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Walter E. Voit - Publications

Affiliations: 
Materials Science and Engineering University of Texas at Dallas, Richardson, TX, United States 
Area:
Materials Science Engineering, Biomedical Engineering
Website:
https://profiles.utdallas.edu/walter.voit
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65 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Garcia-Sandoval A, Guerrero E, Hosseini SM, Rocha-Flores PE, Rihani R, Black BJ, Pal A, Carmel JB, Pancrazio JJ, Voit WE. Stable softening bioelectronics: A paradigm for chronically viable ester-free neural interfaces such as spinal cord stimulation implants. Biomaterials. 277: 121073. PMID 34419732 DOI: 10.1016/j.biomaterials.2021.121073  0.306
2020 Stiller AM, Usoro JO, Lawson J, Araya B, González-González MA, Danda VR, Voit WE, Black BJ, Pancrazio JJ. Mechanically Robust, Softening Shape Memory Polymer Probes for Intracortical Recording. Micromachines. 11. PMID 32630553 DOI: 10.3390/Mi11060619  0.496
2020 Guerrero E, Polednik A, Ecker M, Joshi‐Imre A, Choi W, Gutierrez‐Heredia G, Voit WE, Maeng J. Indium–Gallium–Zinc Oxide Schottky Diodes Operating across the Glass Transition of Stimuli‐Responsive Polymers Advanced Electronic Materials. 6: 1901210. DOI: 10.1002/Aelm.201901210  0.377
2019 Frewin CL, Ecker M, Joshi-Imre A, Kamgue J, Waddell J, Danda VR, Stiller AM, Voit WE, Pancrazio JJ. Electrical Properties of Thiol-ene-based Shape Memory Polymers Intended for Flexible Electronics. Polymers. 11. PMID 31108911 DOI: 10.3390/Polym11050902  0.526
2019 Hosseini SM, Voit WE, Ecker M. Environmental Dynamic Mechanical Analysis to Predict the Softening Behavior of Neural Implants. Journal of Visualized Experiments : Jove. PMID 30882794 DOI: 10.3791/59209  0.418
2019 Zátonyi A, Orbán G, Modi R, Márton G, Meszéna D, Ulbert I, Pongrácz A, Ecker M, Voit WE, Joshi-Imre A, Fekete Z. A softening laminar electrode for recording single unit activity from the rat hippocampus. Scientific Reports. 9: 2321. PMID 30787389 DOI: 10.1038/S41598-019-39835-6  0.392
2018 Stiller AM, Usoro J, Frewin CL, Danda VR, Ecker M, Joshi-Imre A, Musselman KC, Voit W, Modi R, Pancrazio JJ, Black BJ. Chronic Intracortical Recording and Electrochemical Stability of Thiol-ene/Acrylate Shape Memory Polymer Electrode Arrays. Micromachines. 9. PMID 30424433 DOI: 10.3390/Mi9100500  0.504
2018 Shoffstall AJ, Ecker M, Danda V, Joshi-Imre A, Stiller A, Yu M, Paiz JE, Mancuso E, Bedell HW, Voit WE, Pancrazio JJ, Capadona JR. Characterization of the Neuroinflammatory Response to Thiol-ene Shape Memory Polymer Coated Intracortical Microelectrodes. Micromachines. 9. PMID 30424419 DOI: 10.3390/Mi9100486  0.47
2018 González-González MA, Kanneganti A, Joshi-Imre A, Hernandez-Reynoso AG, Bendale G, Modi R, Ecker M, Khurram A, Cogan SF, Voit WE, Romero-Ortega MI. Thin Film Multi-Electrode Softening Cuffs for Selective Neuromodulation. Scientific Reports. 8: 16390. PMID 30401906 DOI: 10.1038/S41598-018-34566-6  0.417
2018 Black BJ, Ecker M, Stiller A, Rihani R, Danda VR, Reed I, Voit WE, Pancrazio JJ. In vitro compatibility testing of thiol-ene/acrylate-based shape memory polymers for use in implantable neural interfaces. Journal of Biomedical Materials Research. Part A. PMID 30371968 DOI: 10.1002/Jbm.A.36478  0.408
2018 Reeder JT, Kang T, Rains S, Voit W. 3D, Reconfigurable, Multimodal Electronic Whiskers via Directed Air Assembly. Advanced Materials (Deerfield Beach, Fla.). PMID 29357119 DOI: 10.1002/Adma.201706733  0.409
