Year |
Citation |
Score |
2020 |
Khalili S, Rangarajan S, Gektin V, Alissa H, Sammakia B. An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads Journal of Electronic Packaging. 142. DOI: 10.1115/1.4048180 |
0.43 |
|
2020 |
Hadad Y, Fallahtafti N, Choobineh L, Hoang CH, Radmard V, Chiarot PR, Sammakia B. Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1304-1319. DOI: 10.1109/Tcpmt.2020.3005824 |
0.427 |
|
2020 |
Hadad Y, Rangararajan S, Nemati K, Ramakrishnann B, Pejman R, Chiarot PR, Sammakia B. Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds International Journal of Thermal Sciences. 148: 106145. DOI: 10.1016/J.Ijthermalsci.2019.106145 |
0.489 |
|
2019 |
Ramakrishnan B, Hadad Y, Alkharabsheh S, Chiarot PR, Sammakia B. Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers Journal of Electronic Packaging. 141: 41005. DOI: 10.1115/1.4044130 |
0.391 |
|
2019 |
Khalili S, Alissa H, Nemati K, Seymour M, Curtis R, Moss D, Sammakia B. Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design Journal of Electronic Packaging. 141: 31004. DOI: 10.1115/1.4042983 |
0.357 |
|
2019 |
Hadad Y, Ramakrishnan B, Pejman R, Rangarajan S, Chiarot PR, Pattamatta A, Sammakia B. Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Applied Thermal Engineering. 150: 720-737. DOI: 10.1016/J.Applthermaleng.2018.12.128 |
0.45 |
|
2018 |
Khalili S, Tradat MI, Nemati K, Seymour M, Sammakia B. Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles Journal of Electronic Packaging. 140: 10907. DOI: 10.1115/1.4039028 |
0.375 |
|
2017 |
Nemati K, Alissa HA, Murray BT, Schneebeli K, Sammakia B. Experimental Failure Analysis of a Rear Door Heat Exchanger With Localized Containment Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 882-892. DOI: 10.1109/Tcpmt.2017.2682863 |
0.45 |
|
2016 |
Chen C, Geer J, Sammakia B. A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction Journal of Electronic Packaging. 138: 41008. DOI: 10.1115/1.4034856 |
0.377 |
|
2016 |
Al-Momani ES, Khasawneh MT, Sammakia B. An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics Under In-Field Conditions Ieee Transactions On Device and Materials Reliability. 16: 532-540. DOI: 10.1109/Tdmr.2016.2606884 |
0.738 |
|
2015 |
Alkharabsheh S, Fernandes J, Gebrehiwot B, Agonafer D, Ghose K, Ortega A, Joshi Y, Sammakia B. A brief overview of recent developments in thermal management in data centers Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031326 |
0.329 |
|
2015 |
Gao T, Geer J, Sammakia B. Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations Journal of Thermal Science and Engineering Applications. 7: 41017. DOI: 10.1115/1.4031222 |
0.459 |
|
2015 |
Gao T, Sammakia B, Samadiani E, Schmidt R. Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers Journal of Electronic Packaging. 137: 21007. DOI: 10.1115/1.4029163 |
0.427 |
|
2015 |
Gao T, Geer J, Sammakia B. Development and verification of compact transient heat exchanger models using transient effectiveness methodologies International Journal of Heat and Mass Transfer. 87: 265-278. DOI: 10.1016/J.Ijheatmasstransfer.2015.03.091 |
0.465 |
|
2015 |
Gao T, Sammakia B, Geer J. Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate conditions International Journal of Heat and Mass Transfer. 81: 542-553. DOI: 10.1016/J.Ijheatmasstransfer.2014.10.046 |
0.47 |
|
2015 |
Gao T, David M, Geer J, Schmidt R, Sammakia B. Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility Energy and Buildings. 91: 83-96. DOI: 10.1016/J.Enbuild.2015.01.028 |
