| Year |
Citation |
Score |
| 2018 |
Vaitheeswaran PK, Subbarayan G. Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model Journal of Electronic Packaging. 140: 20901. DOI: 10.1115/1.4039136 |
0.303 |
|
| 2018 |
Song T, Chen C, Subbarayan G, Lin H, Gurrum S. Estimating the Modulus and Yield Strength of the Top-Layer Film on Multilayer BEOL Stacks Ieee Transactions On Device and Materials Reliability. 18: 438-449. DOI: 10.1109/Tdmr.2018.2865904 |
0.43 |
|
| 2016 |
Upreti K, Lin HY, Subbarayan G, Jung DY, Sammakia BG. An Assessment of Risk of Fracture during Wirebond over Active Circuits on ULK Dies Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 314-325. DOI: 10.1109/Tcpmt.2015.2466679 |
0.504 |
|
| 2016 |
Song T, Subbarayan G, Lin HY, Gurrum S. Estimation of passivated metal stack modulus through simulations of Micro-indentation Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1326-1332. DOI: 10.1109/ITHERM.2016.7517702 |
0.422 |
|
| 2015 |
Morgan OT, Upreti K, Subbarayan G, Anderson DC. HiGeoM: A symbolic framework for a unified function space representation of trivariate solids for isogeometric analysis Cad Computer Aided Design. 65: 34-50. DOI: 10.1016/j.cad.2015.03.005 |
0.756 |
|
| 2015 |
Lin HY, Rayasam M, Subbarayan G. ISOCOMP: Unified geometric and material composition for optimal topology design Structural and Multidisciplinary Optimization. 51: 687-703. DOI: 10.1007/S00158-014-1164-1 |
0.784 |
|
| 2014 |
Upreti K, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage and fracture in ULK under pad structures during Cu wirebond process Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 609-615. DOI: 10.1109/ITHERM.2014.6892337 |
0.5 |
|
| 2014 |
Paranjothy SS, Singh Y, Tippman A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Characterization of cu free air ball constitutive behavior using microscale compression test Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 365-368. DOI: 10.1109/ITHERM.2014.6892303 |
0.504 |
|
| 2014 |
Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys Microelectronics Reliability. 54: 2513-2522. DOI: 10.1016/J.Microrel.2014.04.012 |
0.819 |
|
| 2013 |
Upreti K, Subbarayan G. Algebraic distance field for meshless analysis of free form CAD models Computer-Aided Design and Applications. 10: 427-443. DOI: 10.3722/Cadaps.2013.427-443 |
0.313 |
|
| 2013 |
Lin HY, Upreti K, Tippmann A, Subbarayan G, Jung DY, Sammakia B. Simulations of deformation and stress during copper wirebond on ULK chips Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 1. DOI: 10.1115/IPACK2013-73178 |
0.526 |
|
| 2013 |
Dan B, Sammakia BG, Subbarayan G, Kanuparthi S. An improved efficient network model for determining the effective thermal conductivity of particulate thermal interface materials Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4024392 |
0.337 |
|
| 2013 |
Chan D, Nie X, Bhate D, Subbarayan G, Chen WW, Dutta I. Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 133-146. DOI: 10.1109/Tcpmt.2012.2211022 |
0.747 |
|
| 2013 |
Chavali S, Singh Y, Subbarayan G, Bansal A, Ahmad M. Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys Microelectronics Reliability. 53: 892-898. DOI: 10.1016/J.Microrel.2013.02.006 |
0.417 |
|
| 2013 |
Udupa A, Subbarayan G, Koh CK. Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias Microelectronics Reliability. 53: 63-69. DOI: 10.1016/J.Microrel.2012.09.006 |
0.326 |
|
| 2013 |
