Mark W. Kiehlbauch, Ph.D.

Affiliations: 
2001 University of California, Berkeley, Berkeley, CA 
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"Mark Kiehlbauch"
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David B. Graves grad student 2001 UC Berkeley
 (Innovative techniques in plasma modeling.)
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Publications

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Ouyang Z, Ruzic DN, Kiehlbauch M, et al. (2014) Etching mechanism of the single-step through-silicon-via dry etch using SF6/C4F8 chemistry Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 32
Ouyang Z, Xu W, Ruzic DN, et al. (2014) Finite-element simulation models and experimental verification for through-silicon-via etching: Bosch process and single-step etching Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 32
Rueger NR, McGinnis A, Good F, et al. (2013) Patterning and etch challenges for future DRAM and other high aspect ratio memory device fabrication Proceedings of Spie - the International Society For Optical Engineering. 8685
Mevawalla ZN, May GS, Kiehlbauch MW. (2011) Neural network modeling for advanced process control using production data Ieee Transactions On Semiconductor Manufacturing. 24: 182-189
Mevawalla ZN, May GS, Honjo M, et al. (2011) Neural network modeling of fabrication yield using manufacturing data Asmc (Advanced Semiconductor Manufacturing Conference) Proceedings
Mevawalla ZN, May GS, Kiehlbauch MW. (2010) Neural networks for advanced process control Asmc (Advanced Semiconductor Manufacturing Conference) Proceedings. 137-142
Belen RJ, Gomez S, Kiehlbauch M, et al. (2006) In situ measurement of the ion incidence angle dependence of the ion-enhanced etching yield in plasma reactors Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 24: 2176-2186
Belen RJ, Gomez S, Kiehlbauch M, et al. (2006) Feature scale model of Si etching in S F6 O2 HBr plasma and comparison with experiments Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 24: 350-361
Gomez S, Belen RJ, Kiehlbauch M, et al. (2005) Etching of high aspect ratio features in Si using SF 6/O 2/HBr and SF 6/O 2/Cl 2 plasma Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 23: 1592-1597
Belen RJ, Gomez S, Cooperberg D, et al. (2005) Feature-scale model of Si etching in SF 6/O 2 plasma and comparison with experiments Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 23: 1430-1439
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