Yuhai Mei - Publications

Affiliations: 
2000 University of Michigan, Ann Arbor, Ann Arbor, MI 

82 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Yap D. Gorlin-Goltz syndrome: first reported case of bullae in the lungs complicated with tension pneumothorax. Bmj Case Reports. 2018. PMID 29930167 DOI: 10.1136/bcr-2017-223689  0.68
2016 Richards DJ, Tan Y, Coyle R, Li Y, Xu R, Yeung N, Parker A, Menick D, Tian B, Mei Y. Nanowires and electrical stimulation synergistically improve functions of hiPSC cardiac spheroids. Nano Letters. PMID 27328393 DOI: 10.1021/acs.nanolett.6b02093  0.32
2016 Zhang P, Cao L, Fan P, Mei Y, Wu M. LncRNA-MIF, a c-Myc-activated long non-coding RNA, suppresses glycolysis by promoting Fbxw7-mediated c-Myc degradation. Embo Reports. PMID 27317567 DOI: 10.15252/embr.201642067  0.44
2016 Mei Y, He C, Deng W, Ba D, Yang M, Zhang J, Zhang S, Shen P, Chen X. A Real-Time PCR Method to Detect the Population Level of Halovirus SNJ1. Plos One. 11: e0155642. PMID 27192212 DOI: 10.1371/journal.pone.0155642  0.48
2016 Liu F, Jiang N, Xiao ZY, Cheng JP, Mei YZ, Zheng P, Wang L, Zhang XR, Zhou XB, Zhou WX, Zhang YX. Effects of poly (ADP-ribose) polymerase-1 (PARP-1) inhibition on sulfur mustard-induced cutaneous injuries in vitro and in vivo. Peerj. 4: e1890. PMID 27077006 DOI: 10.7717/peerj.1890  0.32
2016 Wang Z, Huang H, He W, Kong B, Hu H, Fan Y, Liao J, Wang L, Mei Y, Liu W, Xiong X, Peng J, Xiao Y, Huang D, Quan D, et al. Regulator of G-protein signaling 5 protects cardiomyocytes against apoptosis during in vitro cardiac ischemia-reperfusion in mice by inhibiting both JNK and P38 signaling pathways. Biochemical and Biophysical Research Communications. PMID 27021681 DOI: 10.1016/j.bbrc.2016.03.114  0.32
2016 Mei Y, Duan C, Li X, Zhao Y, Cao F, Shang S, Ding S, Yue X, Gao G, Yang H, Shen L, Feng X, Jia J, Tong Z, Yang X. Reduction of Endogenous Melatonin Accelerates Cognitive Decline in Mice in a Simulated Occupational Formaldehyde Exposure Environment. International Journal of Environmental Research and Public Health. 13. PMID 26938543 DOI: 10.3390/ijerph13030258  0.68
2016 Yang JP, Liao YD, Mai DM, Xie P, Qiang YY, Zheng LS, Wang MY, Mei Y, Meng DF, Xu L, Cao L, Yang Q, Yang XX, Wang WB, Peng LX, et al. Tumor vasculogenic mimicry predicts poor prognosis in cancer patients: a meta-analysis. Angiogenesis. PMID 26899730 DOI: 10.1007/s10456-016-9500-2  0.32
2016 Wang C, Wang ZC, Mei YX, Li YK, Li L, Tang ZT, Liu Y, Zhang P, Zhai HF, Xu ZA, Cao GH. A New ZrCuSiAs-Type Superconductor: ThFeAsN. Journal of the American Chemical Society. PMID 26853632 DOI: 10.1021/jacs.6b00236  0.44
2016 Mei Y, Zhao S, Lu X, Liu H, Li X, Ma R. Clinical and Prognostic Significance of Preoperative Plasma Fibrinogen Levels in Patients with Operable Breast Cancer. Plos One. 11: e0146233. PMID 26799214 DOI: 10.1371/journal.pone.0146233  0.68
2016 Yang CX, Li X, Kong YF, Mei YH, Lu GQ. High power COB LED modules attached by nanosilver paste Faguang Xuebao/Chinese Journal of Luminescence. 37: 94-99. DOI: 10.3788/fgxb20163701.0094  0.6
2016 Li W, Luo Q, Mei Y, Zong S, He X, Xia C. Flying-capacitor-based hybrid LLC converters with input voltage autobalance ability for high voltage applications Ieee Transactions On Power Electronics. 31: 1908-1920. DOI: 10.1109/TPEL.2015.2434839  0.48
