Richard Collin Alkire
Affiliations: | University of Illinois, Urbana-Champaign, Urbana-Champaign, IL |
Area:
electrochemical engineeringWebsite:
http://www.electrochem.org/alkireGoogle:
"Richard Alkire"Mean distance: (not calculated yet)
Parents
Sign in to add mentorCharles W. Tobias | grad student | 1965-1968 | UC Berkeley | |
(Reaction distribution in a dissolving porous anode.) |
Children
Sign in to add traineeJames M. Fenton | grad student | ||
Kurt R. Hebert | grad student | 1985 | UIUC (E-Tree) |
Demetre J. Economou | grad student | 1988 | UIUC (Physics Tree) |
Timothy J. Pricer | grad student | 2000 | UIUC |
Yan Qin | grad student | 2000-2006 | UIUC |
Mohan Karulkar | grad student | 2007 | UIUC |
Ryan M. Stephens | grad student | 2008 | UIUC |
Jennifer L. Younker | grad student | 2008 | UIUC |
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Publications
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Bezzola A, Bales BB, Petzold LR, et al. (2014) Numerical scaling studies of kinetically-limited electrochemical nucleation and growth with accelerated stochastic simulations Journal of the Electrochemical Society. 161: E3001-E3008 |
Bezzola A, Bales BB, Alkire RC, et al. (2014) An exact and efficient first passage time algorithm for reaction-diffusion processes on a 2D-lattice Journal of Computational Physics. 256: 183-197 |
Stephens RM, Willis M, Alkire RC. (2009) Additive-assisted nucleation and growth by electrodeposition: II. Mathematical model and comparison with experimental data Journal of the Electrochemical Society. 156 |
Willis M, Alkire RC. (2009) Additive-Assisted Nucleation and Growth by Electrodeposition I. Experimental Studies with Copper Seed Arrays on Gold Films Journal of the Electrochemical Society. 156 |
Stephens RM, Alkire RC. (2009) Island dynamics algorithm for kinetically limited electrochemical nucleation of copper with additives onto a foreign substrate Journal of the Electrochemical Society. 156 |
Qin Y, Li X, Xue F, et al. (2008) Effect of additives on shape evolution during electrodeposition: III. Trench infill for on-chip interconnects Journal of the Electrochemical Society. 155 |
Zheng Z, Stephens RM, Braatz RD, et al. (2008) A hybrid multiscale kinetic Monte Carlo method for simulation of copper electrodeposition Journal of Computational Physics. 227: 5184-5199 |
Alkire RC, Gerischer H, Kolb DM, et al. (2008) Introduction Advances in Electrochemical Science and Engineering. 5: v |
Drews TO, Braatz RD, Alkire RC. (2007) Monte Carlo simulation of kinetically limited electrodeposition on a surface with metal seed clusters Zeitschrift Fur Physikalische Chemie. 221: 1287-1305 |
Rusli E, Xue F, Drews TO, et al. (2007) Effect of Additives on Shape Evolution during Electrodeposition Journal of the Electrochemical Society. 154: D584 |