2018 Shoffstall AJ, Srinivasan S, Willis M, Stiller AM, Ecker M, Voit WE, Pancrazio JJ, Capadona JR. A Mosquito Inspired Strategy to Implant Microprobes into the Brain. Scientific Reports. 8: 122. PMID 29317748 DOI: 10.1038/S41598-017-18522-4  0.312
2018 Hosseini SM, Rihani R, Batchelor B, Stiller AM, Pancrazio JJ, Voit WE, Ecker M. Softening Shape Memory Polymer Substrates for Bioelectronic Devices With Improved Hydrolytic Stability Frontiers in Materials. 5. DOI: 10.3389/Fmats.2018.00066  0.556
2018 Daunis TB, Barrera D, Gutierrez-Heredia G, Rodriguez-Lopez O, Wang J, Voit WE, Hsu JW. Solution-processed oxide thin film transistors on shape memory polymer enabled by photochemical self-patterning Journal of Materials Research. 33: 2454-2462. DOI: 10.1557/Jmr.2018.296  0.436
2018 Ecker M, Joshi-Imre A, Modi R, Frewin CL, Garcia-Sandoval A, Maeng J, Gutierrez-Heredia G, Pancrazio JJ, Voit WE. From softening polymers to multimaterial based bioelectronic devices Multifunctional Materials. 2: 012001. DOI: 10.1088/2399-7532/AAED58  0.354
2018 Gutierrez-Heredia G, Maeng J, Conde J, Rodriguez-Lopez O, Voit WE. Effect of annealing atmosphere on IGZO thin film transistors on a deformable softening polymer substrate Semiconductor Science and Technology. 33: 095001. DOI: 10.1088/1361-6641/Aad293  0.479
2018 Gutierrez-Heredia G, Pineda-Leon H, Carrillo-Castillo A, Rodriguez-Lopez O, Tishechkin M, Ong K, Castillo J, Voit W. Lifetime of hafnium oxide dielectric in thin-film devices fabricated on deformable softening polymer substrate Materials Science in Semiconductor Processing. 88: 273-277. DOI: 10.1016/J.Mssp.2018.08.010  0.47
2017 Do DH, Ecker M, Voit WE. Characterization of a Thiol-Ene/Acrylate-Based Polymer for Neuroprosthetic Implants. Acs Omega. 2: 4604-4611. PMID 30023725 DOI: 10.1021/acsomega.7b00834  0.427
2017 Daunis TB, Gutierrez-Heredia G, Rodriguez-Lopez O, Wang J, Voit WE, Hsu JWP. Solution-deposited Al2O3 dielectric towards fully-patterned thin film transistors on shape memory polymer Proceedings of Spie. 10105. DOI: 10.1117/12.2250393  0.426
2017 Appuhamillage GA, Reagan JC, Khorsandi S, Davidson JR, Voit W, Smaldone RA. 3D printed remendable polylactic acid blends with uniform mechanical strength enabled by a dynamic Diels–Alder reaction Polymer Chemistry. 8: 2087-2092. DOI: 10.1039/C7Py00310B  0.376
2017 Ellson G, Carrier X, Walton J, Mahmood SF, Yang K, Salazar J, Voit WE. Tough thiourethane thermoplastics for fused filament fabrication Journal of Applied Polymer Science. 135: 45574. DOI: 10.1002/App.45574  0.449
2017 Gutierrez-Heredia G, Rodriguez-Lopez O, Garcia-Sandoval A, Voit WE. Highly Stable Indium-Gallium-Zinc-Oxide Thin-Film Transistors on Deformable Softening Polymer Substrates Advanced Electronic Materials. 3: 1700221. DOI: 10.1002/Aelm.201700221  0.477
2017 Yang K, Grant JC, Lamey P, Joshi-Imre A, Lund BR, Smaldone RA, Voit W. Diels-Alder Reversible Thermoset 3D Printing: Isotropic Thermoset Polymers via Fused Filament Fabrication Advanced Functional Materials. 27: 1700318. DOI: 10.1002/Adfm.201700318  0.433
2016 Reit R, Abitz H, Reddy N, Parker S, Wei A, Aragon N, Ho M, Weittenhiller A, Kang T, Ecker M, Voit WE. Thiol-epoxy/maleimide ternary networks as softening substrates for flexible electronics. Journal of Materials Chemistry. B. 4: 5367-5374. PMID 32263460 DOI: 10.1039/C6Tb01082B  0.445
2016 Simon DM, Charkhkar H, St John C, Rajendran S, Kang T, Reit R, Arreaga-Salas D, McHail DG, Knaack GL, Sloan A, Grasse D, Dumas TC, Rennaker RL, Pancrazio JJ, Voit WE. Design and Demonstration of an Intracortical Probe Technology with Tunable Modulus. Journal of Biomedical Materials Research. Part A. PMID 27615364 DOI: 10.1002/Jbm.A.35896  0.447