Lin HY, Subbarayan G. Optimal topological design through insertion and configuration of finite-sized heterogeneities International Journal of Solids and Structures. 50: 429-446. DOI: 10.1016/J.Ijsolstr.2012.10.006 |
0.52 |
|
| 2012 |
Morgan OT, Subbarayan G, Anderson DC. A hybrid hierarchical procedure for composing trivariate NURBS solids Computer-Aided Design and Applications. 9: 215-226. DOI: 10.3722/Cadaps.2012.215-226 |
0.764 |
|
| 2012 |
Sadasiva S, Subbarayan G, Jiang L, Pantuso D. Numerical simulations of electromigration and stressmigration driven void evolution in solder interconnects Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4006707 |
0.359 |
|
| 2012 |
Tambat A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage, crack initiation, and propagation in interlayer dielectric structures: Understanding assembly-induced fracture in dies Ieee Transactions On Device and Materials Reliability. 12: 241-254. DOI: 10.1109/Tdmr.2012.2195006 |
0.53 |
|
| 2012 |
Kumar P, Huang Z, Chavali SC, Chan DK, Dutta I, Subbarayan G, Gupta V. Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 256-265. DOI: 10.1109/Tcpmt.2011.2173494 |
0.775 |
|
| 2012 |
Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Maximum entropy fracture model and fatigue fracture of mixed SnPb/Sn3.0Ag0.5Cu solder alloys Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 870-879. DOI: 10.1109/ITHERM.2012.6231518 |
0.79 |
|
| 2012 |
Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Maximum entropy fracture model and its use for predicting cyclic hysteresis in solder alloys Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 207-215. DOI: 10.1109/ITHERM.2012.6231432 |
0.787 |
|
| 2012 |
Bhate D, Mysore K, Subbarayan G. An information theoretic argument on the form of damage accumulation in solids Mechanics of Advanced Materials and Structures. 19: 184-195. DOI: 10.1080/15376494.2011.572246 |
0.706 |
|
| 2012 |
Srinivasan K, Subbarayan G, Siegmund T. Wrinkling on irreversibly deforming foundations Thin Solid Films. 520: 5671-5682. DOI: 10.1016/J.Tsf.2012.04.071 |
0.333 |
|
| 2012 |
Bajaj N, Subbarayan G, Garimella SV. Topological design of channels for squeeze flow optimization of thermal interface materials International Journal of Heat and Mass Transfer. 55: 3560-3575. DOI: 10.1016/J.Ijheatmasstransfer.2012.03.020 |
0.321 |
|
| 2012 |
Tambat A, Subbarayan G. Isogeometric enriched field approximations Computer Methods in Applied Mechanics and Engineering. 245: 1-21. DOI: 10.1016/J.Cma.2012.06.006 |
0.404 |
|
| 2012 |
Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys Journal of Electronic Materials. 41: 800-800. DOI: 10.1007/S11664-012-1993-X |
0.588 |
|
| 2012 |
Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Constitutive behavior of mixed Sn-Pb/Sn-3.0Ag-0.5Cu solder alloys Journal of Electronic Materials. 41: 596-610. DOI: 10.1007/S11664-011-1812-9 |
0.806 |
|
| 2012 |
Chan D, Subbarayan G, Nguyen L. Maximum-entropy principle for modeling damage and fracture in solder joints : Enabling life predictions under microstructural uncertainty Journal of Electronic Materials. 41: 398-411. DOI: 10.1007/S11664-011-1804-9 |
0.442 |
|
| 2011 |
Lin HY, Tambat A, Claydon I, Subbarayan G, Jung DY, Sammakia B. Nature of package-induced deformation and the risk of fracture in low-k dielectric stacks Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 351-356. DOI: 10.1115/IPACK2011-52258 |
0.505 |
|
| 2011 |
Tambat A, Lin HY, Claydon I, Subbarayan G, Jung DY, Sammakia B. Modeling fracture in dielectric stacks due to chip-package interaction: Impact of dielectric material selection Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 317-323. DOI: 10.1115/IPACK2011-52237 |