2016 Yang CX, Li X, Lu GQ, Mei YH. Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature Materials Science and Engineering A. 660: 71-76. DOI: 10.1016/j.msea.2016.02.082  0.68
2016 Mei Y, Li X, Yao X. On investigation of interdependence between sub-problems of the Travelling Thief Problem Soft Computing. 20: 157-172. DOI: 10.1007/s00500-014-1487-2  0.56
2015 Dennis SG, Trusk T, Richards D, Jia J, Tan Y, Mei Y, Fann S, Markwald R, Yost M. Viability of Bioprinted Cellular Constructs Using a Three Dispenser Cartesian Printer. Journal of Visualized Experiments : Jove. PMID 26436877 DOI: 10.3791/53156  0.32
2015 Shu D, Peng C, Zhu H, Mei Y, Li W, Li X. [A case report of overlapping Rosai-Dorfman disease of the liver and gallbladder combined with hepatocellular adenoma]. Zhonghua Gan Zang Bing Za Zhi = Zhonghua Ganzangbing Zazhi = Chinese Journal of Hepatology. 23: 387-8. PMID 26427072  0.4
2015 Ren LM, Li R, Chen LN, Zhu P, Gu F, Sun LY, Zhao JX, Liu XY, Guo JL, Bi LQ, Hao YJ, Zhang ZL, Mei YF, Zhang ZY, Liu HX, et al. Efficacy and safety of weekly leflunomide for the treatment of early rheumatoid arthritis: a randomized, multi-center study. International Journal of Rheumatic Diseases. PMID 26268935 DOI: 10.1111/1756-185X.12677  0.32
2015 Mei Y, Peng CJ, Shu DJ, Zhu HJ, Li XX, Li WN. Simultaneous Occurrence of a Rare Pancreatic Lymphoepithelial Cyst and Duodenal Mesenteric Castleman's Disease: a Case Report. The Indian Journal of Surgery. 77: 114-6. PMID 25972666 DOI: 10.1007/s12262-014-1188-1  0.4
2015 Mei Y, Peng CJ, Chen L, Li XX, Li WN, Shu DJ, Xie WT. Hemolymphangioma of the spleen: A report of a rare case. World Journal of Gastroenterology : Wjg. 21: 5442-4. PMID 25954120 DOI: 10.3748/wjg.v21.i17.5442  0.32
2015 Wang X, Zhang L, Luo J, Wu Z, Mei Y, Wang Y, Li X, Wang W, Zhou H. Tacrolimus 0.03% ointment in labial discoid lupus erythematosus: A randomized, controlled clinical trial. Journal of Clinical Pharmacology. 55: 1221-8. PMID 25951426 DOI: 10.1002/jcph.537  0.68
2015 Mei Y, He C, Huang Y, Liu Y, Zhang Z, Chen X, Shen P. Salinity regulation of the interaction of halovirus SNJ1 with its host and alteration of the halovirus replication strategy to adapt to the variable ecosystem. Plos One. 10: e0123874. PMID 25853566 DOI: 10.1371/journal.pone.0123874  0.48
2015 Tan Y, Richards D, Xu R, Stewart-Clark S, Mani SK, Borg TK, Menick DR, Tian B, Mei Y. Silicon nanowire-induced maturation of cardiomyocytes derived from human induced pluripotent stem cells. Nano Letters. 15: 2765-72. PMID 25826336 DOI: 10.1021/nl502227a  0.32
2015 Liu Y, Chen X, Huang S, Tian L, Lu Y, Mei Y, Ren M, Li N, Liu L, Xiang H. Association between air pollutants and cardiovascular disease mortality in Wuhan, China. International Journal of Environmental Research and Public Health. 12: 3506-16. PMID 25815523 DOI: 10.3390/ijerph120403506  0.48
2015 Chen G, Cui S, You L, Li Y, Mei YH, Chen X. Experimental study on multi-step creep properties of rat skins. Journal of the Mechanical Behavior of Biomedical Materials. 46: 49-58. PMID 25771256 DOI: 10.1016/j.jmbbm.2015.02.020  0.68
2015 Wu L, Chen X, Mei Y, Hong Q, Feng Z, Lv Y, Wen J, Liu X, Cai G, Chen X. CXCL10 expression induced by Mxi1 inactivation induces mesangial cell apoptosis in mouse Habu nephritis. Cellular Signalling. 27: 943-50. PMID 25683914 DOI: 10.1016/j.cellsig.2015.01.019  0.48
