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Robert Keller, Ph.D. - Publications

Affiliations: 
National Institute of Standards and Technology, Gaithersburg, MD, United States 
Area:
materials science, electron microscopy
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63 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Caplins BW, Holm JD, White RM, Keller RR. Orientation mapping of graphene using 4D STEM-in-SEM. Ultramicroscopy. 219: 113137. PMID 33096294 DOI: 10.1016/j.ultramic.2020.113137  0.777
2019 Caplins BW, White RM, Holm JD, Keller RR. A Workflow for Imaging 2D Materials using 4D STEM-in-SEM Microscopy and Microanalysis. 25: 218-219. DOI: 10.1017/S143192761900182X  0.727
2019 Caplins BW, Holm JD, Keller RR. Orientation mapping of graphene in a scanning electron microscope Carbon. 149: 400-406. DOI: 10.1016/J.Carbon.2019.04.042  0.789
2018 Caplins BW, Holm JD, Keller RR. Transmission imaging with a programmable detector in a scanning electron microscope. Ultramicroscopy. 196: 40-48. PMID 30278316 DOI: 10.1016/J.Ultramic.2018.09.006  0.802
2018 Caplins BW, Holm JD, Keller RR. Developing a Programmable STEM Detector for the Scanning Electron Microscope Microscopy and Microanalysis. 24: 658-659. DOI: 10.1017/S1431927618003781  0.785
2017 Holm J, Keller RR. Acceptance Angle Control for Improved Transmission Imaging in an SEM. Microscopy Today. 25: 12-19. PMID 29375278 DOI: 10.1017/S1551929516001267  0.73
2017 Keller RR. 2015 NIST Workshop on Analytical Transmission Scanning Electron Microscopy Microscopy and Microanalysis. 23: 598-599. DOI: 10.1017/s1431927617003671  0.46
2016 Rice KP, Chen Y, Keller RR, Stoykovich MP. Beam broadening in transmission and conventional EBSD. Micron (Oxford, England : 1993). 95: 42-50. PMID 28192763 DOI: 10.1016/J.Micron.2016.12.007  0.721
2016 Woehl T, Keller R. Dark-field image contrast in transmission scanning electron microscopy: Effects of substrate thickness and detector collection angle. Ultramicroscopy. 171: 166-176. PMID 27690347 DOI: 10.1016/J.Ultramic.2016.08.008  0.699
2016 Holm J, Keller RR. Angularly-selective transmission imaging in a scanning electron microscope. Ultramicroscopy. 167: 43-56. PMID 27179301 DOI: 10.1016/J.Ultramic.2016.05.001  0.765
2016 Woehl TJ, White RM, Keller RR. Dark-Field Scanning Transmission Ion Microscopy via Detection of Forward-Scattered Helium Ions with a Microchannel Plate. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 1-7. PMID 27153003 DOI: 10.1017/S1431927616000775  0.77
2016 Wagner R, Woehl TJ, Keller RR, Killgore JP. Detection of atomic force microscopy cantilever displacement with a transmitted electron beam Applied Physics Letters. 109. DOI: 10.1063/1.4960192  0.686
2015 White RM, Keller RR. Restoration of firearm serial numbers with electron backscatter diffraction (EBSD). Forensic Science International. 249: 266-70. PMID 25747326 DOI: 10.1016/j.forsciint.2015.02.003  0.732
2015 Rice KP, Keller RR, Stoykovich MP. Beam Broadening in Transmission EBSD Microscopy Today. 23: 32-37. DOI: 10.1017/S1551929515000048  0.654
2015 Holm J, Keller R. Analytical Transmission Scanning Electron Microscopy: Extending the Capabilities of a Conventional SEM Using an Off-the-Shelf Transmission Detector Microscopy and Microanalysis. 21: 1867-1868. DOI: 10.1017/S1431927615010119  0.789
