Year |
Citation |
Score |
2020 |
Gao T, Singaravelu AS, Oka S, Ramachandran R, Štepánek F, Chawla N, Emady HN. Powder bed packing and API content homogeneity of granules in single drop granule formation Powder Technology. 366: 12-21. DOI: 10.1016/J.Powtec.2020.02.039 |
0.303 |
|
2020 |
Zhao Y, Singaravelu ASS, Ma X, Zhang Q, Liu X, Chawla N. Micromechanical properties and deformation behavior of Al3BC/6061 Al composites via micropillar compression Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 773: 138852. DOI: 10.1016/J.Msea.2019.138852 |
0.428 |
|
2020 |
Branch Kelly M, Kirubanandham A, Chawla N. Mechanisms of thermal cycling damage in polycrystalline Sn-rich solder joints Materials Science and Engineering: A. 771: 138614. DOI: 10.1016/J.Msea.2019.138614 |
0.337 |
|
2020 |
Zhao Y, Singaravelu ASS, Ma X, Liu X, Chawla N. Mechanical properties of Al3BC by nanoindentation and micropillar compression Materials Letters. 264: 127361. DOI: 10.1016/J.Matlet.2020.127361 |
0.375 |
|
2020 |
Torbati-Sarraf H, Stannard TJ, La Plante EC, Sant GN, Chawla N. Direct observations of microstructure-resolved corrosion initiation in AA7075-T651 at the nanoscale using vertical scanning interferometry (VSI) Materials Characterization. 161: 110166. DOI: 10.1016/J.Matchar.2020.110166 |
0.339 |
|
2020 |
Zhao Y, Singaravelu ASS, Ma X, Zhang Q, Chang SLY, Liu X, Chawla N. Unveiling the deformation behavior and strengthening mechanisms of Al3BC/Al composites via in-situ micropillar compression Journal of Alloys and Compounds. 823: 153842. DOI: 10.1016/J.Jallcom.2020.153842 |
0.399 |
|
2020 |
Kelly MB, Niverty S, Chawla N. Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation Journal of Alloys and Compounds. 818: 152918. DOI: 10.1016/J.Jallcom.2019.152918 |
0.361 |
|
2020 |
Yang L, Mayer C, Chawla N, LLorca J, Molina-Aldareguía J. Nanomechanical characterization of the fracture toughness of Al/SiC nanolaminates Extreme Mechanics Letters. 40: 100945. DOI: 10.1016/J.Eml.2020.100945 |
0.334 |
|
2020 |
Kelly MB, Niverty S, Chawla N. Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints Acta Materialia. 189: 118-128. DOI: 10.1016/J.Actamat.2020.02.052 |
0.353 |
|
2020 |
Kelly MB, Maity T, Sakib ARN, Frear DR, Chawla N. Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0) Journal of Electronic Materials. 49: 4466-4467. DOI: 10.1007/S11664-020-08156-0 |
0.307 |
|
2020 |
Kelly MB, Maity T, Nazmus Sakib AR, Frear DR, Chawla N. Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability Journal of Electronic Materials. 49: 4466-4467. DOI: 10.1007/S11664-020-08013-0 |
0.41 |
|
2019 |
Jansen MA, Williams J, Chawla N, Franz NM. Avoidance of Catastrophic Structural Failure as an Evolutionary Constraint: Biomechanics of the Acorn Weevil Rostrum. Advanced Materials (Deerfield Beach, Fla.). e1903526. PMID 31456275 DOI: 10.1002/Adma.201903526 |
0.388 |
|
2019 |
Zhang Q, Zhu K, Singaravelu ASS, Sun W, Jing T, Chawla N. Three-Dimensional (3D) Microstructure-Based Modeling of a Thermally-Aged Cast Duplex Stainless Steel Based on X-ray Microtomography, Nanoindentation and Micropillar Compression Metals. 9: 688. DOI: 10.3390/MET9060688 |
0.312 |
|
2019 |
Patterson BM, Kuettner L, Cordes N, Henderson K, Herman M, Welch C, Carpenter J, Montgomery C, Sun T, Fezzaa K, Xiao X, Williams J, Chawla N. Probing Material Morphology and Deformation as a Response to in situ Loading using X-ray Tomography Microscopy and Microanalysis. 25: 374-375. DOI: 10.1017/S1431927619002605 |
0.305 |
|
2019 |
Singaravelu A, Williams JJ, Walter J, Holmes C, Henderson M, Chawla N. In situ Four Dimensional (4D) X-ray Microtomography of the Compressive Behavior of eTPU Foam for High Performance Footware Microscopy and Microanalysis. 25: 364-365. DOI: 10.1017/S1431927619002551 |
0.318 |
|
2019 |
Zhang Q, Singaravelu ASS, Zhao Y, Jing T, Chawla N. Mechanical properties of a thermally-aged cast duplex stainless steel by nanoindentation and micropillar compression Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 743: 520-528. DOI: 10.1016/J.Msea.2018.11.112 |
0.313 |
|
2019 |
Singh S, Chang S, Kaira CS, Baldwin JK, Mara N, Chawla N. Microstructure and mechanical properties of co-sputtered Al-SiC composites Materials & Design. 168: 107670. DOI: 10.1016/J.Matdes.2019.107670 |
0.362 |
|
2019 |
Singh S, Kaira CS, Bale H, Huynh C, Merkle A, Chawla N. In situ micropillar compression of Al/SiC nanolaminates using laboratory-based nanoscale X-ray microscopy: Effect of nanopores on mechanical behavior Materials Characterization. 150: 207-212. DOI: 10.1016/J.Matchar.2019.02.030 |
0.349 |
|
2019 |
Zhang Q, Niverty S, Singaravelu ASS, Williams JJ, Guo E, Jing T, Chawla N. Microstructure and micropore formation in a centrifugally-cast duplex stainless steel via X-ray microtomography Materials Characterization. 148: 52-62. DOI: 10.1016/J.Matchar.2018.12.009 |
0.359 |
|
2019 |
Chen P, Xu W, Chawla N, Ren Y, Jiao Y. Hierarchical n-point polytope functions for quantitative representation of complex heterogeneous materials and microstructural evolution Acta Materialia. 179: 317-327. DOI: 10.1016/J.Actamat.2019.08.045 |
0.354 |
|
2019 |
Kaira CS, Stannard TJ, De Andrade V, De Carlo F, Chawla N. Exploring novel deformation mechanisms in aluminum–copper alloys using in situ 4D nanomechanical testing Acta Materialia. 176: 242-249. DOI: 10.1016/J.Actamat.2019.07.016 |
0.426 |
|
2019 |
Williams JJ, Regalado IL, Liu L, Joshi S, Chawla N. Effect of Component Flexibility During Thermal Cycling of Sintered Nano-Silver Joints by X-ray Microtomography Journal of Electronic Materials. 49: 241-244. DOI: 10.1007/S11664-019-07461-7 |
0.316 |
|
2019 |
Lujan-Regalado I, Kirubanandham A, Williams JJ, Chawla N. Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation Journal of Electronic Materials. 48: 58-71. DOI: 10.1007/S11664-018-6669-8 |
0.392 |
|
2019 |
Singaravelu ASS, Williams JJ, Goyal HD, Niverty S, Singh SS, Stannard TJ, Xiao X, Chawla N. 3D Time-Resolved Observations of Fatigue Crack Initiation and Growth from Corrosion Pits in Al 7XXX Alloys Using In Situ Synchrotron X-ray Tomography Metallurgical and Materials Transactions A. 51: 28-41. DOI: 10.1007/S11661-019-05519-Z |
0.37 |
|
2018 |
Gao T, Singaravelu ASS, Oka S, Ramachandran R, Štepánek F, Chawla N, Emady HN. Granule formation and structure from single drop impact on heterogeneous powder beds. International Journal of Pharmaceutics. PMID 30236649 DOI: 10.1016/J.Ijpharm.2018.09.036 |
0.309 |
|
2018 |
Kaira CS, Yang X, Andrade VD, Carlo FD, Scullin W, Gursoy D, Chawla N. Automated correlative segmentation of large Transmission X-ray Microscopy (TXM) tomograms using deep learning Materials Characterization. 142: 203-210. DOI: 10.1016/J.Matchar.2018.05.053 |
0.304 |
|
2018 |
Vallabhaneni R, Stannard TJ, Kaira CS, Chawla N. 3D X-ray microtomography and mechanical characterization of corrosion-induced damage in 7075 aluminium (Al) alloys Corrosion Science. 139: 97-113. DOI: 10.1016/J.Corsci.2018.04.046 |
0.384 |
