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Seungchoun Choi, Ph.D.

Affiliations: 
2013 Mechanical Engineering University of California, Berkeley, Berkeley, CA, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering, General Engineering
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Parents

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Fiona M. Doyle grad student 2013 UC Berkeley
 (Physicochemical Modeling of Copper Chemical Mechanical Planarization (CMP) Considering Synergies in Removal Materials.)

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Publications

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Choi S, Tripathi S, Dornfeld DA, et al. (2010) Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4 Journal of the Electrochemical Society. 157
Tripathi S, Choi S, Doyle FM, et al. (2009) Integrated Tribo-Chemical Modeling of Copper CMP Mrs Proceedings. 1157
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