelectric Materials: New Structures and Properties Powder Diffraction. 25: 209-209
Taylor A, Mortensen C, Rostek R, et al. (2010) Vapor annealing as a post-processing technique to control carrier concentrations of Bi 2Te 3 thin films Journal of Electronic Materials. 39: 1981-1986
Mortensen CD, Johnson D. (2009) Interdiffusion of Bi and Sb in Superlattices Built from Blocks of Bi 2 Te 3 , Sb 2 Te 3 and TiTe 2 Mrs Proceedings. 1166
Chiritescu C, Mortensen C, Cahill DG, et al. (2009) Lower limit to the lattice thermal conductivity of nanostructured Bi 2 Te3 -based materials Journal of Applied Physics. 106
Zhao JH, Gupta V, Mortensen CD, et al. (2009) Thermomechanical property characterization of ultra low-k materials Aip Conference Proceedings. 1143: 87-96
Zschack P, Heideman C, Mortensen C, et al. (2009) X-ray characterization of low-thermal-conductivity thin-film materials Journal of Electronic Materials. 38: 1402-1406
Gupta V, Zhao JH, Edwards D, et al. (2008) Ultra low-K Dielectric mechanical property characterization 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 714-719
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