2015 White RM, Keller RR. Firearm Serial Number Restoration with Electron Backscatter Diffraction Microscopy and Microanalysis. 21: 1363-1364. DOI: 10.1017/S1431927615007606  0.737
2015 Woehl T, Holm J, Keller R. An Analytical Scattering Model for Low Energy Annular Dark Field Transmission Scanning Electron Microscopy Microscopy and Microanalysis. 21: 1263-1264. DOI: 10.1017/S1431927615007102  0.786
2014 Rice KP, Keller RR, Stoykovich MP. Specimen-thickness effects on transmission Kikuchi patterns in the scanning electron microscope. Journal of Microscopy. 254: 129-36. PMID 24660836 DOI: 10.1111/Jmi.12124  0.727
2014 Rice KP, Keller RR. Thickness-dependent beam broadening in transmission EBSD Microscopy and Microanalysis. 20: 854-855. DOI: 10.1017/S1431927614005996  0.661
2013 Miller DL, Keller MW, Shaw JM, Rice KP, Keller RR, Diederichsen KM. Giant secondary grain growth in Cu films on sapphire Aip Advances. 3. DOI: 10.1063/1.4817829  0.679
2013 Geiss RH, Rice KP, Keller RR. Transmission EBSD in the Scanning Electron Microscope Microscopy Today. 21: 16-20. DOI: 10.1017/S1551929513000503  0.741
2013 Geiss R, Rice K, Keller R. New Measurements on the Minimum and Maximum Sample Sizes in t-EBSD Microscopy and Microanalysis. 19: 696-697. DOI: 10.1017/S1431927613005473  0.641
2012 Miller DL, Keller MW, Shaw JM, Chiaramonti AN, Keller RR. Epitaxial (111) films of Cu, Ni, and Cu xNi y on α-Al 2O 3 (0001) for graphene growth by chemical vapor deposition Journal of Applied Physics. 112. DOI: 10.1063/1.4754013  0.32
2012 Shaviv R, Harm GJ, Kumari S, Keller RR, Read DT. Electromigration of Cu interconnects under AC and DC test conditions Microelectronic Engineering. 92: 111-114. DOI: 10.1016/J.Mee.2011.05.014  0.54
2011 Strus MC, Chiaramonti AN, Kim YL, Jung YJ, Keller RR. Accelerated reliability testing of highly aligned single-walled carbon nanotube networks subjected to DC electrical stressing. Nanotechnology. 22: 265713. PMID 21586818 DOI: 10.1088/0957-4484/22/26/265713  0.753
2011 KELLER R, GEISS R. Transmission EBSD from 10 nm domains in a scanning electron microscope Journal of Microscopy. 245: 245-251. DOI: 10.1111/j.1365-2818.2011.03566.x  0.404
2011 Geiss R, Keller R, Sitzman S, Rice P. New Method of Transmission Electron Diffraction to Characterize Nanomaterials in the SEM Microscopy and Microanalysis. 17: 386-387. DOI: 10.1017/S1431927611002807  0.512
2010 Geiss R, Keller R, Read D. Transmission Electron Diffraction From Nanoparticles, Nanowires and Thin Films in an SEM With Conventional EBSD Equipment Microscopy and Microanalysis. 16: 1742-1743. DOI: 10.1017/S1431927610062227  0.648
2007 Read DT, Keller RR, Barbosa N, Geiss R. Nanoindentation Round Robin on Thin Film Copper on Silicon Metallurgical and Materials Transactions A. 38: 2242-2248. DOI: 10.1007/S11661-007-9177-7  0.689
2007 Barbosa N, Keller R, Read D, Geiss R, Vinci R. Comparison of Electrical and Microtensile Evaluations of Mechanical Properties of an Aluminum Film Metallurgical and Materials Transactions A. 38: 2160-2167. DOI: 10.1007/S11661-007-9112-Y  0.688
2007 Keller R, Geiss R, Barbosa N, Slifka A, Read D. Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects Metallurgical and Materials Transactions A. 38: 2263-2272. DOI: 10.1007/S11661-006-9017-1  0.682