|
2018 |
Stannard TJ, Williams JJ, Singh SS, Singaravelu ASS, Xiao X, Chawla N. 3D time-resolved observations of corrosion and corrosion-fatigue crack initiation and growth in peak-aged Al 7075 using synchrotron X-ray tomography Corrosion Science. 138: 340-352. DOI: 10.1016/J.Corsci.2018.04.029 |
0.357 |
|
2018 |
Remington T, Hahn E, Zhao S, Flanagan R, Mertens J, Sabbaghianrad S, Langdon T, Wehrenberg C, Maddox B, Swift D, Remington B, Chawla N, Meyers M. Spall strength dependence on grain size and strain rate in tantalum Acta Materialia. 158: 313-329. DOI: 10.1016/J.Actamat.2018.07.048 |
0.353 |
|
2018 |
Kaira CS, Kantzos C, Williams JJ, Andrade VD, Carlo FD, Chawla N. Microstructural evolution and deformation behavior of Al-Cu alloys: A Transmission X-ray Microscopy (TXM) and micropillar compression study Acta Materialia. 144: 419-431. DOI: 10.1016/J.Actamat.2017.11.009 |
0.469 |
|
2018 |
Yang LW, Mayer C, Li N, Baldwin JK, Mara NA, Chawla N, Molina-Aldareguia JM, Llorca J. Mechanical properties of metal-ceramic nanolaminates: Effect of constraint and temperature Acta Materialia. 142: 37-48. DOI: 10.1016/J.Actamat.2017.09.042 |
0.374 |
|
2017 |
Kaira CS, De Andrade V, Singh SS, Kantzos C, Kirubanandham A, De Carlo F, Chawla N. Probing Novel Microstructural Evolution Mechanisms in Aluminum Alloys Using 4D Nanoscale Characterization. Advanced Materials (Deerfield Beach, Fla.). PMID 28906570 DOI: 10.1002/Adma.201703482 |
0.428 |
|
2017 |
Kaira CS, Andrade VD, Singh SS, Kantzos C, Carlo FD, Chawla N. Understanding Nanoscale 4D Microstructural Evolution in Aluminum Alloys using Transmission X-Ray Microscopy (TXM) Microscopy and Microanalysis. 23: 2220-2221. DOI: 10.1017/S143192761701176X |
0.352 |
|
2017 |
Stannard T, Bale H, Chengattu T, Niverty S, Williams J, Xiao X, Merkle A, Lauridsen E, Chawla N. Multimodal 3D Time-Lapse Studies of Corrosion Pitting and Corrosion-Fatigue Behavior in 7475 Aluminum Alloys Microscopy and Microanalysis. 23: 324-325. DOI: 10.1017/S1431927617002306 |
0.339 |
|
2017 |
Das S, Xiao X, Chawla N, Neithalath N. Effective Constitutive Response of Sustainable Next Generation Infrastructure Materials through High-Fidelity Experiments and Numerical Simulation Procedia Engineering. 173: 1258-1265. DOI: 10.1016/J.Proeng.2016.12.149 |
0.344 |
|
2017 |
Guo E, Singh SS, Kaira CS, Meng X, Xu Y, Luo L, Wang M, Chawla N. Mechanical properties of microconstituents in Nb-Si-Ti alloy by micropillar compression and nanoindentation Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 687: 99-106. DOI: 10.1016/J.Msea.2017.01.058 |
0.364 |
|
2017 |
Vallabhaneni R, Izadi E, Mayer CR, Kaira CS, Singh SS, Rajagopalan J, Chawla N. In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM) Microelectronics Reliability. 79: 314-320. DOI: 10.1016/J.Microrel.2017.07.042 |
0.399 |
|
2017 |
Kotoul M, Skalka P, Ševeček O, Bertolla L, Mertens J, Marcián P, Chawla N. Crack bridging modelling in Bioglass® based scaffolds reinforced by poly-vinyl alcohol/microfibrillated cellulose composite coating Mechanics of Materials. 110: 16-28. DOI: 10.1016/J.Mechmat.2017.04.004 |
0.346 |
|
2017 |
Guo E, Singh SS, Mayer C, Meng X, Xu Y, Luo L, Wang M, Chawla N. Effect of gallium addition on the microstructure and micromechanical properties of constituents in NbSi based alloys Journal of Alloys and Compounds. 704: 89-100. DOI: 10.1016/J.Jallcom.2017.02.054 |
0.333 |
|
2017 |
Singh SS, Stannard TJ, Xiao X, Chawla N. In Situ X-ray Microtomography of Stress Corrosion Cracking and Corrosion Fatigue in Aluminum Alloys Jom. 69: 1404-1414. DOI: 10.1007/S11837-017-2413-8 |
0.398 |
|
2017 |
Mertens JCE, Henderson K, Cordes NL, Pacheco R, Xiao X, Williams JJ, Chawla N, Patterson BM. Analysis of thermal history effects on mechanical anisotropy of 3D-printed polymer matrix composites via in situ X-ray tomography Journal of Materials Science. 52: 12185-12206. DOI: 10.1007/S10853-017-1339-4 |
0.408 |
|
2016 |
Kaira CS, Mayer CR, De Andrade V, De Carlo F, Chawla N. Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM). Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 1-6. PMID 27426439 DOI: 10.1017/S1431927616011429 |
0.374 |
|
2016 |
Andrew Jansen M, Singh SS, Chawla N, Franz NM. A Multilayer Micromechanical Model of the Cuticle of Curculio longinasus Chittenden, 1927 (Coleoptera: Curculionidae). Journal of Structural Biology. PMID 27189867 DOI: 10.1016/J.Jsb.2016.05.007 |
0.335 |
|
2016 |
Yang LW, Mayer C, Chawla N, Llorca J, Molina-Aldareguía JM. Deformation mechanisms of ultra-thin Al layers in Al/SiC nanolaminates as a function of thickness and temperature Philosophical Magazine. 1-20. DOI: 10.1080/14786435.2016.1219075 |
0.329 |
|
2016 |
Mayer C, Yang LW, Singh SS, Xie H, Shen YL, Llorca J, Molina-Aldareguia J, Chawla N. Orientation dependence of indentation behavior in Al-SiC nanolaminate composites Materials Letters. 168: 129-133. DOI: 10.1016/J.Matlet.2016.01.049 |
0.571 |
|
2016 |
Mayer CR, Molina-Aladareguia J, Chawla N. Three dimensional (3D) microstructure-based finite element modeling of Al-SiC nanolaminates using focused ion beam (FIB) tomography Materials Characterization. 120: 369-376. DOI: 10.1016/J.Matchar.2016.09.023 |
0.375 |
|
2016 |
Yuan R, Singh SS, Chawla N, Oswald J. Geometry segmentation of voxelized representations of heterogeneous microstructures using betweenness centrality Materials Characterization. 118: 553-559. DOI: 10.1016/J.Matchar.2016.07.001 |
0.321 |
|
2016 |
Singh SS, Jansen MA, Franz NM, Chawla N. Microstructure and nanoindentation of the rostrum of Curculio longinasus Chittenden, 1927 (Coleoptera: Curculionidae) Materials Characterization. 118: 206-211. DOI: 10.1016/J.Matchar.2016.05.022 |
0.353 |
|
2016 |
Singh SS, Loza JJ, Merkle AP, Chawla N. Three dimensional microstructural characterization of nanoscale precipitates in AA7075-T651 by focused ion beam (FIB) tomography Materials Characterization. 118: 102-111. DOI: 10.1016/J.Matchar.2016.05.009 |
0.388 |
|
2016 |
Singh SS, Williams JJ, Stannard TJ, Xiao X, Carlo FD, Chawla N. Measurement of localized corrosion rates at inclusion particles in AA7075 by in situ three dimensional (3D) X-ray synchrotron tomography Corrosion Science. 104: 330-335. DOI: 10.1016/J.Corsci.2015.12.027 |
0.317 |
|
2016 |
Das S, Maroli A, Singh SS, Stannard T, Xiao X, Chawla N, Neithalath N. A microstructure-guided constitutive modeling approach for random heterogeneous materials: Application to structural binders Computational Materials Science. 119: 52-64. DOI: 10.1016/J.Commatsci.2016.03.040 |
0.4 |
|
2016 |
Aguayo M, Das S, Maroli A, Kabay N, Mertens JCE, Rajan SD, Sant G, Chawla N, Neithalath N. The influence of microencapsulated phase change material (PCM) characteristics on the microstructure and strength of cementitious composites: Experiments and finite element simulations Cement and Concrete Composites. 73: 29-41. DOI: 10.1016/J.Cemconcomp.2016.06.018 |
0.386 |
|
2016 |