2015 Deng W, Liu MJ, Yang Q, Mei Y, Li XF, Zheng MQ. Tribenuron-methyl resistance and mutation diversity of Pro197 in flixweed (Descurainia Sophia L.) accessions from China. Pesticide Biochemistry and Physiology. 117: 68-74. PMID 25619914 DOI: 10.1016/j.pestbp.2014.10.012  0.32
2015 Dennis SG, Trusk T, Richards D, Jia J, Tan Y, Mei Y, Fann S, Markwald R, Yost M. Viability of bioprinted cellular constructs using a three dispenser Cartesian printer Journal of Visualized Experiments. 2015. DOI: 10.3791/53156  0.32
2015 Li WN, Peng CJ, Shu DJ, Mei Y, Li XX, Xie WT. Progress in research of liver ischemia-reperfusion injury World Chinese Journal of Digestology. 23: 3554-3559. DOI: 10.11569/wcjd.v23.i22.3554  0.4
2015 Xie J, Mei Y, Song A. Evolving self-adaptive tabu Search algorithm for Storage Location Assignment Problems Gecco 2015 - Companion Publication of the 2015 Genetic and Evolutionary Computation Conference. 779-780. DOI: 10.1145/2739482.2764896  0.56
2015 Kong YF, Li X, Mei YH, Lu GQ. Effects of die-attach material and ambient temperature on properties of high-power COB blue LED module Ieee Transactions On Electron Devices. 62: 2251-2256. DOI: 10.1109/TED.2015.2436820  0.68
2015 Wang MY, Mei YH, Li X, Lu GQ. Relationship between transient thermal impedance and shear strength of pressureless sintered silver as die attachment for power devices Icep-Iaac 2015 - 2015 International Conference On Electronic Packaging and Imaps All Asia Conference. 559-564. DOI: 10.1109/ICEP-IAAC.2015.7111077  0.68
2015 Zhao SY, Li X, Mei YH, Lu GQ. Silver paste pressureless sintering on bare copper substrates for large area chip bonding in high power electronic packaging Icep-Iaac 2015 - 2015 International Conference On Electronic Packaging and Imaps All Asia Conference. 491-494. DOI: 10.1109/ICEP-IAAC.2015.7111065  0.68
2015 Wang MY, Lu GQ, Mei YH, Li X, Wang L, Chen G. Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module Iet Power Electronics. 8: 1009-1016. DOI: 10.1049/iet-pel.2014.0120  0.68
2015 Chen G, Wang YZ, Mei Y, Yu L, Li X, Chen X. Retraction notice to "Influence of temperature and microstructure on the mechanical properties of sintered nanosilver joints" [Mater. Sci. Eng. A 626 (2015) 390-399 Materials Science and Engineering A. 636: 613. DOI: 10.1016/j.msea.2015.05.001  0.68
2015 Chen G, Wang YZ, Mei Y, Yu L, Li X, Chen X. Influence of temperature and microstructure on the mechanical properties of sintered nanosilver joints Materials Science and Engineering A. 626: 390-399. DOI: 10.1016/j.msea.2014.12.066  0.68
2015 Zhao SY, Li X, Mei YH, Lu GQ. Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate Microelectronics Reliability. 55: 2524-2531. DOI: 10.1016/j.microrel.2015.10.017  0.68
2015 Yan H, Mei Y, Li X, Zhang P, Lu GQ. Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions Microelectronics Reliability. DOI: 10.1016/j.microrel.2015.07.037  0.68
2015 Fu S, Mei Y, Li X, Ning P, Lu GQ. Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging Journal of Electronic Materials. 44: 3973-3984. DOI: 10.1007/s11664-015-3842-1  0.68
2015 Yan Y, Ngo KDT, Hou D, Mu M, Mei Y, Lu GQ. Effect of Sintering Temperature on Magnetic Core-Loss Properties of a NiCuZn Ferrite for High-Frequency Power Converters Journal of Electronic Materials. 44: 3788-3794. DOI: 10.1007/s11664-015-3836-z  0.68