0.411 |
|
2015 |
Gao T, Murray B, Sammakia B. Analysis of transient and hysteresis behavior of cross-flow heat exchangers under variable fluid mass flow rate for data center cooling applications Applied Thermal Engineering. 84: 15-26. DOI: 10.1016/J.Applthermaleng.2015.03.044 |
0.48 |
|
2014 |
Gao T, Sammakia BG, F. Geer J, Ortega A, Schmidt R. Dynamic Analysis of Cross Flow Heat Exchangers in Data Centers Using Transient Effectiveness Method Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1925-1935. DOI: 10.1109/Tcpmt.2014.2369256 |
0.357 |
|
2014 |
Gao T, Sammakia BG, Murray BT, Ortega A, Schmidt R. Cross Flow Heat Exchanger Modeling of Transient Temperature Input Conditions Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1796-1807. DOI: 10.1109/Tcpmt.2014.2356202 |
0.386 |
|
2014 |
Gao T, Geer J, Sammakia B. Nonuniform temperature boundary condition effects on data center cross flow heat exchanger dynamic performance International Journal of Heat and Mass Transfer. 79: 1048-1058. DOI: 10.1016/J.Ijheatmasstransfer.2014.09.011 |
0.491 |
|
2014 |
Chen C, Geer J, Sammakia B. Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 79: 666-675. DOI: 10.1016/J.Ijheatmasstransfer.2014.08.052 |
0.416 |
|
2014 |
Song Z, Murray BT, Sammakia B. Long-term transient thermal analysis using compact models for data center applications International Journal of Heat and Mass Transfer. 71: 69-78. DOI: 10.1016/J.Ijheatmasstransfer.2013.12.007 |
0.454 |
|
2014 |
Song Z, Murray BT, Sammakia B. Numerical investigation of inter-zonal boundary conditions for data center thermal analysis International Journal of Heat and Mass Transfer. 68: 649-658. DOI: 10.1016/J.Ijheatmasstransfer.2013.09.073 |
0.44 |
|
2014 |
Song Z, Murray BT, Sammakia B. A dynamic compact thermal model for data center analysis and control using the zonal method and artificial neural networks Applied Thermal Engineering. 62: 48-57. DOI: 10.1016/J.Applthermaleng.2013.09.006 |
0.398 |
|
2013 |
Alzoubi K, Choi G, Hamasha MM, Alkhazali AS, Defranco J, Lu S, Sammakia B, Westgate C. Comparisons of the mechanical behaviors of poly(3,4-ethylenedioxythiophene) (PEDOT) and ITO on flexible substrates Materials Research Society Symposium Proceedings. 1493: 127-132. DOI: 10.1557/Opl.2013.228 |
0.543 |
|
2013 |
Chauhan A, Sammakia B, Afram FF, Ghose K, Refai-Ahmed G, Agonafer D. Solving thermal issues in a three-dimensional-stacked-quad-core processor by microprocessor floor planning, microchannel cooling, and insertion of through-silicon-vias Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4025531 |
0.548 |
|
2013 |
Song Z, Murray BT, Sammakia B. A Compact Thermal Model for Data Center Analysis using the Zonal Method Numerical Heat Transfer Part a-Applications. 64: 361-377. DOI: 10.1080/10407782.2013.784138 |
0.412 |
|
2013 |
Song Z, Murray BT, Sammakia B. Airflow and temperature distribution optimization in data centers using artificial neural networks International Journal of Heat and Mass Transfer. 64: 80-90. DOI: 10.1016/J.Ijheatmasstransfer.2013.04.017 |
0.351 |
|
2013 |
Pisipati S, Chen C, Geer J, Sammakia B, Murray BT. Multiscale thermal device modeling using diffusion in the Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 64: 286-303. DOI: 10.1016/J.Ijheatmasstransfer.2013.04.011 |
0.742 |
|
2012 |
