Ronald J. Gutmann

Affiliations: 
Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Chemical Engineering, Polymer Chemistry, Materials Science Engineering
Website:
https://prabook.com/web/ronald_j.gutmann/835192
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"Ronald Gutmann"
Bio:

https://www.researchgate.net/profile/RJ_Gutmann
https://books.google.com/books?id=IDQhAQAAIAAJ&pg=PA575#v=onepage&q&f=false

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Children

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Christopher L. Borst grad student 2000 RPI
Byung-Chan Lee grad student 2000 RPI
Kevin S. Matocha grad student 2003 RPI
K. Juliet Vogel grad student 2004 RPI
YuJuan (Annie) Zeng grad student 2005 RPI
Siddharth Devarajan grad student 2006 RPI
J. Jay McMahon grad student 2008 RPI
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Publications

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Losee PA, Wang Y, Li C, et al. (2009) Comparative evaluation of anode layers on the electrical characteristics of high voltage 4H-SiC PiN diodes Materials Science Forum. 600: 1003-1006
Lu J, McMahon JJ, Gutmann RJ. (2008) 3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces Mrs Proceedings. 1112
Kwon Y, Jindal A, Augur R, et al. (2008) Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Journal of the Electrochemical Society. 155
Cale TS, Lu JQ, Gutmann RJ. (2008) Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling Chemical Engineering Communications. 195: 847-888
Kwon Y, Seok J, Lu JQ, et al. (2007) Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers Journal of the Electrochemical Society. 154
Losee PA, Li C, Kumar RJ, et al. (2007) Electrical characteristics and carrier lifetime measurements in high voltage 4H-SiC PiN diodes International Journal of High Speed Electronics and Systems. 17: 43-48
Kumar RJ, Borrego JM, Gutmann RJ, et al. (2007) Microwave photoconductivity decay characterization of high-purity 4H-SiC substrates Journal of Applied Physics. 102
Losee PA, Li C, Kumar RJ, et al. (2006) Improving switching characteristics of 4H-SiC junction rectifiers using epitaxial and implanted anodes with epitaxial refill Materials Science Forum. 527: 1363-1366
Gutmann RJ, McMahon JJ, Lu J. (2006) Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers Mrs Proceedings. 970
Lee SH, Niklaus F, McMahon JJ, et al. (2006) Fine keyed alignment and bonding for wafer-level 3D ICs Materials Research Society Symposium Proceedings. 914: 433-438
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