2005 Geiss R, Keller R, Read D, Cheng Y. TEM-Based Analysis of Defects Induced by AC Thermomechanical versus Microtensile Deformation in Aluminum Thin Films Mrs Proceedings. 863. DOI: 10.1557/PROC-863-B7.2/O11.2  0.641
2005 Geiss RH, Read DT, Keller RR. TEM Study of Dislocation Loops in Deformed Aluminum Films Microscopy and Microanalysis. 11. DOI: 10.1017/S1431927605508626  0.599
2005 Geiss RH, Read DT, Roshko A, Bertness KA, Keller RR. Applications of EBSD to the Study of Localized Deformation Microscopy and Microanalysis. 11. DOI: 10.1017/S1431927605508560  0.542
2004 Mönig R, Keller RR, Volkert CA. Thermal fatigue testing of thin metal films Review of Scientific Instruments. 75: 4997-5004. DOI: 10.1063/1.1809260  0.26
2004 Josell D, Burkhard C, Li Y, Cheng YW, Keller RR, Witt CA, Kelley DR, Bonevich JE, Baker BC, Moffat TP. Electrical properties of superfilled sub-micrometer silver metallizations Journal of Applied Physics. 96: 759-768. DOI: 10.1063/1.1757655  0.285
2001 Read DT, Cheng Y, McColskey JD, Keller RR. Mechanical Behavior of Contact Aluminum Alloy Mrs Proceedings. 695. DOI: 10.1557/Proc-695-L6.11.1  0.636
2001 Read DT, Cheng Y, Keller RR, McColskey J. Tensile properties of free-standing aluminum thin films Scripta Materialia. 45: 583-589. DOI: 10.1016/S1359-6462(01)01067-3  0.576
2000 Nucci JA, Keller RR, Krämer S, Volkert CA, Gross ME. Localized Measurement of Strains in Damascene Copper Interconnects by Convergent-Beam Electron Diffraction Mrs Proceedings. 612. DOI: 10.1557/PROC-612-D8.5.1  0.352
2000 Spolenak R, Barr DL, Gross ME, Evans-Lutterodt K, Brown WL, Tamura N, Macdowell AA, Celestre RS, Padmore HA, Valek BC, Bravman JC, Flinn P, Marieb T, Keller RR, Batterman BW, et al. Microtexture and Strain in Electroplated Copper Interconnects Mrs Proceedings. 612. DOI: 10.1557/Proc-612-D10.3.1  0.388
1999 Kalnas CE, Keller RR, Phelps JM, Marieb TN. Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects+ Mrs Proceedings. 563. DOI: 10.1557/PROC-563-219  0.261
1999 Keller RR, Kalnas CE, Phelps JM. Local crystallography and stress voiding in Al–Si–Cu versus copper interconnects Journal of Applied Physics. 86: 1167-1169. DOI: 10.1063/1.370860  0.216
1997 Nucci JA, Keller RR, Field DP, Shacham-Diamand Y. Grain boundary misorientation angles and stress-induced voiding in oxide passivated copper interconnects Applied Physics Letters. 70: 1242-1244. DOI: 10.1063/1.118942  0.244
1997 Keller RR, Nucci JA, Field DP. Local textures and grain boundaries in voided copper interconnects Journal of Electronic Materials. 26: 996-1001. DOI: 10.1007/s11664-997-0236-z  0.24
1996 Keller RR, Phelps JM. Scanning electron microscopy observations of misfit dislocations in epitaxial In0.25Ga0.75As on GaAs(001) Journal of Materials Research. 11: 552-554. DOI: 10.1557/JMR.1996.0067  0.42
1996 Maier HJ, Keller RR, Renner H, Mughrabi H, Preston A. On the unique evaluation of local lattice parameters by convergent-beam electron diffraction Philosophical Magazine A. 74: 23-43. DOI: 10.1080/01418619608239688  0.37
1996 Nucci JA, Keller RR, Sanchez JE, Shacham‐Diamand Y. Local crystallographic texture and voiding in passivated copper interconnects Applied Physics Letters. 69: 4017-4019. DOI: 10.1063/1.117856  0.225
1996 Keller RR, Phelps JM, Read DT. Tensile and fracture behavior of free-standing copper films Materials Science and Engineering A. 214: 42-52. DOI: 10.1016/0921-5093(96)10253-7  0.609