Kaira CS, Singh SS, Kirubanandham A, Chawla N. Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression Acta Materialia. 120: 56-67. DOI: 10.1016/J.Actamat.2016.08.030 |
0.362 |
|
2016 |
Mayer CR, Yang LW, Singh SS, Llorca J, Molina-Aldareguia JM, Shen YL, Chawla N. Anisotropy, size, and aspect ratio effects on micropillar compression of Al[sbnd]SiC nanolaminate composites Acta Materialia. 114: 25-32. DOI: 10.1016/J.Actamat.2016.05.018 |
0.411 |
|
2016 |
Mertens JCE, Kirubanandham A, Chawla N. Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD) Acta Materialia. 102: 220-230. DOI: 10.1016/J.Actamat.2015.08.073 |
0.349 |
|
2016 |
Kirubanandham A, Lujan-Regalado I, Vallabhaneni R, Chawla N. Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography Jom. 1-9. DOI: 10.1007/S11837-016-2042-7 |
0.388 |
|
2016 |
Li H, Singh S, Shashank Kaira C, Mertens JCE, Williams JJ, Chawla N, Jiao Y. Microstructural Quantification and Property Prediction Using Limited X-ray Tomography Data Jom. 68: 2288-2295. DOI: 10.1007/S11837-016-2024-9 |
0.335 |
|
2015 |
Chapman NC, Silva J, Williams JJ, Chawla N, Xiao X. Characterisation of thermal cycling induced cavitation in particle reinforced metal matrix composites by three-dimensional (3D) X-ray synchrotron tomography Materials Science and Technology (United Kingdom). 31: 573-578. DOI: 10.1179/1743284714Y.0000000582 |
0.374 |
|
2015 |
Paciornik S, Silva LF, dos Santos VR, Chawla N, Schneider G, Bernthaler T. 3D Multiscale Characterization of Discontinuities in Underwater Wet Welds Microscopy and Microanalysis. 21: 2419-2420. DOI: 10.1017/S1431927615012878 |
0.339 |
|
2015 |
Merkle AP, Lechner L, Hunter L, Gelb J, Singh SS, Chawla N. Automated Correlative Tomography of an Aluminum 7075 Alloy Spanning Length Scales and Modalities Microscopy and Microanalysis. 21: 1345-1346. DOI: 10.1017/S1431927615007515 |
0.312 |
|
2015 |
Jiang L, Muthegowda N, Bhatia MA, Migliori A, Solanki KN, Chawla N. Full elastic constants of Cu<inf>6</inf>Sn<inf>5</inf> intermetallic by Resonant Ultrasound Spectroscopy (RUS) and ab initio calculations Scripta Materialia. 107: 26-29. DOI: 10.1016/J.Scriptamat.2015.05.012 |
0.313 |
|
2015 |
Mayer C, Li N, Mara N, Chawla N. Micromechanical and in situ shear testing of Al-SiC nanolaminate composites in a transmission electron microscope (TEM) Materials Science and Engineering A. 621: 229-235. DOI: 10.1016/J.Msea.2014.10.055 |
0.362 |
|
2015 |
Mertens JCE, Kirubanandham A, Chawla N. In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens Microelectronics Reliability. 55: 2345-2353. DOI: 10.1016/J.Microrel.2015.08.003 |
0.353 |
|
2015 |
Silva LF, Dos Santos VR, Paciornik S, Mertens JCE, Chawla N. Multiscale 3D characterization of discontinuities in underwater wet welds Materials Characterization. 107: 358-366. DOI: 10.1016/J.Matchar.2015.07.030 |
0.34 |
|
2015 |
Singh SS, Guo E, Xie H, Chawla N. Mechanical properties of intermetallic inclusions in Al 7075 alloys by micropillar compression Intermetallics. 62: 69-75. DOI: 10.1016/J.Intermet.2015.03.008 |
0.601 |
|
2015 |
Das S, Yang P, Singh SS, Mertens JCE, Xiao X, Chawla N, Neithalath N. Effective properties of a fly ash geopolymer: Synergistic application of X-ray synchrotron tomography, nanoindentation, and homogenization models Cement and Concrete Research. 78: 252-262. DOI: 10.1016/J.Cemconres.2015.08.004 |
0.38 |
|
2015 |
Chen S, Kirubanandham A, Chawla N, Jiao Y. Stochastic Multi-Scale Reconstruction of 3D Microstructure Consisting of Polycrystalline Grains and Second-Phase Particles from 2D Micrographs Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 1-11. DOI: 10.1007/S11661-015-3283-8 |
0.334 |
|
2015 |
Patterson BM, Cordes NL, Henderson K, Williams JJ, Stannard T, Singh SS, Ovejero AR, Xiao X, Robinson M, Chawla N. In situ X-ray synchrotron tomographic imaging during the compression of hyper-elastic polymeric materials Journal of Materials Science. DOI: 10.1007/S10853-015-9355-8 |
0.388 |
|
2015 |
Mayer CR, Lotfian S, Molina-Aldareguia J, Chawla N. High-Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead-Free Solder Advanced Engineering Materials. 17: 1168-1174. DOI: 10.1002/Adem.201500089 |
0.351 |
|
2014 |
Singh SS, Williams JJ, Lin MF, Xiao X, De Carlo F, Chawla N. In SituInvestigation of High Humidity Stress Corrosion Cracking of 7075 Aluminum Alloy by Three-Dimensional (3D) X-ray Synchrotron Tomography Materials Research Letters. 2: 217-220. DOI: 10.1080/21663831.2014.918907 |
0.353 |
|
2014 |
Jiao Y, Chawla N. Modeling and characterizing anisotropic inclusion orientation in heterogeneous material via directional cluster functions and stochastic microstructure reconstruction Journal of Applied Physics. 115. DOI: 10.1063/1.4867611 |
0.316 |
|
2014 |
Lotfian S, Mayer C, Chawla N, Llorca J, Misra A, Baldwin JK, Molina-Aldareguía JM. Effect of layer thickness on the high temperature mechanical properties of Al/SiC nanolaminates Thin Solid Films. 571: 260-267. DOI: 10.1016/J.Tsf.2014.06.022 |
0.367 |
|
2014 |
Guo EY, Xie HX, Singh SS, Kirubanandham A, Jing T, Chawla N. Mechanical characterization of microconstituents in a cast duplex stainless steel by micropillar compression Materials Science and Engineering A. 598: 98-105. DOI: 10.1016/J.Msea.2014.01.002 |
0.372 |
|
2014 |
Mertens JCE, Williams JJ, Chawla N. Development of a lab-scale, high-resolution, tube-generated X-ray computed-tomography system for three-dimensional (3D) materials characterization Materials Characterization. 92: 36-48. DOI: 10.1016/J.Matchar.2014.03.002 |
0.3 |
|
2014 |
Guo EY, Chawla N, Jing T, Torquato S, Jiao Y. Accurate modeling and reconstruction of three-dimensional percolating filamentary microstructures from two-dimensional micrographs via dilation-erosion method Materials Characterization. 89: 33-42. DOI: 10.1016/J.Matchar.2013.12.011 |
0.313 |
|
2014 |
Singh SS, Schwartzstein C, Williams JJ, Xiao X, De Carlo F, Chawla N. 3D microstructural characterization and mechanical properties of constituent particles in Al 7075 alloys using X-ray synchrotron tomography and nanoindentation Journal of Alloys and Compounds. 602: 163-174. DOI: 10.1016/J.Jallcom.2014.03.010 |
0.393 |
|
2014 |
Hruby P, Singh SS, Williams JJ, Xiao X, De Carlo F, Chawla N. Fatigue crack growth in SiC particle reinforced Al alloy matrix composites at high and low R-ratios by in situ X-ray synchrotron tomography International Journal of Fatigue. 68: 136-143. DOI: 10.1016/J.Ijfatigue.2014.05.010 |
0.409 |
|
2014 |
Yazzie KE, Fei H, Jiang H, Chawla N. Corrigendum to “Rate-dependent behavior of Sn alloy–Cu couples: Effects of microstructure and composition on mechanical shock resistance” [Acta Mater. 60 (2012) 4336–4348] Acta Materialia. 72: 262. DOI: 10.1016/J.Actamat.2014.03.056 |
0.561 |
|
2014 |
Mertens JCE, Williams JJ, Chawla N. A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography (μXCT) Journal of Electronic Materials. 43: 4442-4456. DOI: 10.1007/S11664-014-3382-0 |
0.372 |
|
2014 |