Zheng LY, Farnam DS, Homentcovschi D, Sammakia BG. A porous elastic model for bacterial biofilms: application to the simulation of deformation of bacterial biofilms under microfluidic jet impingement. Journal of Biomechanical Engineering. 134: 051003. PMID 22757491 DOI: 10.1115/1.4006683 |
0.738 |
|
2012 |
Tambat A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage, crack initiation, and propagation in interlayer dielectric structures: Understanding assembly-induced fracture in dies Ieee Transactions On Device and Materials Reliability. 12: 241-254. DOI: 10.1109/Tdmr.2012.2195006 |
0.308 |
|
2012 |
Ibrahim M, Bhopte S, Sammakia B, Murray B, Iyengar M, Schmidt R. Effect of transient boundary conditions and detailed thermal modeling of data center rooms Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 300-310. DOI: 10.1109/Tcpmt.2011.2175926 |
0.803 |
|
2012 |
Alzoubi K, Hamasha MM, Wang L, Zhang H, Yin J, Luo J, Lu S, Sammakia B, Poliks M, Zhong CJ. Stability of interdigitated microelectrodes of flexible chemiresistor sensors Ieee/Osa Journal of Display Technology. 8: 377-384. DOI: 10.1109/Jdt.2012.2186953 |
0.553 |
|
2011 |
Alzoubi K, Hamasha MM, Schadt M, Lu S, Sammakia B, Poliks M. Effect of lamination on the bending fatigue life of copper coated PET substrate Proceedings of Spie - the International Society For Optical Engineering. 7956. DOI: 10.1117/12.874226 |
0.522 |
|
2011 |
Venkatadri V, Sammakia B, Srihari K, Santos D. A review of recent advances in thermal management in three dimensional chip stacks in electronic systems Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4005298 |
0.333 |
|
2011 |
Bhopte S, Sammakia B, Iyengar M, Schmidt R. Numerical and experimental study of the effect of underfloor blockages on data center performance Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4003603 |
0.753 |
|
2011 |
Alzoubi K, Lu S, Sammakia B, Poliks M. Experimental and analytical studies on the high cycle fatigue of thin film metal on PET substrate for flexible electronics applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 43-51. DOI: 10.1109/Tcpmt.2010.2100911 |
0.539 |
|
2011 |
Alzoubi K, Hamasha MM, Lu S, Sammakia B. Bending fatigue study of sputtered ITO on flexible substrate Ieee/Osa Journal of Display Technology. 7: 593-600. DOI: 10.1109/Jdt.2011.2151830 |
0.556 |
|
2011 |
Alzoubi K, Lu S, Sammakia B, Poliks M. Factor effect study for the high cyclic bending fatigue of thin films on PET substrate for flexible displays applications Ieee/Osa Journal of Display Technology. 7: 348-355. DOI: 10.1109/Jdt.2010.2076772 |
0.576 |
|
2011 |
Pisipati S, Geer J, Sammakia B, Murray BT. A novel alternate approach for multiscale thermal transport using diffusion in the Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 54: 3406-3419. DOI: 10.1016/J.Ijheatmasstransfer.2011.03.046 |
0.724 |
|
2010 |
Farnam D, Sammakia B, Ghose K. Thermal design criteria for extraordinary performance of devices cooled by microchannel heat sink Journal of Thermal Science and Engineering Applications. 2. DOI: 10.1115/1.4002841 |
0.778 |
|
2010 |
Karajgikar S, Agonafer D, Ghose K, Sammakia B, Amon C, Refai-Ahmed G. Multi-objective optimization to improve both thermal and device performance of a nonuniformly powered micro-architecture Journal of Electronic Packaging, Transactions of the Asme. 132: 0210081-0210088. DOI: 10.1115/1.4001852 |
0.35 |
|
2010 |
Zhou F, Arunasalam P, Murray BT, Sammakia B. Modeling Heat Transport in Thermal Interface Materials Enhanced With MEMS-Based Microinterconnects Ieee Transactions On Components and Packaging Technologies. 33: 16-24. DOI: 10.1109/Tcapt.2009.2018834 |
0.487 |
|
2010 |
Gondipalli S, Ibrahim M, Bhopte S, Sammakia B, Murray B, Ghose K, Iyengar MK, Schmidt R. Numerical modeling of data center with transient boundary conditions 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501420 |
0.694 |
|
2010 |
Ibrahim M, Gondipalli S, Bhopte S, Sammakia B, Murray B, Ghose K, Iyengar MK, Schmidt R. Numerical modeling approach to dynamic data center cooling 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501335 |
0.699 |
|
2010 |
Bhopte S, Sammakia B, Murray B. Numerical study of a novel passive micromixer design 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501318 |
0.685 |
|
2010 |
Gondipalli S, Bhopte S, Sammakia B, Calmidi V. Numerical and experimental study of the effect of thermocouple wire attachment on thermal characterization of a high performance flip-chip package 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501260 |
0.757 |
|
2009 |
Kanuparthi S, Subbarayan G, Siegmund T, Sammakia B. The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials Ieee Transactions On Components and Packaging Technologies. 32: 424-434. DOI: 10.1109/Tcapt.2008.2010502 |
0.327 |
|
2009 |
Farnam D, Sammakia B, Ackler H, Ghose K. Comparative analysis of microchannel heat sink configurations subject to a pressure constraint Heat Transfer Engineering. 30: 43-53. DOI: 10.1080/01457630802293324 |
0.781 |
|
2009 |
Kanuparthi S, Rayasam M, Subbarayan G, Sammakia B, Gowda A, Tonapi S. Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials Computer Methods in Applied Mechanics and Engineering. 198: 657-668. DOI: 10.1016/J.Cma.2008.10.001 |
0.332 |
|
2008 |
Bhopte S, Sammakia B, Murray B. Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing Ieee Transactions On Biomedical Engineering. 19-20. DOI: 10.1115/Biomed2008-38096 |
0.719 |
|
2008 |
Kanuparthi S, Subbarayan G, Siegmund T, Sammakia B. An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials Ieee Transactions On Components and Packaging Technologies. 31: 611-621. DOI: 10.1109/Tcapt.2008.2001839 |
0.367 |
|
2008 |
Garimella SV, Fleischer AS, Murthy JY, Keshavarzi A, Prasher R, Patel C, Bhavnani SH, Venkatasubramanian R, Mahajan R, Joshi Y, Sammakia B, Myers BA, Chorosinski L, Baelmans M, Sathyamurthy P, et al. Thermal challenges in next-generation electronic systems Ieee Transactions On Components and Packaging Technologies. 31: 801-815. DOI: 10.1109/Tcapt.2008.2001197 |
0.379 |
|
2008 |
Bhopte S, Sammakia B, Calmidi V. A study of the thermal characterization of a high - Performance flip chip package 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 302-309. DOI: 10.1109/ITHERM.2008.4544284 |
0.746 |
|
2007 |
Geer J, Desai A, Sammakia B. Heat Conduction in Multilayered Rectangular Domains Journal of Electronic Packaging. 129: 440-451. DOI: 10.1115/1.2804094 |
0.724 |
|
2007 |
Lin T, Menezes AS, Andros F, McBride DG, Lu S, Sammakia B. Assembly of Copper Column Interconnect Flip Chip Ieee Transactions On Electronics Packaging Manufacturing. 30: 206-212. DOI: 10.1109/Tepm.2007.899149 |
0.323 |
|
2007 |
Park S, Lee HC, Sammakia B, Raghunathan K. Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies Ieee Transactions On Components and Packaging Technologies. 30: 294-301. DOI: 10.1109/Tcapt.2007.898363 |
0.392 |
|
2006 |
Bhopte S, Agonafer D, Schmidt R, Sammakia B. Optimization of data center room layout to minimize rack inlet air temperature Journal of Electronic Packaging, Transactions of the Asme. 128: 380-387. DOI: 10.1115/1.2356866 |
