Karen L. Stewart, Ph.D.
Affiliations: | 2008 | University of Illinois, Urbana-Champaign, Urbana-Champaign, IL |
Area:
structure and reactivity of surfaces and interfacesGoogle:
"Karen Stewart"Mean distance: 8.59 | S | N | B | C | P |
Parents
Sign in to add mentorAndrew A. Gewirth | grad student | 2008 | UIUC | |
(Copper surface chemistry relevant to chemical mechanical planarization (CMP).) |
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Publications
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Stewart KL, Keleher JJ, Gewirth AA. (2009) Synergy of ammonium oxalate and hydrogen peroxide on the dissolution of copper at neutral pH Journal of the Electrochemical Society. 156: H595-H600 |
Stewart KL, Keleher JJ, Gewirth AA. (2008) Relationship between molecular structure and removal rates during chemical mechanical planarization: Comparison of benzotriazole and 1,2,4-triazole Journal of the Electrochemical Society. 155: D625-D631 |
Stewart KL, Gewirth AA. (2007) Mechanism of electrochemical reduction of hydrogen peroxide on copper in acidic sulfate solutions. Langmuir : the Acs Journal of Surfaces and Colloids. 23: 9911-8 |
Bae SE, Stewart KL, Gewirth AA. (2007) Nitrate adsorption and reduction on Cu(100) in acidic solution. Journal of the American Chemical Society. 129: 10171-80 |
Stewart KL, Zhang J, Li S, et al. (2007) Anion effects on Cu-benzotriazole film formation Journal of the Electrochemical Society. 154: D57-D63 |