Jipu Lei, Ph.D.

Affiliations: 
2005 University of North Texas, Denton, TX, United States 
Area:
Analytical Chemistry
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"Jipu Lei"
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Jeffry A. Kelber grad student 2005 University of North Texas
 (Copper electrodeposition on ruthenium with a chemisorbed iodine surface layer.)
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Publications

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Lei J, Rudenja S, Magtoto N, et al. (2006) Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition Thin Solid Films. 497: 121-129
Liu J, Lei J, Magtoto N, et al. (2005) The effects of an iodine surface layer on ru reactivity in air and during Cu electrodeposition Journal of the Electrochemical Society. 152: G115-G121
Wang C, Lei J, Bjelkevig C, et al. (2003) Electrodeposition of adherent copper film on unmodified tungsten Thin Solid Films. 445: 72-79
Wang C, Lei J, Rudenja S, et al. (2002) Seedless electrodeposition of Cu on unmodified tungsten Electrochemical and Solid-State Letters. 5: C82-C84
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