0.522 |
|
| 2011 |
Goyal S, Srinivasan K, Subbarayan G, Siegmund T. Estimating the yield strength of thin metal films through elasticplastic buckling-induced debonding Ieee Transactions On Device and Materials Reliability. 11: 358-361. DOI: 10.1109/Tdmr.2011.2112362 |
0.478 |
|
| 2011 |
Mahajan SS, Subbarayan G, Sammakia BG. Estimating Kapitza resistance between Si-SiO 2 interface using molecular dynamics simulations Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1132-1139. DOI: 10.1109/Tcpmt.2011.2112356 |
0.547 |
|
| 2011 |
Mysore K, Morgan OT, Subbarayan G. NURBS representational strategies for tracking moving boundaries and topological changes during phase evolution Computer Methods in Applied Mechanics and Engineering. 200: 2594-2610. DOI: 10.1016/J.Cma.2011.04.002 |
0.759 |
|
| 2010 |
Chan D, Nie X, Bhate D, Subbarayan G, Dutta I. High strain rate behavior of Sn3.8Ag0.7Cu solder alloys and its influence on the fracture location within solder joints Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 989-995. DOI: 10.1115/InterPACK2009-89404 |
0.688 |
|
| 2010 |
Chan D, Bhate D, Subbarayan G, Zhao J, Edwards D. Predicting crack growth and fatigue lives of QFN solder joints using a multiscale fracture model Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 207-213. DOI: 10.1115/InterPACK2009-89403 |
0.709 |
|
| 2010 |
Chan D, Bhate D, Subbarayan G, Nguyen L. Characterization of crack fronts in a WLCSP package: Experiments and models for application of a multiscale fracture theory Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 199-205. DOI: 10.1115/InterPACK2009-89402 |
0.71 |
|
| 2010 |
Bhate D, Mysore K, Subbarayan G. A multiscale damage accumulation theory for solder joint failure Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 191-197. DOI: 10.1115/InterPACK2009-89399 |
0.699 |
|
| 2010 |
Chavali SC, Subbarayan G, Mysore K, Dutta I. Observations of changes in rate dependent flow of SnAgCu solder alloys due to aging Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 173-178. DOI: 10.1115/IMECE2009-11704 |
0.741 |
|
| 2010 |
Bhate D, Chan D, Subbarayan G, Nguyen L, Zhao J, Edwards D. Singularities at Solder Joint Interfaces and Their Effects on Fracture Models Journal of Electronic Packaging. 132: 21007. DOI: 10.1115/1.4001588 |
0.784 |
|
| 2010 |
Srinivasan V, Subbarayan G, Radhakrishnan S, Pantuso D, Shankar S. Hierarchical partition of unity field compositions (HPFC) for optimal design in the presence of cracks Mechanics of Advanced Materials and Structures. 17: 467-480. DOI: 10.1080/15376494.2010.508989 |
0.543 |
|
| 2010 |
Goyal S, Srinivasan K, Subbarayan G, Siegmund T. A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems Thin Solid Films. 518: 2056-2064. DOI: 10.1016/J.Tsf.2009.07.148 |
0.563 |
|
| 2010 |
Goyal S, Srinivasan K, Subbarayan G, Siegmund T. On instability-induced debond initiation in thin film systems Engineering Fracture Mechanics. 77: 1298-1313. DOI: 10.1016/J.Engfracmech.2010.02.001 |
0.562 |
|
| 2010 |
Srinivasan V, Radhakrishnan S, Subbarayan G. Coordinated synthesis of hierarchical engineering systems Computer Methods in Applied Mechanics and Engineering. 199: 392-404. DOI: 10.1016/J.Cma.2008.08.021 |
0.68 |
|
| 2009 |
Srinivasan K, Goyal S, Siegmund T, Subbarayan G, Lin Q. Thermally induced wrinkling in thin-film stacks on patterned substrates Ibm Journal of Research and Development. 53: 12:1-12:10. DOI: 10.1147/Jrd.2009.5429025 |