1994 Keller RR, Phelps JM, Read DT. Tensile Deformation-Induced Microstructures in Freestanding Copper Thin Films Mrs Proceedings. 338. DOI: 10.1557/Proc-338-227  0.617
1994 Keller RR, Maier HJ, Renner H, Mughrabi H. Local internal stress characterization in a tensile-deformed copper single crystal by convergent-beam electron diffraction Philosophical Magazine a: Physics of Condensed Matter, Structure, Defects and Mechanical Properties. 70: 329-340. DOI: 10.1080/01418619408243188  0.584
1993 Keller RR, Maier HJ, Mughrabi H. Characterization of interfacial dislocation networks in a creep-deformed nickel-base superalloy Scripta Metallurgica Et Materiala. 28: 23-28. DOI: 10.1016/0956-716X(93)90531-V  0.532
1993 Zielinski W, Keller R, Gerberich W. Heterogeneous dislocation loop nucleation and free surface effects on plastic deformation: an in situ transmission electron microscopy study Materials Science and Engineering: A. 164: 196-200. DOI: 10.1016/0921-5093(93)90661-W  0.577
1993 Katz Y, Keller RR, Huang H, Gerberich WW. A dislocation shielding model for the fracture of semibrittle polycrystals Metallurgical Transactions A. 24: 343-350. DOI: 10.1007/BF02657321  0.427
1992 Keller RR, Maier HJ, Renner H, Mughrabi H. Local lattice parameter measurements in a creep-deformed nickel-base superalloy by convergent beam electron diffraction Scripta Metallurgica Et Materiala. 27: 1167-1172. DOI: 10.1016/0956-716X(92)90593-4  0.608
1992 Keller R, Zielinski W, Gerberich W. Fatigue-induced surface versus bulk dislocation arrangements in iron alloys Scripta Metallurgica Et Materialia. 26: 1523-1528. DOI: 10.1016/0956-716X(92)90250-I  0.436
1991 Gerberich W, Angelo J, Keller R, Wowchak A, Cohen P. Strains and Relaxations Near metal Alumlnide/Semiconductor Interfaces Mrs Proceedings. 226. DOI: 10.1557/PROC-226-279  0.544
1991 Kozubowski JA, Keller RR, Gerberich WW. Effects of tetragonal distortion in thin expitaxic films on electron channeling patterns in scanning electron microscopy Journal of Applied Crystallography. 24: 102-107. DOI: 10.1107/S0021889890010834  0.597
1991 Keller RR, Wowchak AM, Angelo JE, Kuznia JN, Cohen PI, Gerberich WW. Growth and characterization of iron aluminide films on compound semiconductors Journal of Electronic Materials. 20: 319-324. DOI: 10.1007/BF02657898  0.453
1990 Keller RR, Angelo JE, Wowchak AM, Cohen PI, Gerberich WW. Electron Channeling Analysis of Strained Iron Aluminide Films Mrs Proceedings. 208. DOI: 10.1557/PROC-208-205  0.558
1990 Kozubowski JA, Keller R, Gerberich WW. Calibration of SEM voltage using electron channeling patterns of silicon Scanning. 12: 134-139. DOI: 10.1002/Sca.4950120304  0.578
1989 Keller R, Zielinski W, Gerberich W, Kozubowski J. Electron Channeling Analysis of Elastic Strains in InGaAs Thin Films Mrs Proceedings. 160. DOI: 10.1557/Proc-160-159  0.586
1989 Keller R, Zielinski W, Gerberich W. On the onset of low-energy dislocation substructures in fatigue: Grain size effects Materials Science and Engineering: A. 113: 267-280. DOI: 10.1016/0921-5093(89)90315-8  0.557
1989 Keller R, Gerberich W. Surface versus bulk deformation in fatigue Scripta Metallurgica. 23: 1115-1120. DOI: 10.1016/0036-9748(89)90310-4  0.543
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