Singh SS, Sarkar R, Xie HX, Mayer C, Rajagopalan J, Chawla N. Tensile behavior of single-crystal tin whiskers Journal of Electronic Materials. 43: 978-982. DOI: 10.1007/S11664-014-3068-7 |
0.422 |
|
2014 |
Xie HX, Friedman D, Mirpuri K, Chawla N. Electromigration damage characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints by three-dimensional X-ray tomography and scanning electron microscopy Journal of Electronic Materials. 43: 33-42. DOI: 10.1007/S11664-013-2667-Z |
0.422 |
|
2014 |
Wang M, Xu Y, Zheng Q, Wu S, Jing T, Chawla N. Dendritic growth in Mg-based alloys: Phase-field simulations and experimental verification by X-ray synchrotron tomography Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 45: 2562-2574. DOI: 10.1007/S11661-014-2200-X |
0.35 |
|
2014 |
Guo EY, Singh SS, Xie HX, Williams JJ, Jing T, Chawla N. Microstructure-based modeling of deformation in steels based on constitutive relationships from micropillar compression Steel Research International. 85: 946-953. DOI: 10.1002/Srin.201300217 |
0.411 |
|
2014 |
Yuan R, Singh SS, Chawla N, Oswald J. Efficient methods for implicit geometrical representation of complex material microstructures International Journal For Numerical Methods in Engineering. 98: 79-91. DOI: 10.1002/Nme.4619 |
0.305 |
|
2013 |
Guo EY, Wang MY, Jing T, Chawla N. Temperature-dependent mechanical properties of an austenitic-ferritic stainless steel studied by in situ tensile loading in a scanning electron microscope (SEM) Materials Science and Engineering A. 580: 159-168. DOI: 10.1016/J.Msea.2013.04.060 |
0.408 |
|
2013 |
Xie HX, Chawla N. Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints Microelectronics Reliability. 53: 733-740. DOI: 10.1016/J.Microrel.2012.12.010 |
0.396 |
|
2013 |
Padilla E, Chawla N, Silva LF, Dos Santos VR, Paciornik S. Image analysis of cracks in the weld metal of a wet welded steel joint by three dimensional (3D) X-ray microtomography Materials Characterization. 83: 139-144. DOI: 10.1016/J.Matchar.2013.06.016 |
0.356 |
|
2013 |
Williams JJ, Yazzie KE, Padilla E, Chawla N, Xiao X, De Carlo F. Understanding fatigue crack growth in aluminum alloys by in situ X-ray synchrotron tomography International Journal of Fatigue. 57: 79-85. DOI: 10.1016/J.Ijfatigue.2012.06.009 |
0.735 |
|
2013 |
Lotfian S, Rodríguez M, Yazzie KE, Chawla N, Llorca J, Molina-Aldareguía JM. High temperature micropillar compression of Al/SiC nanolaminates Acta Materialia. 61: 4439-4451. DOI: 10.1016/J.Actamat.2013.04.013 |
0.742 |
|
2013 |
Jiao Y, Padilla E, Chawla N. Modeling and predicting microstructure evolution in lead/tin alloy via correlation functions and stochastic material reconstruction Acta Materialia. 61: 3370-3377. DOI: 10.1016/J.Actamat.2013.02.026 |
0.381 |
|
2013 |
Williams JJ, Walters JL, Wang MY, Chawla N, Rohatgi A. Extracting constitutive stress-strain behavior of microscopic phases by micropillar compression Jom. 65: 226-233. DOI: 10.1007/S11837-012-0516-9 |
0.412 |
|
2013 |
Chawla N, Venkatesh SH, Singh DRP, Alford TL. Characterization and adhesion in Cu/Ru/SiO2/Si multilayer nano-scale structure for Cu metallization Journal of Materials Engineering and Performance. 22: 1085-1090. DOI: 10.1007/S11665-012-0359-0 |
0.319 |
|
2013 |
Lotfian S, Molina-Aldareguia JM, Yazzie KE, Llorca J, Chawla N. Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation Journal of Electronic Materials. 42: 1085-1091. DOI: 10.1007/S11664-013-2517-Z |
0.737 |
|
2013 |
Xie HX, Chawla N. Enhancing the ductility of Sn-Ag-Cu lead-free solder joints by addition of compliant intermetallics Journal of Electronic Materials. 42: 527-536. DOI: 10.1007/S11664-012-2386-X |
0.369 |
|
2013 |
Williams JJ, Chapman NC, Chawla N. Mechanisms of Sn hillock growth in vacuum by in situ nanoindentation in a scanning electron microscope (SEM) Journal of Electronic Materials. 42: 224-229. DOI: 10.1007/S11664-012-2209-0 |
0.315 |
|
2013 |
Xie HX, Jiang L, Chawla N. Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys Journal of Materials Science: Materials in Electronics. 24: 3456-3466. DOI: 10.1007/S10854-013-1270-7 |
0.423 |
|
2012 |
Singh DRP, Chawla N. Scratch resistance of Al/SiC metal/ceramic nanolaminates Journal of Materials Research. 27: 278-283. DOI: 10.1557/Jmr.2011.274 |
0.37 |
|
2012 |
Fei H, Abraham A, Chawla N, Jiang H. Evaluation of micro-pillar compression tests for accurate determination of elastic-plastic constitutive relations Journal of Applied Mechanics, Transactions Asme. 79. DOI: 10.1115/1.4006767 |
0.574 |
|
2012 |
Lotfian S, Molina-Aldareguia JM, Yazzie KE, Llorca J, Chawla N. High-temperature nanoindentation behavior of Al/SiC multilayers Philosophical Magazine Letters. 92: 362-367. DOI: 10.1080/09500839.2012.674220 |
0.731 |
|
2012 |
Zhang J, An Y, Yazzie K, Chawla N, Jiang H. Finite element simulation of swelling-induced crack healing in gels Soft Matter. 8: 8107-8112. DOI: 10.1039/C2Sm25399B |
0.722 |
|
2012 |
Wang MY, Xu YJ, Jing T, Peng GY, Fu YN, Chawla N. Growth orientations and morphologies of α-Mg dendrites in Mg-Zn alloys Scripta Materialia. 67: 629-632. DOI: 10.1016/J.Scriptamat.2012.07.031 |
0.304 |
|
2012 |
Yazzie KE, Xie HX, Williams JJ, Chawla N. On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints Scripta Materialia. 66: 586-589. DOI: 10.1016/J.Scriptamat.2012.01.009 |
0.757 |
|
2012 |
Chawla N, Liaw PK, Lara-Curzio E, Ferber MK, Lowden RA. Effect of fiber fabric orientation on the flexural monotonic and fatigue behavior of 2D woven ceramic matrix composites Materials Science and Engineering A. 557: 77-83. DOI: 10.1016/J.Msea.2012.06.050 |
0.373 |
|
2012 |
Williams JJ, Segurado J, LLorca J, Chawla N. Three dimensional (3D) microstructure-based modeling of interfacial decohesion in particle reinforced metal matrix composites Materials Science and Engineering A. 557: 113-118. DOI: 10.1016/J.Msea.2012.05.108 |
0.355 |
|
2012 |
Shen YL, Blada CB, Williams JJ, Chawla N. Cyclic indentation behavior of metal-ceramic nanolayered composites Materials Science and Engineering A. 557: 119-125. DOI: 10.1016/J.Msea.2012.05.103 |
0.394 |
|
2012 |
Stewart JL, Jiang L, Williams JJ, Chawla N. Prediction of bulk tensile behavior of dual phase stainless steels using constituent behavior from micropillar compression experiments Materials Science and Engineering A. 534: 220-227. DOI: 10.1016/J.Msea.2011.11.062 |
0.397 |
|
2012 |
Yazzie KE, Williams JJ, Chawla N. Quantifying necking of rectangular tensile specimens using a mirror-based image analysis system Materials Letters. 74: 243-246. DOI: 10.1016/J.Matlet.2012.01.138 |
0.742 |
|
2012 |
Yazzie KE, Williams JJ, Phillips NC, De Carlo F, Chawla N. Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography Materials Characterization. 70: 33-41. DOI: 10.1016/J.Matchar.2012.05.004 |
0.753 |
|
2012 |
Bonakdar A, Mobasher B, Chawla N. Diffusivity and micro-hardness of blended cement materials exposed to external sulfate attack Cement and Concrete Composites. 34: 76-85. DOI: 10.1016/J.Cemconcomp.2011.08.016 |
0.318 |
|
2012 |
Yazzie KE, Fei HE, Jiang H, Chawla N. Rate-dependent behavior of Sn alloy-Cu couples: Effects of microstructure and composition on mechanical shock resistance Acta Materialia. 60: 4336-4348. DOI: 10.1016/J.Actamat.2012.04.018 |
0.772 |
|
2012 |
Padilla E, Jakkali V, Jiang L, Chawla N. Quantifying the effect of porosity on the evolution of deformation and damage in Sn-based solder joints by X-ray microtomography and microstructure-based finite element modeling Acta Materialia. 60: 4017-4026. DOI: 10.1016/J.Actamat.2012.03.048 |
0.39 |
|
2012 |
Wang MY, Williams JJ, Jiang L, De Carlo F, Jing T, Chawla N. Three Dimensional (3D) Microstructural Characterization and Quantitative Analysis of Solidified Microstructures in Magnesium-Based Alloys Metallography, Microstructure, and Analysis. 1: 7-13. DOI: 10.1007/S13632-012-0008-X |
0.384 |
|
2012 |
Yazzie KE, Williams JJ, Chawla N. Fracture behavior of Sn-3.5Ag-0.7Cu and pure Sn solders as a function of applied strain rate Journal of Electronic Materials. 41: 2519-2526. DOI: 10.1007/S11664-012-2180-9 |
0.763 |
|
2012 |
Xie H, Chawla N, Mirpuri K. Thermal and mechanical stability of Ce-containing Sn-3.9Ag-0.7Cu lead-free solder on Cu and electroless Ni-P metallizations Journal of Electronic Materials. 41: 3249-3258. DOI: 10.1007/S11664-012-2170-Y |
0.562 |
|
2012 |
Jiang L, Jiang H, Chawla N. The effect of crystallographic orientation on the mechanical behavior of Cu6Sn5 by micropillar compression testing Journal of Electronic Materials. 41: 2083-2088. DOI: 10.1007/S11664-012-2124-4 |
0.367 |
|
2012 |
Fei H, Yazzie K, Chawla N, Jiang H. Modeling fracture of sn-rich (Pb-Free) solder joints under mechanical shock conditions Journal of Electronic Materials. 41: 2089-2099. DOI: 10.1007/S11664-012-2079-5 |
0.777 |
|
2012 |
Fei H, Yazzie K, Chawla N, Jiang H. The effect of random voids in the modified Gurson model Journal of Electronic Materials. 41: 177-183. DOI: 10.1007/S11664-011-1816-5 |
0.792 |
|
2012 |
Singh SS, Williams JJ, Jiao Y, Chawla N. Modeling anisotropic multiphase heterogeneous materials via directional correlation functions: Simulations and experimental verification Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 4470-4474. DOI: 10.1007/S11661-012-1451-7 |
0.375 |
|
2012 |
Yazzie KE, Fei H, Jiang H, Chawla N. A self-consistent approach for necking correction in tensile specimens with rectangular cross-section using a novel mirror fixture Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 5058-5066. DOI: 10.1007/S11661-012-1355-6 |
0.741 |
|
2012 |
Yazzie KE, Topliff J, Chawla N. Communication: On the asymmetric growth behavior of intermetallic compound layers during extended reflow of Sn-Rich Alloy on Cu Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 3442-3446. DOI: 10.1007/S11661-012-1329-8 |
0.745 |
|
2012 |
Stewart JL, Williams JJ, Chawla N. Influence of thermal aging on the microstructure and mechanical behavior of dual-phase, precipitation-hardened, powder metallurgy stainless steels Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 43: 124-135. DOI: 10.1007/S11661-011-0844-3 |
0.382 |
|
2011 |
Fei H, Yazzie K, Williams J, Chawla N, Jiang H. Multiscale modeling of the interfacial fracture behavior in the Sn-Cu 6 Sn 5-Cu system Journal of Computational and Theoretical Nanoscience. 8: 873-880. DOI: 10.1166/Jctn.2011.1767 |
0.785 |
|
2011 |
Wang MY, Williams JJ, Jiang L, Carlo FD, Jing T, Chawla N. Dendritic morphology of α-Mg during the solidification of Mg-based alloys: 3D experimental characterization by X-ray synchrotron tomography and phase-field simulations Scripta Materialia. 65: 855-858. DOI: 10.1016/J.Scriptamat.2011.07.040 |
0.335 |
|
2011 |
Singh DRP, Chawla N, Tang G, Shen YL. Anomalous viscoplasticity during nanoindentation of Al/SiC nanolaminated composites Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 528: 4608-4614. DOI: 10.1016/J.Msea.2011.02.058 |
0.392 |
|
2011 |
Xie HX, Chawla N, Shen YL. Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys Microelectronics Reliability. 51: 1142-1147. DOI: 10.1016/J.Microrel.2011.02.005 |
0.445 |
|
2011 |
Jiang L, Chawla N, Pacheco M, Noveski V. Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography Materials Characterization. 62: 970-975. DOI: 10.1016/J.Matchar.2011.07.011 |
0.39 |
|
2011 |
Danaher FD, Williams JJ, Singh DRP, Jiang L, Chawla N. Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding Journal of Electronic Materials. 40: 1422-1427. DOI: 10.1007/S11664-011-1592-2 |
0.39 |
|
2011 |
Williams JJ, Yazzie KE, Connor Phillips N, Chawla N, Xiao X, De Carlo F, Iyyer N, Kittur M. On the correlation between fatigue striation spacing and crack growth rate: A three-dimensional (3-D) X-ray synchrotron tomography study Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 42: 3845-3848. DOI: 10.1007/S11661-011-0963-X |
0.746 |
|
2011 |
Williams JJ, Chapman NC, Jakkali V, Tanna VA, Chawla N, Xiao X, De Carlo F. Characterization of Damage Evolution in SiC Particle Reinforced Al Alloy Matrix Composites by In-Situ X-Ray Synchrotron Tomography Metallurgical and Materials Transactions A. 42: 2999-3005. DOI: 10.1007/S11661-011-0718-8 |
0.417 |
|
2010 |
Silva FdA, Toledo Filho RD, Mobasher B, Chawla N. A multi-scale investigation of the mechanical behavior of durable sisal fiber cement composites MatéRia (Rio De Janeiro). 15: 338-344. DOI: 10.1590/S1517-70762010000200035 |
0.345 |
|
2010 |
De Silva FA, Chawla N, Filho RDT. Mechanical behavior of natural sisal fibers Journal of Biobased Materials and Bioenergy. 4: 106-113. DOI: 10.1166/Jbmb.2010.1074 |
0.305 |
|
2010 |
Singh DRP, Deng X, Chawla N, Bai J, Hubbard C, Tang G, Shen YL. Residual stress characterization of Al/SiC nanoscale multilayers using X-ray synchrotron radiation Thin Solid Films. 519: 759-765. DOI: 10.1016/J.Tsf.2010.08.148 |
0.333 |
|
2010 |
Jiang L, Chawla N. Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing Scripta Materialia. 63: 480-483. DOI: 10.1016/J.Scriptamat.2010.05.009 |
0.387 |
|
2010 |
Sun PL, Chu JP, Lin TY, Shen YL, Chawla N. Characterization of nanoindentation damage in metal/ceramic multilayered films by transmission electron microscopy (TEM) Materials Science and Engineering A. 527: 2985-2992. DOI: 10.1016/J.Msea.2010.01.040 |
0.36 |
|
2010 |
Dudek MA, Hunter L, Kranz S, Williams JJ, Lau SH, Chawla N. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints Materials Characterization. 61: 433-439. DOI: 10.1016/J.Matchar.2010.01.011 |
0.406 |
|
2010 |
Singh DRP, Chawla N, Shen YL. Focused Ion Beam (FIB) tomography of nanoindentation damage in nanoscale metal/ceramic multilayers Materials Characterization. 61: 481-488. DOI: 10.1016/J.Matchar.2010.01.005 |
0.342 |
|
2010 |
Dudek MA, Chawla N. Nanoindentation of rare earth-Sn intermetallics in Pb-free solders Intermetallics. 18: 1016-1020. DOI: 10.1016/J.Intermet.2010.01.028 |
0.33 |
|
2010 |
Chawla N, Ganesh VV. Fatigue crack growth of SiC particle reinforced metal matrix composites International Journal of Fatigue. 32: 856-863. DOI: 10.1016/J.Ijfatigue.2009.08.005 |
0.41 |
|
2010 |
Singh DRP, Chawla N, Tang G, Shen YL. Micropillar compression of Al/SiC nanolaminates Acta Materialia. 58: 6628-6636. DOI: 10.1016/J.Actamat.2010.08.025 |
0.398 |
|
2010 |
Williams JJ, Flom Z, Amell AA, Chawla N, Xiao X, De Carlo F. Damage evolution in SiC particle reinforced Al alloy matrix composites by X-ray synchrotron tomography Acta Materialia. 58: 6194-6205. DOI: 10.1016/J.Actamat.2010.07.039 |
0.41 |
|
2010 |
Tang G, Shen YL, Singh DRP, Chawla N. Indentation behavior of metal–ceramic multilayers at the nanoscale: Numerical analysis and experimental verification Acta Materialia. 58: 2033-2044. DOI: 10.1016/J.Actamat.2009.11.046 |
0.438 |
|
2010 |
Yazzie KE, Williams JJ, Kingsbury D, Peralta P, Jiang H, Chawla N. Digital image correlation analysis of the deformation behavior of Pb-free solders at intermediate strain rates Jom. 62: 16-21. DOI: 10.1007/S11837-010-0102-Y |
0.75 |
|
2010 |
Wang F, Williams JJ, Chawla N. Environmental Effects on Fatigue Crack Growth in 7075 Aluminum Alloy Fatigue of Materials: Advances and Emergences in Understanding. 29-41. DOI: 10.1007/S11661-011-0810-0 |
0.386 |
|
2010 |
de Andrade Silva F, Williams JJ, Müller BR, Hentschel MP, Portella PD, Chawla N. Three-Dimensional Microstructure Visualization of Porosity and Fe-Rich Inclusions in SiC Particle-Reinforced Al Alloy Matrix Composites by X-Ray Synchrotron Tomography Metallurgical and Materials Transactions A. 41: 2121-2128. DOI: 10.1007/S11661-010-0260-0 |
0.416 |
|
2010 |
Dudek MA, Chawla N. Effect of rare-earth (La, Ce, and Y) additions on the microstructure and mechanical behavior of Sn-3.9Ag-0.7Cu solder alloy Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 41: 610-620. DOI: 10.1007/S11661-009-0146-1 |
0.404 |
|
2009 |
Crawford GA, Chawla N, Houston JE. Nanomechanics of biocompatible TiO2 nanotubes by Interfacial Force Microscopy (IFM) Journal of the Mechanical Behavior of Biomedical Materials. 2: 580-587. PMID 19716101 DOI: 10.1016/J.Jmbbm.2008.10.004 |
0.326 |
|
2009 |
Rinaldi A, Peralta P, Friesen C, Chawla N, Traversa E, Sieradzki K. Localized compression and shear tests on nanotargets with a Berkovich tip and a novel multifunctional tip Journal of Materials Research. 24: 768-775. DOI: 10.1557/Jmr.2009.0099 |
0.332 |
|
2009 |
Chawla N. Thermomechanical behaviour of environmentally benign Pb-free solders International Materials Reviews. 54: 368-384. DOI: 10.1179/174328009X461069 |
0.426 |
|
2009 |
Silva FdA, Chawla N, Filho RDdT. An experimental investigation of the fatigue behavior of sisal fibers Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 516: 90-95. DOI: 10.1016/J.Msea.2009.03.026 |
0.337 |
|
2009 |
Tang G, Singh DRP, Shen YL, Chawla N. Elastic properties of metal–ceramic nanolaminates measured by nanoindentation Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 502: 79-84. DOI: 10.1016/J.Msea.2008.11.013 |
0.376 |
|
2009 |
Hayes SM, Chawla N, Frear DR. Interfacial fracture toughness of Pb-free solders Microelectronics Reliability. 49: 269-287. DOI: 10.1016/J.Microrel.2008.11.004 |
0.395 |
|
2009 |
Goel A, Chawla KK, Vaidya UK, Chawla N, Koopman M. Characterization of fatigue behavior of long fiber reinforced thermoplastic (LFT) composites Materials Characterization. 60: 537-544. DOI: 10.1016/J.Matchar.2008.12.020 |
0.315 |
|
2009 |
Dudek MA, Chawla N. Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders Acta Materialia. 57: 4588-4599. DOI: 10.1016/J.Actamat.2009.06.031 |
0.358 |
|
2009 |
Crawford GA, Chawla N. Porous hierarchical TiO2 nanostructures: Processing and microstructure relationships Acta Materialia. 57: 854-867. DOI: 10.1016/J.Actamat.2008.10.032 |
0.304 |
|
2009 |
Yazzie KE, Fei H, Williams JJ, Jiang H, Chawla N. Mechanical shock behavior of bulk pure Sn solder Journal of Electronic Materials. 38: 2746-2755. DOI: 10.1007/S11664-009-0889-X |
0.797 |
|
2009 |
Dudek MA, Chawla N. Oxidation behavior of rare-earth-containing Pb-free solders Journal of Electronic Materials. 38: 210-220. DOI: 10.1007/S11664-008-0544-Y |
0.312 |
|
2009 |
Coughlin JP, Williams JJ, Crawford GA, Chawla N. Interfacial reactions in model NiTi shape memory alloy fiber-reinforced Sn matrix "Smart" composites Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 40: 176-184. DOI: 10.1007/S11661-008-9676-1 |
0.356 |
|
2009 |
Coughlin JP, Williams JJ, Chawla N. Mechanical behavior of NiTi shape memory alloy fiber reinforced Sn matrix "smart" composites Journal of Materials Science. 44: 700-707. DOI: 10.1007/S10853-008-3188-7 |
0.44 |
|
2009 |
Crawford GA, Chawla N, Koopman M, Carlisle K, Chawla KK. Effect of mounting material compliance on nanoindentation response of metallic materials Advanced Engineering Materials. 11: 45-51. DOI: 10.1002/Adem.200800253 |
0.327 |
|
2008 |
Goel A, Chawla KK, Vaidya UK, Chawla N, Koopman M. Two-dimensional microstructure based modelling of Young's modulus of long fibre thermoplastic composite Materials Science and Technology. 24: 864-869. DOI: 10.1179/174328408X294080 |
0.36 |
|
2008 |
Tang G, Shen YL, Chawla N. Plastic deformation during indentation unloading in multilayered materials Journal of Applied Physics. 104. DOI: 10.1063/1.3032913 |
0.387 |
|
2008 |
Deng X, Piotrowski G, Chawla N, Narasimhan KS. Fatigue crack growth behavior of hybrid and prealloyed sintered steels. Part I. Microstructure characterization Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 491: 19-27. DOI: 10.1016/J.Msea.2008.05.009 |
0.379 |
|
2008 |
Deng X, Piotrowski G, Chawla N, Narasimhan KS. Fatigue crack growth behavior of hybrid and prealloyed sintered steels: Part II. Fatigue behavior Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 491: 28-38. DOI: 10.1016/J.Msea.2008.01.021 |
0.357 |
|
2008 |
Dudek MA, Chawla N. Three-dimensional (3D) microstructure visualization of LaSn3 intermetallics in a novel Sn-rich rare-earth-containing solder Materials Characterization. 59: 1364-1368. DOI: 10.1016/J.Matchar.2007.10.008 |
0.329 |
|
2008 |
Ayyar A, Crawford GA, Williams JJ, Chawla N. Numerical simulation of the effect of particle spatial distribution and strength on tensile behavior of particle reinforced composites Computational Materials Science. 44: 496-506. DOI: 10.1016/J.Commatsci.2008.04.009 |
0.301 |
|
2008 |
Sidhu RS, Chawla N. Thermal fatigue behavior of Sn-Rich (Pb-Free) solders Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 39: 799-810. DOI: 10.1007/S11661-008-9480-Y |
0.427 |
|
2008 |
Sidhu RS, Chawla N. Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part I. Microstructure characterization of bulk solder and solder/copper joints Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 39: 340-348. DOI: 10.1007/S11661-007-9414-0 |
0.449 |
|
2008 |
Sidhu RS, Deng X, Chawla N. Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 39: 349-362. DOI: 10.1007/S11661-007-9412-2 |
0.441 |
|
2008 |