0.5 |
|
| 2009 |
Bhate D, Subbarayan G, Zhao J, Gupta V, Edwards D. Improved solder joint fatigue models through reduced geometry dependence of empirical fits Journal of Electronic Packaging, Transactions of the Asme. 131: 0445021-0445023. DOI: 10.1115/1.4000208 |
0.737 |
|
| 2009 |
Rayasam M, Chaparala S, Farnam D, Sammakia BG, Subbarayan G. Thermal solution maps: A strategy for thermal design of three-dimensional packages Journal of Electronic Packaging, Transactions of the Asme. 131: 0110151-0110159. DOI: 10.1115/1.3077131 |
0.771 |
|
| 2009 |
Mysore K, Subbarayan G, Gupta V, Zhang R. Constitutive and aging behavior of Sn3.0Ag0.5Cu solder alloy Ieee Transactions On Electronics Packaging Manufacturing. 32: 221-232. DOI: 10.1109/Tepm.2009.2024119 |
0.395 |
|
| 2009 |
Kanuparthi S, Rayasam M, Subbarayan G, Sammakia B, Gowda A, Tonapi S. Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials Computer Methods in Applied Mechanics and Engineering. 198: 657-668. DOI: 10.1016/J.Cma.2008.10.001 |
0.784 |
|
| 2009 |
Dutta I, Kumar P, Subbarayan G. Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties Jom. 61: 29-38. DOI: 10.1007/S11837-009-0085-8 |
0.385 |
|
| 2008 |
Bhate D, Chan D, Subbarayan G, Chiu TC, Edwards D, Gupta V. Constitutive behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu alloys at creep and low strain rate regimes Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 183-196. DOI: 10.1115/IMECE2007-44151 |
0.717 |
|
| 2008 |
Bhate D, Chan D, Subbarayan G, Nguyen L. A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints Journal of Electronic Packaging, Transactions of the Asme. 130: 0210031-0210039. DOI: 10.1115/1.2840057 |
0.73 |
|
| 2008 |
Kanuparthi S, Subbarayan G, Siegmund T, Sammakia B. An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials Ieee Transactions On Components and Packaging Technologies. 31: 611-621. DOI: 10.1109/Tcapt.2008.2001839 |
0.353 |
|
| 2008 |
Mahajan SS, Subbarayan G, Sammakia BG. Estimating Kapitza resistance between Si-SiO2 interface using molecular dynamics simulations 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1055-1062. DOI: 10.1109/ITHERM.2008.4544379 |
0.548 |
|
| 2008 |
Mysore K, Chan D, Bhate D, Subbarayan G, Dutta I, Gupta V, Zhao J, Edwards D. Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 870-875. DOI: 10.1109/ITHERM.2008.4544357 |
0.666 |
|
| 2008 |
Bhate D, Subbarayan G, Nguyen L, Zhao J. Singularities at solder joint interfaces and their effects on fracture models: Part II 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 746-750. DOI: 10.1109/ITHERM.2008.4544342 |
0.705 |
|
| 2008 |
Bhate D, Subbarayan G, Nguyen L, Zhao J. Singularities at solder joint interfaces and their effects on fracture models: Part I 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 738-745. DOI: 10.1109/ITHERM.2008.4544341 |
0.706 |
|
| 2008 |
Nie X, Bhate D, Chan D, Chen W, Subbarayan G, Dutta I. Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 -6 to 102 s-1 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 676-682. DOI: 10.1109/ITHERM.2008.4544333 |
0.653 |
|
| 2007 |
Mahajan SS, Subbarayan G, Sammakia BG. Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations. Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics. 76: 056701. PMID 18233784 DOI: 10.1103/Physreve.76.056701 |
0.597 |
|
| 2007 |
Radhakrishnan S, Subbarayan G, Nguyen L, Mazotti W. Stochastic characterization and models to predict performance uncertainty in photonic packages Journal of Electronic Packaging, Transactions of the Asme. 129: 229-235. DOI: 10.1115/1.2753885 |
