Jason J. Keleher, Ph.D.

Affiliations: 
2004 Clarkson University, Potsdam, NY, United States 
Area:
Organic Chemistry, Materials Science Engineering
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Parents

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Yuzhuo Li grad student 2004 Clarkson University
 (Development of next generation consumable technologies for chemical mechanical planarization of copper/low K devices.)
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Publications

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Wortman-Otto KM, Graverson CF, Linhart AN, et al. (2020) Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance Ecs Journal of Solid State Science and Technology. 9: 54005
Zubi TB, Wiencek RA, Mlynarski AL, et al. (2019) Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications Ecs Journal of Solid State Science and Technology. 8
Rickhoff TA, Sullivan E, Werth LK, et al. (2018) A biomimetic cellulose-based composite material that incorporates the antimicrobial metal-organic framework HKUST-1 Journal of Applied Polymer Science. 136: 46978
Soderquist TJ, Chesniak OM, Witt MR, et al. (2012) Evaluation of the catalytic decomposition of H2O2 through use of organo-metallic complexes--a potential link to the luminol presumptive blood test. Forensic Science International. 219: 101-5
Stewart KL, Keleher JJ, Gewirth AA. (2009) Synergy of ammonium oxalate and hydrogen peroxide on the dissolution of copper at neutral pH Journal of the Electrochemical Society. 156: H595-H600
Cheemalapati K, Keleher J, Li Y. (2007) Key Chemical Components in Metal CMP Slurries Microelectronic Applications of Chemical Mechanical Planarization. 201-247
Keleher J, Bashant J, Heldt N, et al. (2002) Photo-catalytic preparation of silver-coated TiO2 particles for antibacterial applications World Journal of Microbiology & Biotechnology. 18: 133-139
Hariharaputhiran M, Zhang J, Ramarajan S, et al. (2000) Hydroxyl radical formation in H2O2-amino acid mixtures and chemical mechanical polishing of copper Journal of the Electrochemical Society. 147: 3820-3826
Keleher J, Zhang J, Waud S, et al. (2000) Bridging the Gap: Understanding the Chemistry of CMP The Chemical Educator. 5: 242-245
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