2015 Chen G, Liang HQ, Wang L, Mei YH, Chen X. Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer Polymer Engineering and Science. 55: 664-671. DOI: 10.1002/pen.23932  0.68
2015 Zhou C, Chen X, Mei Y, Qian L. Study on the characteristics of compression wave propagating through high-speed railway tunnel with side branches Tumu Gongcheng Xuebao/China Civil Engineering Journal. 48: 111-117.  0.48
2014 Lai RY, Shao ZW, Yu HQ, Li LL, Mei Y, He Y. [Design and application of psychological intervention paths for ascites type of advanced schistosomiasis patients]. Zhongguo Xue Xi Chong Bing Fang Zhi Za Zhi = Chinese Journal of Schistosomiasis Control. 26: 662-4. PMID 25856895  0.32
2014 Guo H, Li W, Mei Y, Zeng J. [Meta analysis of condiments fortified with sodium iron ethylenediaminetetraacetate on the prevention and treatment of anemia]. Wei Sheng Yan Jiu = Journal of Hygiene Research. 43: 998-1003. PMID 25603614  0.48
2014 Kong B, Liu Y, Hu H, Wang L, Fan Y, Mei Y, Liu W, Liao J, Liu D, Xing D, Huang H. Left atrial appendage morphology in patients with atrial fibrillation in China: implications for stroke risk assessment from a single center study. Chinese Medical Journal. 127: 4210-4. PMID 25533823  0.32
2014 Hong Q, Yu S, Mei Y, Lv Y, Chen D, Wang Y, Geng W, Wu D, Cai G, Chen X. Smilacis Glabrae Rhizoma reduces oxidative stress caused by hyperuricemia via upregulation of catalase. Cellular Physiology and Biochemistry : International Journal of Experimental Cellular Physiology, Biochemistry, and Pharmacology. 34: 1675-85. PMID 25401709 DOI: 10.1159/000366369  0.48
2014 Wang L, Chen G, Zhu J, Sun X, Mei Y, Ling X, Chen X. Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe Structural Engineering and Mechanics. 52: 1135-1156. DOI: 10.12989/sem.2014.52.6.1135  0.68
2014 Lu GQ, Li W, Mei Y, Chen G, Li X, Chen X. Characterizations of nanosilver joints by rapid sintering at low temperature for power electronic packaging Ieee Transactions On Device and Materials Reliability. 14: 623-629. DOI: 10.1109/TDMR.2014.2306955  0.68
2014 Lu GQ, Yang W, Mei YH, Li X, Chen G, Chen X. Migration of sintered nanosilver on alumina and aluminum nitride substrates at high temperatures in dry air for electronic packaging Ieee Transactions On Device and Materials Reliability. 14: 600-606. DOI: 10.1109/TDMR.2014.2304737  0.68
2014 Lu GQ, Yang W, Mei YH, Li X, Chen G, Chen X. Mechanism of migration of sintered nanosilver at high temperatures in dry air for electronic packaging Ieee Transactions On Device and Materials Reliability. 14: 311-317. DOI: 10.1109/TDMR.2013.2282041  0.68
2014 Mei YH, Lian JY, Chen X, Chen G, Li X, Lu GQ. Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver Ieee Transactions On Device and Materials Reliability. 14: 194-202. DOI: 10.1109/TDMR.2013.2280668  0.68
2014 Mei YH, Cao Y, Chen G, Li X, Lu GQ, Chen X. Characterization and reliability of sintered nanosilver joints by a rapid current-assisted method for power electronics packaging Ieee Transactions On Device and Materials Reliability. 14: 262-267. DOI: 10.1109/TDMR.2013.2278979  0.68
2014 Fu S, Mei Y, Li X, Lu GQ. Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging Proceedings of the Electronic Packaging Technology Conference, Eptc. 90-96. DOI: 10.1109/ICEPT.2014.6922606  0.68
