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Yongchang Lee, Ph.D. - Publications

Affiliations: 
2013 Civil, Structural and Environmental Engineering State University of New York, Buffalo, Buffalo, NY, United States 
Area:
Materials Science Engineering, Mechanical Engineering, Civil Engineering
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Lee Y, Basaran C. Erratam: Effect of Ni solute on grain boundary diffusivity and structure of βsn (Computational Materials Science (2014) 92 (1-7)) Computational Materials Science. 96: 379. DOI: 10.1016/J.Commatsci.2014.09.023  0.534
2014 Lee Y, Basaran C. Effect of Ni solute on grain boundary diffusivity and structure of βsn Computational Materials Science. 92: 1-7. DOI: 10.1016/J.Commatsci.2014.05.008  0.539
2013 Lee Y, Basaran C. Atomic-level shear stress-strain behavior of β-sn Journal of Nanomechanics and Micromechanics. 3. DOI: 10.1061/(Asce)Nm.2153-5477.0000066  0.533
2013 Lee Y, Basaran C. A multiscale modeling technique for bridging molecular dynamics with finite element method Journal of Computational Physics. 253: 64-85. DOI: 10.1016/J.Jcp.2013.06.039  0.506
2013 Lee Y, Basaran C. Corrigendum to "molecular dynamics of viscoplasticity in β-tin lattice and grain boundary" [Comput. Mater. Sci. 68 (2013) 290-296] Computational Materials Science. 77: 467. DOI: 10.1016/J.Commatsci.2013.05.004  0.558
2013 Lee Y, Basaran C. Molecular dynamics of viscoplasticity in β-tin lattice and grain boundary Computational Materials Science. 68: 290-296. DOI: 10.1016/J.Commatsci.2012.10.029  0.564
2011 Lee Y, Basaran C. A creep model for solder alloys Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4005288  0.515
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