0.59 |
|
| 2007 |
Bhate D, Chan D, Subbarayan G, Chiu TC, Gupta V, Edwards D. Constitutive behavior of SN3.8AG0.7CU and SN1.0AG0.5CU alloys at creep and low strain rate regimes Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 5: 183-196. DOI: 10.1109/Tcapt.2008.2001165 |
0.736 |
|
| 2007 |
Bhate D, Chan D, Subbarayan G, Nguyen L. Fatigue crack growth and life descriptions of Sn3.8Ag0.7Cu solder joints: A computational and experimental study Proceedings - Electronic Components and Technology Conference. 558-565. DOI: 10.1109/ECTC.2007.373851 |
0.738 |
|
| 2007 |
Chan D, Bhate D, Subbarayan G, Love D, Sullivan R. Effects of dwell time on the fatigue life of Sn3.8AgO.7Cu and Sn3.0Ag0.5Cu solder joints during simulated power cycling Proceedings - Electronic Components and Technology Conference. 227-234. DOI: 10.1109/ECTC.2007.373802 |
0.703 |
|
| 2007 |
Radhakrishnan S, Subbarayan G, Nguyen L, Mazotti W. Material behavior uncertainty in the design of bonded systems - Part II: Exhaustive materials characterization and design guidelines Materials and Design. 28: 2712-2718. DOI: 10.1016/J.Matdes.2006.10.006 |
0.556 |
|
| 2007 |
Radhakrishnan S, Subbarayan G, Nguyen L, Mazotti W. Material behavior uncertainty in the design of bonded systems - Part I: Shear displacement and stress prediction Materials and Design. 28: 2706-2711. DOI: 10.1016/J.Matdes.2006.10.005 |
0.558 |
|
| 2007 |
Luo Y, Subbarayan G. A study of multiple singularities in multi-material wedges and their use in analysis of microelectronic interconnect structures Engineering Fracture Mechanics. 74: 416-430. DOI: 10.1016/J.Engfracmech.2006.04.032 |
0.543 |
|
| 2007 |
Zhang X, Rayasam M, Subbarayan G. A meshless, compositional approach to shape optimal design Computer Methods in Applied Mechanics and Engineering. 196: 2130-2146. DOI: 10.1016/J.Cma.2006.11.008 |
0.791 |
|
| 2007 |
Rayasam M, Srinivasan V, Subbarayan G. CAD inspired hierarchical partition of unity constructions for NURBS-based, meshless design, analysis and optimization International Journal For Numerical Methods in Engineering. 72: 1452-1489. DOI: 10.1002/Nme.2046 |
0.786 |
|
| 2006 |
Littlewood D, Subbarayan G. Updating a CMYK printer model using a sparse data set Journal of Imaging Science and Technology. 50: 556-566. DOI: 10.2352/J.Imagingsci.Technol.(2006)50:6(556) |
0.331 |
|
| 2006 |
Rayasam M, Subbarayan G. A three-dimensional solder shape model incorporating top pad inclination and misalignment Journal of Electronic Packaging, Transactions of the Asme. 128: 291-293. DOI: 10.1115/1.2229232 |
0.788 |
|
| 2006 |
Rayasam M, Thompson TB, Subbarayan G, Gurumurthy C, Wilcox JR. A model for assessing the shape of solder joints in the presence of PCB and package warpage Journal of Electronic Packaging, Transactions of the Asme. 128: 184-191. DOI: 10.1115/1.2227058 |
0.787 |
|
| 2006 |
Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B. A numerical study of transport in a thermal interface material enhanced with carbon nanotubes Journal of Electronic Packaging, Transactions of the Asme. 128: 92-97. DOI: 10.1115/1.2161231 |
0.61 |
|
| 2006 |
Bhate D, Subbarayan G. A nonlinear fracture mechanics perspective on solder joint failure: Going beyond the Coffin-manson equation Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 1220-1225. DOI: 10.1109/ITHERM.2006.1645484 |
0.731 |
|
| 2006 |