2016 Davidson JR, Adikari Appuhamillage G, Thompson CM, Voit WE, Smaldone RA. A Design Paradigm Utilizing Reversible Diels-Alder Reactions to Enhance the Mechanical Properties of 3D Printed Materials. Acs Applied Materials & Interfaces. PMID 27299858 DOI: 10.1021/Acsami.6B05118  0.356
2016 Parker S, Reit R, Abitz H, Ellson G, Yang K, Lund B, Voit WE. High-Tg Thiol-Click Thermoset Networks via the Thiol-Maleimide Michael Addition. Macromolecular Rapid Communications. PMID 27168131 DOI: 10.1002/Marc.201600033  0.341
2016 Ajieren H, Reit R, Lee R, Pham T, Shao D, Lee K, Voit W. Robotic Insertion Aid for Self-Coiling Cochlear Implants Mrs Advances. 1: 51-56. DOI: 10.1557/Adv.2016.71  0.341
2016 Maaraoui KV, Ellson G, Voit W. Hybrid cured thiol-ene/epoxy networks for core-shell semiconductor packaging Mrs Advances. 1: 57-62. DOI: 10.1557/Adv.2016.59  0.356
2016 Reit R, Abitz H, Reddy N, Parker S, Wei A, Aragon N, Ho M, Weittenhiller A, Kang T, Ecker M, Voit WE. Thiol-epoxy/maleimide ternary networks as softening substrates for flexible electronics Journal of Materials Chemistry B. 4: 5367-5374. DOI: 10.1039/c6tb01082b  0.34
2016 Batchelor BL, Mahmood SF, Jung M, Shin H, Kulikov OV, Voit W, Novak BM, Yang DJ. Plasticization for melt viscosity reduction of melt processable carbon fiber precursor Carbon. 98: 681-688. DOI: 10.1016/J.Carbon.2015.10.096  0.345
2016 Ecker M, Danda V, Shoffstall AJ, Mahmood SF, Joshi-Imre A, Frewin CL, Ware TH, Capadona JR, Pancrazio JJ, Voit WE. Sterilization of Thiol-ene/Acrylate Based Shape Memory Polymers for Biomedical Applications Macromolecular Materials and Engineering. DOI: 10.1002/Mame.201600331  0.739
2015 Haldorai Y, Hwang SK, Gopalan AI, Huh YS, Han YK, Voit W, Sai-Anand G, Lee KP. Direct electrochemistry of cytochrome c immobilized on titanium nitride/multi-walled carbon nanotube composite for amperometric nitrite biosensor. Biosensors & Bioelectronics. 79: 543-552. PMID 26748372 DOI: 10.1016/J.Bios.2015.12.054  0.301
2015 Reit R, Zamorano D, Parker S, Simon D, Lund BR, Voit WE, Ware T. Hydrolytically Stable Thiol-ene Networks for Flexible Bioelectronics. Acs Applied Materials & Interfaces. PMID 26650346 DOI: 10.1021/Acsami.5B10593  0.686
2015 Arreaga-Salas DE, Avendano-Bolivar AE, Simon D, Reit R, Garcia-Sandoval A, Rennaker R, Voit WE. Integration of high charge injection capacity electrodes onto polymer softening neural interfaces. Acs Applied Materials & Interfaces. PMID 26575084 DOI: 10.1021/Acsami.5B08139  0.763
2015 Yokota T, Inoue Y, Terakawa Y, Reeder J, Kaltenbrunner M, Ware T, Yang K, Mabuchi K, Murakawa T, Sekino M, Voit W, Sekitani T, Someya T. Ultraflexible, large-area, physiological temperature sensors for multipoint measurements. Proceedings of the National Academy of Sciences of the United States of America. PMID 26554008 DOI: 10.1073/Pnas.1515650112  0.63
2015 Wei A, Reit R, Voit W. Investigating thiol-epoxy composites for semiconductor die attach adhesives Materials Research Society Symposium Proceedings. 1718: 27-31. DOI: 10.1557/Opl.2015.539  0.416
2015 Wobser V, Yang K, Modi R, Archer W, Patel Y, Voit W. Light-Activated Hydrophobic Adhesive for Shape-Memory Polymer Nerve Cuffs Mrs Advances. 1: 1-7. DOI: 10.1557/Adv.2015.42  0.486
2015 Choi S, Fuentes-Hernandez C, Wang CY, Wei A, Voit W, Zhang Y, Barlow S, Marder SR, Kippelen B. Top-gate organic field-effect transistors fabricated on shapememory polymer substrates Proceedings of Spie - the International Society For Optical Engineering. 9568. DOI: 10.1117/12.2188684  0.307
