Alex A. Volinsky, Ph.D.
Affiliations: | 2000 | University of Minnesota, Twin Cities, Minneapolis, MN |
Area:
Nanomaterials & Nanotechnology, Nanomechanics & PlasticityGoogle:
"Alex Volinsky"Mean distance: 13.95
Parents
Sign in to add mentor| William W. Gerberich | grad student | 2000 | UMN | |
| (The role of geometry and plasticity in thin, ductile film adhesion.) | ||||
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Publications
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| Ban Y, Zhang Y, Tian B, et al. (2020) Microstructure Evolution in Cu-Ni-Co-Si-Cr Alloy During Hot Compression by Ce Addition. Materials (Basel, Switzerland). 13 |
| Geng Y, Li X, Zhang Y, et al. (2020) Microstructure evolution of Cu-1.0Co-0.65Si-0.1Ti alloy during hot deformation Vacuum. 177: 109376 |
| Kondratov AP, Yakubov V, Volinsky AA. (2020) Strain gauges capable of measuring large cyclical deformations printed on elastic polymer films Measurement. 166: 108107 |
| Ban Y, Zhang Y, Jia Y, et al. (2020) Effects of Cr addition on the constitutive equation and precipitated phases of copper alloy during hot deformation Materials & Design. 191: 108613 |
| Ban Y, Zhang Y, Tian B, et al. (2020) EBSD analysis of hot deformation behavior of Cu-Ni-Co-Si-Cr alloy Materials Characterization. 110656 |
| Zhuang Y, Zhang X, Peng T, et al. (2020) Effects of yttrium oxides on the microstructure and mechanical properties of 15-15Ti ODS alloy fabricated by casting Materials Characterization. 162: 110228 |
| Zhang X, Zhang Y, Tian B, et al. (2020) Graphene oxide effects on the properties of Al2O3-Cu/35W5Cr composite Journal of Materials Science & Technology. 37: 185-199 |
| Geng Y, Ban Y, Wang B, et al. (2020) A review of microstructure and texture evolution with nanoscale precipitates for copper alloys Journal of Materials Research and Technology. 9: 11918-11934 |
| Wang B, Zhang Y, Tian B, et al. (2020) Nanoscale precipitates evolution and strengthening mechanism of the aged Cu-Mg-Fe-Sn-P-Y electrical contact wire Journal of Materials Research and Technology. 9: 6352-6359 |
| Geng Y, Zhang Y, Song K, et al. (2020) Effect of Ce addition on microstructure evolution and precipitation in Cu-Co-Si-Ti alloy during hot deformation Journal of Alloys and Compounds. 821: 155666 |