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Krishnayya Cheemalapati, Ph.D.

Affiliations: 
2007 Clarkson University, Potsdam, NY, United States 
Area:
Materials Science Engineering
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Yuzhuo Li grad student 2007 Clarkson University
 (Investigation of planarization characteristics and novel defects in metal CMP affected by physical, chemical and mechanical factors.)

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Publications

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Cheemalapati K, Keleher J, Li Y. (2007) Key Chemical Components in Metal CMP Slurries Microelectronic Applications of Chemical Mechanical Planarization. 201-247
Cheemalapati K, Bundi D, Duwuru V, et al. (2006) Investigation of some key factors that influence step height reduction efficiency and detectivity during metal CMP 2006 Proceedings - 11th International Chemical-Mechanical Planarization For Ulsi Multilevel Interconnection Conference, Cmp-Mic 2006. 547-553
Odeh F, Cheemalapati K, Duvvuru VR, et al. (2005) Chemical analysis of copper CMP slurries before and after polishing for defect reduction 2005 Proceedings - 10th International Chemical-Mechanical Planarization For Ulsi Multilevel Interconnection Conference, Cmp-Mic 2005. 53-57
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