2014 Berry D, Jiang L, Mei Y, Luo S, Ngo K, Lu GQ. Packaging of high-temperature planar power modules interconnected by low-temperature sintering of nanosilver paste 2014 International Conference On Electronics Packaging, Icep 2014. 549-554. DOI: 10.1109/ICEP.2014.6826739  0.68
2014 Lu GQ, Li W, Mei Y, Li X. Measurements of electrical resistance and temperature distribution during current assisted sintering of nanosilver die-attach material 2014 International Conference On Electronics Packaging, Icep 2014. 538-543. DOI: 10.1109/ICEP.2014.6826737  0.68
2014 Chen G, Yu L, Mei Y, Li X, Chen X, Lu GQ. Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging Materials Science and Engineering A. 591: 121-129. DOI: 10.1016/j.msea.2013.10.091  0.68
2014 Chen G, Zhang ZS, Mei YH, Li X, Yu DJ, Wang L, Chen X. Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint Mechanics of Materials. 72: 61-71. DOI: 10.1016/j.mechmat.2014.02.001  0.68
2014 Fu S, Mei Y, Lu GQ, Li X, Chen G, Chen X. Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packaging Materials Letters. 128: 42-45. DOI: 10.1016/j.matlet.2014.04.127  0.68
2014 Chen G, Yu L, Mei YH, Li X, Chen X, Lu GQ. Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging Journal of Materials Processing Technology. 214: 1900-1908. DOI: 10.1016/j.jmatprotec.2014.04.007  0.68
2014 Tan Y, Li X, Chen G, Mei Y, Chen X. Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep Journal of Electronic Materials. 44: 761-769. DOI: 10.1007/s11664-014-3553-z  0.68
2014 Mei Y, Lian J, Xu Q, Li X, Chen X, Cheng W. Strength and reliability of nanosilver paste bonding double-sided packaged IGBT assemblies Jixie Qiangdu/Journal of Mechanical Strength. 36: 352-356.  0.68
2013 Mei Y, Cao Y, Chen G, Li X, Lu GQ, Chen X. Rapid sintering nanosilver joint by pulse current for power electronics packaging Ieee Transactions On Device and Materials Reliability. 13: 258-265. DOI: 10.1109/TDMR.2012.2237552  0.68
2013 Lu GQ, Yang W, Mei Y, Li X, Chen G, Chen X. Effects of DC bias and spacing on migration of sintered nanosilver at high temperatures for power electronic packaging Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 925-930. DOI: 10.1109/ICEPT.2013.6756612  0.68
2013 Lu GQ, Wang M, Mei Y, Li X, Wang L, Chen G, Chen X. An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 870-878. DOI: 10.1109/ICEPT.2013.6756601  0.68
2013 Mei Y, Chen G, Li X, Lu GQ, Chen X. Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste Soldering and Surface Mount Technology. 25: 107-116. DOI: 10.1108/09540911311309077  0.68
2013 Li X, Chen G, Wang L, Mei YH, Chen X, Lu GQ. Creep properties of low-temperature sintered nano-silver lap shear joints Materials Science and Engineering A. 579: 108-113. DOI: 10.1016/j.msea.2013.05.001  0.68
2013 Chen G, Zhang ZS, Mei YH, Li X, Lu GQ, Chen X. Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging Microelectronics Reliability. 53: 645-651. DOI: 10.1016/j.microrel.2012.11.011  0.68
2013 Li X, Chen G, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force Microelectronics Reliability. 53: 174-181. DOI: 10.1016/j.microrel.2012.07.028  0.68
2013 Mei Y, Chen G, Cao Y, Li X, Han D, Chen X. Simplification of low-temperature sintering nanosilver for power electronics packaging Journal of Electronic Materials. 42: 1209-1218. DOI: 10.1007/s11664-013-2561-8  0.68
