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Vinay Sriram, Ph.D. - Publications

Affiliations: 
2008 University of California, Los Angeles, Los Angeles, CA 
Area:
Materials Science Engineering
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2010 Sriram V, Yang JM, Ye J, Minor AM. In-situ metrology and testing of nanotwinned copper pillars for potential air gap applications Microelectronic Engineering. 87: 2046-2049. DOI: 10.1016/J.Mee.2010.04.019  0.413
2009 Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C. In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper Journal of Applied Physics. 105. DOI: 10.1063/1.3068191  0.307
2009 Tong M, Sriram V, Minor A, Yang JM. In situ and ex situ nanomechanical analysis of reactive nanolayer solder joints Advanced Engineering Materials. 11: 645-649. DOI: 10.1002/Adem.200900102  0.391
2008 Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C, Zienert I, Geisler H, Hofmann P, Zschech E. Nanotwin formation and its physical properties and effect on reliability of copper interconnects Microelectronic Engineering. 85: 2155-2158. DOI: 10.1016/J.Mee.2008.04.035  0.346
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