Tang G, Shen YL, Singh DRP, Chawla N. Analysis of indentation-derived effective elastic modulus of metal-ceramic multilayers International Journal of Mechanics and Materials in Design. 4: 391-398. DOI: 10.1007/S10999-008-9063-5 |
0.383 |
|
2008 |
Deng X, Chawla N. Three-dimensional (3D) modeling of the thermoelastic behavior of woven glass fiber-reinforced resin matrix composites Journal of Materials Science. 43: 6468-6472. DOI: 10.1007/S10853-008-2982-6 |
0.324 |
|
2008 |
Chawla N, Singh DRP, Shen YL, Tang G, Chawla KK. Indentation mechanics and fracture behavior of metal/ceramic nanolaminate composites Journal of Materials Science. 43: 4383-4390. DOI: 10.1007/S10853-008-2450-3 |
0.404 |
|
2007 |
Crawford GA, Chawla N, Das K, Bose S, Bandyopadhyay A. Microstructure and deformation behavior of biocompatible TiO2 nanotubes on titanium substrate. Acta Biomaterialia. 3: 359-367. PMID 17067860 DOI: 10.1016/J.Actbio.2006.08.004 |
0.342 |
|
2007 |
Williams JJ, Deng X, Chawla N. Effect of residual surface stress on the fatigue behavior of a low-alloy powder metallurgy steel International Journal of Fatigue. 29: 1978-1984. DOI: 10.1016/J.Ijfatigue.2007.01.008 |
0.377 |
|
2007 |
Ayyar A, Chawla N. Microstructure-based modeling of the influence of particle spatial distribution and fracture on crack growth in particle-reinforced composites Acta Materialia. 55: 6064-6073. DOI: 10.1016/J.Actamat.2007.06.044 |
0.352 |
|
2007 |
Sidhu RS, Madge SV, Deng X, Chawla N. On the Nature of the Interface between Ag3Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys Journal of Electronic Materials. 36: 1615-1620. DOI: 10.1007/S11664-007-0239-9 |
0.34 |
|
2007 |
Chawla N, Sidhu RS. Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys Lead-Free Electronic Solders: a Special Issue of the Journal of Materials Science: Materials in Electronics. 175-189. DOI: 10.1007/S10854-006-9028-0 |
0.422 |
|
2007 |
Ayyar A, Chawla N. Three-dimensional (3D) microstructure-based modeling of crack growth in particle reinforced composites Journal of Materials Science. 42: 9125-9129. DOI: 10.1007/S10853-007-2010-2 |
0.345 |
|
2006 |
Sidhu RS, Chawla N. Three-dimensional (3D) visualization and microstructure-based modeling of deformation in a Sn-rich solder Scripta Materialia. 54: 1627-1631. DOI: 10.1016/J.Scriptamat.2006.01.013 |
0.376 |
|
2006 |
Chawla N, Deng X, Schnell DRM. Thermal expansion anisotropy in extruded SiC particle reinforced 2080 aluminum alloy matrix composites Materials Science and Engineering A. 426: 314-322. DOI: 10.1016/J.Msea.2006.04.054 |
0.391 |
|
2006 |
Ayyar A, Chawla N. Microstructure-based modeling of crack growth in particle reinforced composites Composites Science and Technology. 66: 1980-1994. DOI: 10.1016/J.Compscitech.2006.01.007 |
0.364 |
|
2006 |
Chawla N, Sidhu RS, Ganesh VV. Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites Acta Materialia. 54: 1541-1548. DOI: 10.1016/J.Actamat.2005.11.027 |
0.398 |
|
2006 |
Dudek MA, Sidhu RS, Chawla N. Novel rare-earth-containing lead-free solders with enhanced ductility Jom. 58: 57-62. DOI: 10.1007/S11837-006-0184-8 |
0.435 |
|
2006 |
Dudek MA, Sidhu RS, Chawla N, Renavikar M. Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-Free Solders Journal of Electronic Materials. 35: 2088-2097. DOI: 10.1007/S11664-006-0318-3 |
0.416 |
|
2006 |
Chawla N, Chawla KK. Microstructure-based modeling of the deformation behavior of particle reinforced metal matrix composites Journal of Materials Science. 41: 913-925. DOI: 10.1007/S10853-006-6572-1 |
0.389 |
|
2006 |
Deng X, Chawla N. Modeling the effect of particle clustering on the mechanical behavior of SiC particle reinforced Al matrix composites Journal of Materials Science. 41: 5731-5734. DOI: 10.1007/S10853-006-0100-1 |
0.346 |
|
2005 |
Deng X, Cleveland C, Karcher T, Koopman M, Chawla N, Chawla KK. Nanoindentation behavior of nanolayered metal-ceramic composites Journal of Materials Engineering and Performance. 14: 417-423. DOI: 10.1361/105994905X56115 |
0.39 |
|
2005 |
Chawla N, Kerr M, Chawla KK. Monotonic and cyclic fatigue behavior of high-performance ceramic fibers Journal of the American Ceramic Society. 88: 101-108. DOI: 10.1111/J.1551-2916.2004.00007.X |
0.348 |
|
2005 |
Chawla N, Tur YK, Holmes JW, Barber JR, Szweda A. High-Frequency Fatigue Behavior of Woven-Fiber-Fabric-Reinforced Polymer-Derived Ceramic-Matrix Composites Journal of the American Ceramic Society. 81: 1221-1230. DOI: 10.1111/J.1151-2916.1998.Tb02472.X |
0.358 |
|
2005 |
Chawla N, Ganesh VV. Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of heterogeneous materials 11th International Conference On Fracture 2005, Icf11. 2: 1006-1011. DOI: 10.1017/S1431927605509310 |
0.401 |
|
2005 |
Ganesh VV, Chawla N. Effect of particle orientation anisotropy on the tensile behavior of metal matrix composites: Experiments and microstructure-based simulation Materials Science and Engineering A. 391: 342-353. DOI: 10.1016/J.Msea.2004.09.017 |
0.397 |
|
2005 |
Chawla N, Deng X. Microstructure and mechanical behavior of porous sintered steels Materials Science and Engineering A. 390: 98-112. DOI: 10.1016/J.Msea.2004.08.046 |
0.457 |
|
2005 |
Deng X, Piotrowski GB, Williams JJ, Chawla N. Effect of porosity and tension-compression asymmetry on the Bauschinger effect in porous sintered steels International Journal of Fatigue. 27: 1233-1243. DOI: 10.1016/J.Ijfatigue.2005.06.041 |
0.397 |
|
2005 |
Shen YL, Chawla N, Ege ES, Deng X. Deformation analysis of lap-shear testing of solder joints Acta Materialia. 53: 2633-2642. DOI: 10.1016/J.Actamat.2005.02.024 |
0.397 |
|
2005 |
Deng X, Sidhu RS, Johnson P, Chawla N. Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 36: 55-64. DOI: 10.1007/S11661-005-0138-8 |
0.448 |
|
2005 |
Deng X, Chawla N, Chawla KK, Koopman M, Chu JP. Mechanical behavior of multilayered nanoscale metal-ceramic composites Advanced Engineering Materials. 7: 1099-1108. DOI: 10.1002/Adem.200500161 |
0.423 |
|
2004 |
Chawla N, Ochoa F, Ganesh VV, Deng X, Koopman M, Chawla KK, Scarritt S. Measurement and prediction of Young's modulus of a Pb-free solder Journal of Materials Science: Materials in Electronics. 15: 385-388. DOI: 10.1023/B:Jmse.0000025683.19987.B3 |
0.329 |
|
2004 |
Chawla N, Ganesh VV, Wunsch B. Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites Scripta Materialia. 51: 161-165. DOI: 10.1016/J.Scriptamat.2004.03.043 |
0.404 |
|
2004 |
Deng X, Koopman M, Chawla N, Chawla KK. Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation Materials Science and Engineering A. 364: 240-243. DOI: 10.1016/J.Msea.2003.08.032 |
0.332 |
|
2004 |
Sidhu RS, Chawla N. Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning Materials Characterization. 52: 225-230. DOI: 10.1016/J.Matchar.2004.04.010 |
0.326 |
|
2004 |
Kerr M, Chawla N. Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales Acta Materialia. 52: 4527-4535. DOI: 10.1016/J.Actamat.2004.06.010 |
0.396 |
|
2004 |
Deng X, Chawla N, Chawla KK, Koopman M. Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation Acta Materialia. 52: 4291-4303. DOI: 10.1016/J.Actamat.2004.05.046 |
