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Dennis K. Chan, Ph.D. - Publications

Affiliations: 
2012 Mechanical Engineering Purdue University, West Lafayette, IN, United States 
Area:
Mechanical Engineering, Materials Science Engineering
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Srinivasan V, Braidy N, Chan EK, Xu YH, Chan DK. Genetic and Environmental Factors in Vascular Dementia: an update of blood brain barrier dysfunction. Clinical and Experimental Pharmacology & Physiology. PMID 26859837 DOI: 10.1111/1440-1681.12558  0.39
2014 Fouzder T, Chan YC, Chan DK. Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates Proceedings of the 16th Electronics Packaging Technology Conference, Eptc 2014. 69-74. DOI: 10.1109/EPTC.2014.7028281  0.341
2014 Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys Microelectronics Reliability. 54: 2513-2522. DOI: 10.1016/J.Microrel.2014.04.012  0.672
2014 Fouzder T, Li Q, Chan YC, Chan DK. Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates Journal of Materials Science: Materials in Electronics. 25: 4012-4023. DOI: 10.1007/s10854-014-2123-8  0.35
2014 Fouzder T, Li Q, Chan YC, Chan DK. Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates Journal of Materials Science: Materials in Electronics. 25: 2529-2539. DOI: 10.1007/s10854-014-1906-2  0.333
2013 Chan D, Nie X, Bhate D, Subbarayan G, Chen WW, Dutta I. Constitutive models for intermediate-and high-strain rate flow behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 133-146. DOI: 10.1109/Tcpmt.2012.2211022  0.687
2012 Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys Journal of Electronic Materials. 41: 800-800. DOI: 10.1007/S11664-012-1993-X  0.641
2012 Tucker JP, Chan DK, Subbarayan G, Handwerker CA. Constitutive behavior of mixed Sn-Pb/Sn-3.0Ag-0.5Cu solder alloys Journal of Electronic Materials. 41: 596-610. DOI: 10.1007/S11664-011-1812-9  0.667
2010 Bhate D, Chan D, Subbarayan G, Nguyen L, Zhao J, Edwards D. Singularities at Solder Joint Interfaces and Their Effects on Fracture Models Journal of Electronic Packaging. 132: 21007. DOI: 10.1115/1.4001588  0.673
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