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Haiying Li

Affiliations: 
Henkel Corp. 
Area:
Adhesives
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Ching-Ping Wong grad student 1999-2003 Georgia Tech (E-Tree)

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Li H, Jacob K, Wong C. (2003) An improvement of thermal conductivity of underfill materials for flip-chip packages Ieee Transactions On Advanced Packaging. 26: 25-32
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