Bhate D, Chan D, Subbarayan G, Chiu TC. Solder interconnection specimen design and test control procedure for valid constitutive modeling of solder alloys Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 977-983. DOI: 10.1109/ITHERM.2006.1645451 |
0.709 |
|
| 2006 |
Bhate D, Chan D, Subbarayan G. Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters 7th International Conference On Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Eurosime 2006. 2006. DOI: 10.1109/ESIME.2006.1643992 |
0.714 |
|
| 2006 |
Zhang X, Subbarayan G. JNURBS: An object-oriented, symbolic framework for integrated, meshless analysis and optimal design Advances in Engineering Software. 37: 287-311. DOI: 10.1016/J.Advengsoft.2005.08.001 |
0.349 |
|
| 2006 |
Gadag S, Subbarayan G, Barker W. Thermo-elastic properties of dense YSZ and porous Ni-ZrO 2 monolithic and isotropic materials Journal of Materials Science. 41: 1221-1232. DOI: 10.1007/S10853-005-3660-6 |
0.328 |
|
| 2005 |
Radhakrishnan S, Subbarayan G, Nguyen L, Mazotti WP. A systems approach for analyzing uncertainties in misalignment of a fiberoptic system Journal of Electronic Packaging, Transactions of the Asme. 127: 391-396. DOI: 10.1115/1.2056573 |
0.509 |
|
| 2005 |
Zhang L, Subbarayan G, Hunter BC, Rose D. Response surface models for efficient, modular estimation of solder joint reliability in area array packages Microelectronics Reliability. 45: 623-635. DOI: 10.1016/J.Microrel.2004.06.007 |
0.4 |
|
| 2005 |
Towashiraporn P, Subbarayan G, Desai CS. A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces International Journal of Solids and Structures. 42: 4468-4483. DOI: 10.1016/J.Ijsolstr.2004.12.012 |
0.411 |
|
| 2005 |
Setty K, Subbarayan G, Nguyen L. Powercycling reliability, failure analysis and acceleration factors of Pb-free solder joints Proceedings - Electronic Components and Technology Conference. 1: 907-915. |
0.304 |
|
| 2004 |
Zhang X, Subbarayan G. A constructive approach for heterogeneous material modeling and analysis Computer-Aided Design and Applications. 1: 171-178. DOI: 10.1080/16864360.2004.10738256 |
0.385 |
|
| 2004 |
Natekar D, Zhang X, Subbarayan G. Constructive solid analysis: A hierarchical, geometry-based meshless analysis procedure for integrated design and analysis Cad Computer Aided Design. 36: 473-486. DOI: 10.1016/S0010-4485(03)00129-5 |
0.352 |
|
| 2004 |
Towashiraporn P, Gall K, Subbarayan G, McIlvanie B, Hunter BC, Love D, Sullivan B. Power cycling thermal fatigue of Sn-Pb solder joints on a chip scale package International Journal of Fatigue. 26: 497-510. DOI: 10.1016/J.Ijfatigue.2003.09.004 |
0.408 |
|
| 2003 |
Mahajan S, Subbarayan G, Sammakia BG, Jones W. Molecular dynamics simulations of nanotube-polymer composites for use as thermal interface material American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 3: 381-385. DOI: 10.1115/IMECE2003-42462 |
0.566 |
|
| 2003 |
Ratanawilai TB, Hunter B, Subbarayan G, Rose D. A study on the variation of effective CTE of printed circuit boards through a validated comparison between strain gages and moiré interferometry Ieee Transactions On Components and Packaging Technologies. 26: 712-718. DOI: 10.1109/Tcapt.2003.821685 |
0.314 |
|
| 2003 |
Towashiraporn P, Subbarayan G. A hybrid fracture-damage model for computationally efficient fracture simulations in solder joints Proceedings of 5th Electronics Packaging Technology Conference, Eptc 2003. 462-469. DOI: 10.1109/EPTC.2003.1271566 |
0.31 |
|
| 2002 |
Towashiraporn P, Subbarayan G, McIlvanie B, Hunter BC, Love D, Sullivan B. Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests Soldering and Surface Mount Technology. 14. DOI: 10.1108/09540910210444737 |
0.349 |
|
| 2002 |
Towashiraporn P, Subbarayan G, McIlvanie B, Hunter BC, Love D, Sullivan B. The effect of model building on the accuracy of fatigue life predictions in electronic packages Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 854-861. DOI: 10.1016/J.Microrel.2003.08.012 |
0.369 |
|
| 2001 |
Natekar D, Subbarayan G. Computationally efficient fracture analysis of electronic packages through decomposition International Journal of Damage Mechanics. 10: 171-186. DOI: 10.1106/F9W7-Xgv5-9Pme-D5Cx |
0.318 |
|
| 2000 |
Subbarayan G, Bartel DL. A reconciliation of local and global models for bone remodeling through optimization theory. Journal of Biomechanical Engineering. 122: 72-6. PMID 10790832 DOI: 10.1115/1.429633 |
0.311 |
|
| 2000 |
Deshpande AM, Subbarayan G, Rose D. A system for first order reliability estimation of solder joints in area array packages Journal of Electronic Packaging, Transactions of the Asme. 122: 6-12. DOI: 10.1115/1.483125 |
0.35 |
|
| 2000 |
Deshpande A, Subbarayan G. LGA connectors: An automated design technique for a shrinking design space Journal of Electronic Packaging, Transactions of the Asme. 122: 247-254. DOI: 10.1115/1.1286021 |
0.327 |
|
| 2000 |
Renken FP, Subbarayan G. NURBS-based solutions to inverse boundary problems in droplet shape prediction Computer Methods in Applied Mechanics and Engineering. 190: 1391-1406. DOI: 10.1016/S0045-7825(00)00168-7 |
0.321 |
|
| 1999 |
Deshpande AM, Subbarayan G. Decomposition techniques for the efficient analysis of area-array packages American Society of Mechanical Engineers, Eep. 26: 33-39. DOI: 10.1115/1.483126 |
0.354 |
|
| 1999 |
Ramakrishna K, Sammakia B, Subbarayan G, Mirman B. Foreword contributions from the 1998 intersociety conference on thermal and thermomechanical phenomena in electronic packages Ieee Transactions On Components and Packaging Technologies. 22: 481-483. DOI: 10.1109/Tcapt.1999.814961 |
0.391 |
|
| 1999 |
Subbarayan G, Raj R. A methodology for integrating materials science with system engineering Materials and Design. 20: 1-12. DOI: 10.1016/S0261-3069(98)00048-X |
0.35 |
|
| 1998 |
Li Y, Mahajan RL, Subbarayan G. The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints Journal of Electronic Packaging, Transactions of the Asme. 120: 54-60. DOI: 10.1115/1.2792286 |
0.384 |
|
| 1998 |
Zhang L, Hunter B, Subbarayan G, Rose D. Accuracy of structural approximations employed in analysis of area array packages Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 269-276. DOI: 10.1109/6144.814968 |
0.333 |
|
| 1997 |
Renken FP, Subbarayan G. A two-body formulation for solder joint shape prediction American Society of Mechanical Engineers, Eep. 19: 1397-1405. DOI: 10.1115/1.2792637 |
0.359 |
|
| 1997 |
Subbarayan G, Ramakrishna K, Sammakia BG. The Impact of Interfacial Adhesion on PTH and Via Stress State Journal of Electronic Packaging, Transactions of the Asme. 119: 260-267. DOI: 10.1115/1.2792247 |
0.331 |
|
| 1997 |
Deshpande AM, Subbarayan G, Mahajan RL. Maximizing Solder Joint Reliability Through Optimal Shape Design Journal of Electronic Packaging. 119: 149-155. DOI: 10.1115/1.2792227 |
0.36 |
|
| 1996 |
Subbarayan G. A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints Journal of Electronic Packaging, Transactions of the Asme. 118: 127-133. DOI: 10.1115/1.2792142 |
0.38 |
|
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