2012 Yan Y, Chen X, Liu X, Mei Y, Lu GQ. Die bonding of high power 808 nm laser diodes with nanosilver paste Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4007271  0.68
2012 Chen G, Han D, Mei YH, Cao X, Wang T, Chen X, Lu GQ. Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver Ieee Transactions On Device and Materials Reliability. 12: 124-132. DOI: 10.1109/TDMR.2011.2173573  0.68
2012 Chen G, Cao Y, Mei Y, Han D, Lu GQ, Chen X. Pressure-assisted low-temperature sintering of nanosilver paste for 5×5-mm2 chip attachment Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1759-1767. DOI: 10.1109/TCPMT.2012.2214481  0.68
2012 Cao Y, Chen G, Mei Y, Li X, Lu GQ, Chen X. Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver Paste Icept-Hdp 2012 Proceedings - 2012 13th International Conference On Electronic Packaging Technology and High Density Packaging. 310-317. DOI: 10.1109/ICEPT-HDP.2012.6474625  0.68
2012 Lian J, Mei Y, Chen X, Li X, Chen G, Zhou K. Low-temperature sintering of nanoscale silver paste for double-sided attaching 9×9 mm2 chip Icept-Hdp 2012 Proceedings - 2012 13th International Conference On Electronic Packaging Technology and High Density Packaging. 232-237. DOI: 10.1109/ICEPT-HDP.2012.6474608  0.68
2012 Li X, Chen G, Chen X, Lu GQ, Wang L, Mei YH. Mechanical property evaluation of nano-Silver paste sintered joint using lap-Shear test Soldering and Surface Mount Technology. 24: 120-126. DOI: 10.1108/09540911211214695  0.68
2012 Mei Y, Chen G, Lu GQ, Chen X. Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly International Journal of Adhesion and Adhesives. 35: 88-93. DOI: 10.1016/j.ijadhadh.2011.12.010  0.68
2012 Mei Y, Wang T, Cao X, Chen G, Lu GQ, Chen X. Transient thermal impedance measurements on low-temperature-sintered nanoscale silver joints Journal of Electronic Materials. 41: 3152-3160. DOI: 10.1007/s11664-012-2233-0  0.68
2012 Chen G, Sun XH, Nie P, Mei YH, Lu GQ, Chen X. High-temperature creep behavior of low-temperature-sintered nano-silver paste films Journal of Electronic Materials. 41: 782-790. DOI: 10.1007/s11664-012-1903-2  0.68
2011 Mei Y, Lu GQ, Chen X, Luo S, Ibitayo D. Migration of sintered nanosilver die-attach material on alumina substrate between 250 °c and 400 °c in dry air Ieee Transactions On Device and Materials Reliability. 11: 316-322. DOI: 10.1109/TDMR.2010.2064775  0.68
2011 Mei Y, Lu GQ, Chen X, Luo S, Ibitayo D. Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material Ieee Transactions On Device and Materials Reliability. 11: 312-315. DOI: 10.1109/TDMR.2010.2056372  0.68
2011 Mei Y, Ibitayo D, Chen X, Luo S, Lu GQ. Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures Icept-Hdp 2011 Proceedings - 2011 International Conference On Electronic Packaging Technology and High Density Packaging. 787-792. DOI: 10.1109/ICEPT.2011.6066949  0.68
2011 Mei Y, Lu GQ, Chen X, Gang C, Luo S, Ibitayo D. Investigation of post-etch copper residue on direct bonded copper (DBC) substrates Journal of Electronic Materials. 40: 2119-2125. DOI: 10.1007/s11664-011-1716-8  0.68
2009 Mei Y, Chen X, Gao H. Hygrothermal effects on the tensile properties of anisotropic conductive films Journal of Electronic Materials. 38: 2415-2426. DOI: 10.1007/s11664-009-0893-1  0.68
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