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Kevin P. Pipe

Affiliations: 
University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
Electronics and Electrical Engineering, Optics Physics
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"Kevin Pipe"
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Parents

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Rajeev Jagga Ram grad student MIT (E-Tree)

Children

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Kwok-Leung Chan grad student 2007 University of Michigan
Kwang H. An grad student 2009 University of Michigan
Abhishek Yadav grad student 2010 University of Michigan
Yiying Zhao grad student 2010 University of Michigan

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Publications

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Jha AK, Leisher PO, Li C, et al. (2019) Thermoreflectance-Based Measurement of Facet Optical Absorption in High Power Diode Lasers Ieee Photonics Technology Letters. 31: 1909-1912
Jha AK, Li C, Pipe KP, et al. (2019) Thermoreflectance Imaging of Back-Irradiance Heating in High Power Diode Lasers at Several Operating Wavelengths Ieee Journal of Selected Topics in Quantum Electronics. 25: 1-13
Li C, Pipe KP, Cao C, et al. (2018) Thermal imaging of high power diode lasers subject to back-irradiance Applied Physics Letters. 112: 101101
Hui S, Gao W, Lu X, et al. (2017) Engineering Temperature-Dependent Carrier Concentration in Bulk Composite Materials via Temperature-Dependent Fermi Level Offset Advanced Energy Materials. 8: 1701623
Li C, Pipe KP. (2016) Thermionic refrigeration at CNT-CNT junctions Applied Physics Letters. 109: 163901
Zhang K, Yadav A, Shao L, et al. (2016) Thermoelectric properties of MBE-grown HgCdTe-based superlattices from 100K to 300K Aip Advances. 6
Kim GH, Kim J, Pipe KP. (2016) Humidity-dependent thermoelectric properties of poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonate) Applied Physics Letters. 108
Kwon MS, Yu Y, Coburn C, et al. (2015) Suppressing molecular motions for enhanced room-temperature phosphorescence of metal-free organic materials. Nature Communications. 6: 8947
Biswas S, Shalev O, Pipe KP, et al. (2015) Chemical Vapor Jet Deposition of Parylene Polymer Films in Air Macromolecules. 48: 5550-5556
Rashidi V, Pipe KP. (2015) Contributions of strain relaxation and interface modes to thermal transport in superlattices Computational Materials Science. 107: 151-156
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