0.407 |
|
2004 |
Kerr M, Chawla N. Creep deformation behavior of Sn-3.5Ag solder at small length scales Jom. 56: 50-54. DOI: 10.1007/S11837-004-0112-8 |
0.358 |
|
2004 |
Ochoa F, Deng X, Chawla N. Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy Journal of Electronic Materials. 33: 1596-1607. DOI: 10.1007/S11664-004-0103-0 |
0.373 |
|
2004 |
Chawla N, Shen YL, Deng X, Ege ES. An evaluation of the lap-shear test for Sn-Rich Solder/Cu couples: Experiments and simulation Journal of Electronic Materials. 33: 1589-1595. DOI: 10.1007/S11664-004-0102-1 |
0.415 |
|
2004 |
Ganesh VV, Chawla N. Effect of Reinforcement-Particle-Orientation Anisotropy on the Tensile and Fatigue Behavior of Metal-Matrix Composites Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 35: 53-61. DOI: 10.1007/S11661-004-0108-6 |
0.406 |
|
2003 |
Chawla N, Jester B, Vonk DT. Bauschinger effect in porous sintered steels Materials Science and Engineering A. 346: 266-272. DOI: 10.1016/S0921-5093(02)00542-7 |
0.393 |
|
2003 |
Ochoa F, Williams JJ, Chawla N. The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder Jom. 55: 56-60. DOI: 10.1007/S11837-003-0142-7 |
0.4 |
|
2003 |
Ochoa F, Williams JJ, Chawla N. Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.%Ag Solder Journal of Electronic Materials. 32: 1414-1420. DOI: 10.1007/S11664-003-0109-Z |
0.378 |
|
2003 |
Deng X, Piotrowski G, Williams JJ, Chawla N. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints Journal of Electronic Materials. 32: 1403-1413. DOI: 10.1007/S11664-003-0108-0 |
0.34 |
|
2002 |
Kerr M, Williams JJ, Chawla N, Chawla KK. Monotonic and cyclic fatigue behavior of a high performance ceramic fiber Materials Research Society Symposium - Proceedings. 702: 223-228. DOI: 10.1557/Proc-702-U6.5.1 |
0.315 |
|
2002 |
Saha R, Morris E, Chawla N, Pickard SM. Hybrid and conventional particle reinforced metal matrix composites by squeeze infiltration casting Journal of Materials Science Letters. 21: 337-339. DOI: 10.1023/A:1017960912030 |
0.347 |
|
2002 |
Chawla N, Williams JJ, Saha R. Mechanical behavior and microstructure characterization of sinter-forged SiC particle reinforced aluminum matrix composites Journal of Light Metals. 2: 215-227. DOI: 10.1016/S1471-5317(03)00005-1 |
0.415 |
|
2002 |
Chawla N, Patel BV, Koopman M, Chawla KK, Saha R, Patterson BR, Fuller ER, Langer SA. Microstructure-based simulation of thermomechanical behavior of composite materials by object-oriented finite element analysis Materials Characterization. 49: 395-407. DOI: 10.1016/S1044-5803(03)00054-8 |
0.375 |
|
2002 |
Williams JJ, Piotrowski G, Saha R, Chawla N. Effect of overaging and particle size on tensile deformation and fracture of particle-reinforced aluminum matrix composites Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 33: 3861-3869. DOI: 10.1007/S11661-002-0258-3 |
0.327 |
|
2002 |
Polasik SJ, Williams JJ, Chawla N. Fatigue crack initiation and propagation of binder-treated powder metallurgy steels Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 33: 73-81. DOI: 10.1007/S11661-002-0006-8 |
0.351 |
|
2001 |
Carreño-Morelli E, Chawla N, Schaller R. Thermo-mechanical characterization of 2080 AI/SiCp composites by mechanical spectroscopy technique Journal of Materials Science Letters. 20: 163-165. DOI: 10.1023/A:1006783512311 |
0.419 |
|
2001 |
Shen Y, Williams J, Piotrowski G, Chawla N, Guo Y. Correlation between tensile and indentation behavior of particle-reinforced metal matrix composites: an experimental and numerical study Acta Materialia. 49: 3219-3229. DOI: 10.1016/S1359-6454(01)00226-9 |
0.402 |
|
2001 |
Chawla N, Murphy TF, Narasimhan KS, Koopman M, Chawla KK. Axial fatique behavior of binder-treated versus diffusion alloyed powder metallurgy steels Materials Science and Engineering A. 308: 180-188. DOI: 10.1016/S0921-5093(00)01990-0 |
0.419 |
|
2001 |
Shen YL, Chawla N. On the correlation between hardness and tensile strength in particle reinforced metal matrix composites Materials Science and Engineering A. 297: 44-47. DOI: 10.1016/S0921-5093(00)01256-9 |
0.369 |
|
2001 |
Chawla N, Chawla KK, Koopman M, Patel B, Coffin C, Eldridge JI. Thermal-shock behavior of a Nicalon-fiber-reinforced hybrid glass-ceramic composite Composites Science and Technology. 61: 1923-1930. DOI: 10.1016/S0266-3538(01)00096-3 |
0.329 |
|
2001 |
Chawla N, Shen YL. Mechanical behavior of particle reinforced metal matrix composites Advanced Engineering Materials. 3: 357-370. DOI: 10.1002/1527-2648(200106)3:6<357::Aid-Adem357>3.0.Co;2-I |
0.396 |
|
2000 |
Shen YL, Fishencord E, Chawla N. Correlating macrohardness and tensile behavior in discontinuously reinforced metal matrix composites Scripta Materialia. 42: 427-432. DOI: 10.1016/S1359-6462(99)00368-1 |
0.378 |
|
2000 |
Chawla N, Habel U, Shen Y-, Andres C, Jones JW, Allison JE. The effect of matrix microstructure on the tensile and fatigue behavior of SiC particle-reinforced 2080 Al matrix composites Metallurgical and Materials Transactions A. 31: 531-540. DOI: 10.1007/S11661-000-0288-7 |
0.418 |
|
2000 |
Chawla N, Andes C, Davis LC, Allison JE, Jones JW. The interactive role of inclusions and SiC reinforcement on the high-cycle fatigue resistance of particle reinforced metal matrix composites Metallurgical and Materials Transactions A. 31: 951-957. DOI: 10.1007/S11661-000-0037-Y |
0.382 |
|
1999 |
Pandey AB, Chawla N. The Fracture Toughness and Fatigue Behavior of DRA Jom. 51: 69-72. DOI: 10.1007/S11837-999-0228-Y |
0.429 |
|
1998 |
Chawla N, Andres C, Jones JW, Allison JE. Cyclic stress-strain behavior of particle reinforced metal matrix composites Scripta Materialia. 38: 1595-1600. DOI: 10.1016/S1359-6462(98)00067-0 |
0.466 |
|
1998 |
Chawla N, Andres C, Jones JW, Allison JE. Effect of SiC volume fraction and particle size on the fatigue resistance of a 2080 Al/SiCp composite Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 29: 2843-2854. DOI: 10.1007/S11661-998-0325-5 |
0.42 |
|
1997 |
Chawla N. Effect of laminate stacking sequence on the high frequency fatigue behavior of SCS-6 fiber-reinforced Si3N4 matrix composites Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science. 28: 2423-2427. DOI: 10.1007/S11661-997-0199-Y |
0.355 |
|
1996 |
Chawla N, Holmes JW, Lowden RA. The role of interfacial coatings on the high frequency fatigue behavior of nicalon/C/SiC composites Scripta Materialia. 35: 1411-1416. DOI: 10.1016/S1359-6462(96)00326-0 |
0.342 |
|
1995 |
Xu ZR, Chawla KK, Wolfenden A, Neuman A, Liggett GM, Chawla N. Stiffness loss and density decrease due to thermal cycling in an alumina fiber/magnesium alloy composite Materials Science and Engineering A. 203: 75-80. DOI: 10.1016/0921-5093(95)09847-X |
0.373 |
|
1991 |
Thadhani NN, Chawla N, Kibbe W. Explosive shock-compression processing of titanium aluminide/titanium diboride composites Journal of Materials Science. 26: 232-240. DOI: 10.1007/Bf00576057 |
0.344 |
|
Show low-probability matches. |