0.738 |
|
2006 |
Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B. A numerical study of transport in a thermal interface material enhanced with carbon nanotubes Journal of Electronic Packaging, Transactions of the Asme. 128: 92-97. DOI: 10.1115/1.2161231 |
0.716 |
|
2006 |
Desai A, Geer J, Sammakia B. Models of Steady Heat Conduction in Multiple Cylindrical Domains Journal of Electronic Packaging. 128: 10-17. DOI: 10.1115/1.2159003 |
0.718 |
|
2002 |
Garimella SV, Joshi YK, Bar-Cohen A, Mahajan R, Toh KC, Carey VP, Baelmans M, Lohan J, Sammakia B, Andros F. Thermal challenges in next generation electronic systems- Summary of panel presentations and discussions Ieee Transactions On Components and Packaging Technologies. 25: 569-575. DOI: 10.1109/Tcapt.2003.809113 |
0.599 |
|
1998 |
Sathe S, Sammakia B. A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages Journal of Heat Transfer-Transactions of the Asme. 120: 830-839. DOI: 10.1115/1.2825902 |
0.443 |
|
1990 |
Khalillolahi A, Sammakia B. The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity Journal of Electronic Packaging. 112: 357-366. DOI: 10.1115/1.2904390 |
0.458 |
|
1988 |
Khalilollahi A, Sammakia B. Transient natural convection near a uniform flux surface with appreciable heat capacity International Communications in Heat and Mass Transfer. 15: 303-313. DOI: 10.1016/0735-1933(88)90031-0 |
0.423 |
|
1986 |
Khalilollahi A, Sammakia B. Unsteady Natural Convection Generated By A Heated Surface Within An Enclosure Numerical Heat Transfer Part a-Applications. 9: 715-730. DOI: 10.1080/10407798608552176 |
0.436 |
|
1985 |
Sammakia B, Carey VP, Gebhart B. Measurements and calculations of transient mixed convection in air International Journal of Heat and Mass Transfer. 28: 1837-1846. DOI: 10.1016/0017-9310(85)90206-6 |
0.739 |
|
1984 |
Sammakia B, Gebhart B. Transport adjacent to ice surfaces melting in saline water: visualization experiments International Communications in Heat and Mass Transfer. 11: 25-34. DOI: 10.1016/0735-1933(84)90027-7 |
0.621 |
|
1983 |
Gebhart B, Sammakia B, Audunson T. Melting characteristics of horizontal ice surfaces in cold saline water Journal of Geophysical Research. 88: 2935-2942. DOI: 10.1029/Jc088Ic05P02935 |
0.31 |
|
1983 |
Sammakia B, Gebhart B. Transport near a vertical ice surface melting in water of various salinity levels International Journal of Heat and Mass Transfer. 26: 1439-1452. DOI: 10.1016/S0017-9310(83)80045-3 |
0.633 |
|
1982 |
Sammakia B, Gebhart B, Qureshi ZH. Measurements and Calculations of Transient Natural Convection in Water Journal of Heat Transfer-Transactions of the Asme. 104: 644-648. DOI: 10.1115/1.3245180 |
0.68 |
|
1982 |
Sammakia B, Gebhart B, Carey VP. Transient mixed convection adjacent to a vertical flat surface International Journal of Heat and Mass Transfer. 25: 835-845. DOI: 10.1016/0017-9310(82)90096-5 |
0.753 |
|
1981 |
Sammakia B, Gebhart B. Transient Natural Convection Adjacent To A Vertical Flat Surface: The Thermal Capacity Effect Numerical Heat Transfer Part a-Applications. 4: 331-344. DOI: 10.1080/01495728108961796 |
0.696 |
|
1978 |
Sammakia B, Gebhart B. Transient And Steady-State Numerical Solutions In Natural Convection Numerical Heat Transfer Part a-Applications. 1: 529-542. DOI: 10.1080/10407797809412184 |
0.676 |
|
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