2015 Ellson G, Prima MD, Ware T, Tang X, Voit W. Tunable thiol-epoxy shape memory polymer foams Smart Materials and Structures. 24. DOI: 10.1088/0964-1726/24/5/055001  0.731
2015 Gaj MP, Wei A, Fuentes-Hernandez C, Zhang Y, Reit R, Voit W, Marder SR, Kippelen B. Organic light-emitting diodes on shape memory polymer substrates for wearable electronics Organic Electronics: Physics, Materials, Applications. 25: 151-155. DOI: 10.1016/J.Orgel.2015.06.029  0.455
2014 Reeder J, Kaltenbrunner M, Ware T, Arreaga-Salas D, Avendano-Bolivar A, Yokota T, Inoue Y, Sekino M, Voit W, Sekitani T, Someya T. Mechanically adaptive organic transistors for implantable electronics Advanced Materials. 26: 4967-4973. PMID 24733490 DOI: 10.1002/Adma.201400420  0.737
2014 Ware T, Simon D, Liu C, Musa T, Vasudevan S, Sloan A, Keefer EW, Rennaker RL, Voit W. Thiol-ene/acrylate substrates for softening intracortical electrodes. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. 102: 1-11. PMID 23666562 DOI: 10.1002/Jbmb.32946  0.678
2014 Baur C, Zhou Y, Sipes J, Priya S, Voit W. Organic, Flexible, Polymer Composites for High-Temperature Piezoelectric Applications Energy Harvesting and Systems. 1. DOI: 10.1515/ehs-2013-0015  0.365
2014 Ware T, Jennings AR, Bassampour ZS, Simon D, Son DY, Voit W. Degradable, silyl ether thiol-ene networks Rsc Advances. 4: 39991-40002. DOI: 10.1039/C4Ra06997H  0.671
2014 Shaffer S, Yang K, Vargas J, Di Prima MA, Voit W. On reducing anisotropy in 3D printed polymers via ionizing radiation Polymer. 55: 5969-5979. DOI: 10.1016/J.Polymer.2014.07.054  0.476
2014 Haque MH, Upadhyaya P, Roy S, Ware T, Voit W, Lu H. The changes in flexural properties and microstructures of carbon fiber bismaleimide composite after exposure to a high temperature Composite Structures. 108: 57-64. DOI: 10.1016/J.Compstruct.2013.09.011  0.617
2014 Reit R, Lund B, Voit W. Shape Memory Polymer–Inorganic Hybrid Nanocomposites Advances in Polymer Science. 267: 313-350. DOI: 10.1007/12_2014_290  0.536
2013 Hearon K, Nash LD, Volk BL, Ware T, Lewicki JP, Voit WE, Wilson TS, Maitland DJ. Electron Beam Crosslinked Polyurethane Shape Memory Polymers with Tunable Mechanical Properties. Macromolecular Chemistry and Physics. 214: 1258-1272. PMID 25411531 DOI: 10.1002/Macp.201200348  0.735
2013 Hearon K, Besset CJ, Lonnecker AT, Ware T, Voit WE, Wilson TS, Wooley KL, Maitland DJ. A Structural Approach to Establishing a Platform Chemistry for the Tunable, Bulk Electron Beam Cross-Linking of Shape Memory Polymer Systems. Macromolecules. 46: 8905-8916. PMID 25411511 DOI: 10.1021/Ma4018372  0.713
2013 Ware T, Simon D, Hearon K, Kang TH, Maitland DJ, Voit W. Thiol-click chemistries for responsive neural interfaces. Macromolecular Bioscience. 13: 1640-7. PMID 24115484 DOI: 10.1002/Mabi.201300272  0.673
2013 Simon D, Ware T, Marcotte R, Lund BR, Smith DW, Di Prima M, Rennaker RL, Voit W. A comparison of polymer substrates for photolithographic processing of flexible bioelectronics. Biomedical Microdevices. 15: 925-39. PMID 23852172 DOI: 10.1007/S10544-013-9782-8  0.73
2013 Avendano-Bolivar A, Ware T, Arreaga-Salas D, Simon D, Voit W. Mechanical cycling stability of organic thin film transistors on shape memory polymers Advanced Materials. 25: 3095-3099. PMID 23703745 DOI: 10.1002/Adma.201203976  0.764
2013 Ware T, Simon D, Arreaga-Salas D, Avendano-Bolivar A, Reeder J, Voit W. Advances in Flexible Electronics based on Shape Memory Polymers The Japan Society of Applied Physics. DOI: 10.7567/Ssdm.2013.N-1-1  0.764
2013 Ware T, Simon D, Rennaker RL, