Ronald J. Gutmann
Affiliations: | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Chemical Engineering, Polymer Chemistry, Materials Science EngineeringWebsite:
https://prabook.com/web/ronald_j.gutmann/835192Google:
"Ronald Gutmann"Bio:
https://www.researchgate.net/profile/RJ_Gutmann
https://books.google.com/books?id=IDQhAQAAIAAJ&pg=PA575#v=onepage&q&f=false
Mean distance: (not calculated yet)
Children
Sign in to add traineeChristopher L. Borst | grad student | 2000 | RPI |
Byung-Chan Lee | grad student | 2000 | RPI |
Kevin S. Matocha | grad student | 2003 | RPI |
K. Juliet Vogel | grad student | 2004 | RPI |
YuJuan (Annie) Zeng | grad student | 2005 | RPI |
Siddharth Devarajan | grad student | 2006 | RPI |
J. Jay McMahon | grad student | 2008 | RPI |
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Publications
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Losee PA, Wang Y, Li C, et al. (2009) Comparative evaluation of anode layers on the electrical characteristics of high voltage 4H-SiC PiN diodes Materials Science Forum. 600: 1003-1006 |
Lu J, McMahon JJ, Gutmann RJ. (2008) 3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces Mrs Proceedings. 1112 |
Kwon Y, Jindal A, Augur R, et al. (2008) Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Journal of the Electrochemical Society. 155 |
Cale TS, Lu JQ, Gutmann RJ. (2008) Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling Chemical Engineering Communications. 195: 847-888 |
Kwon Y, Seok J, Lu JQ, et al. (2007) Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers Journal of the Electrochemical Society. 154 |
Losee PA, Li C, Kumar RJ, et al. (2007) Electrical characteristics and carrier lifetime measurements in high voltage 4H-SiC PiN diodes International Journal of High Speed Electronics and Systems. 17: 43-48 |
Kumar RJ, Borrego JM, Gutmann RJ, et al. (2007) Microwave photoconductivity decay characterization of high-purity 4H-SiC substrates Journal of Applied Physics. 102 |
Losee PA, Li C, Kumar RJ, et al. (2006) Improving switching characteristics of 4H-SiC junction rectifiers using epitaxial and implanted anodes with epitaxial refill Materials Science Forum. 527: 1363-1366 |
Gutmann RJ, McMahon JJ, Lu J. (2006) Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers Mrs Proceedings. 970 |
Lee SH, Niklaus F, McMahon JJ, et al. (2006) Fine keyed alignment and bonding for wafer-level 3D ICs Materials Research Society Symposium Proceedings. 914: 433-438 |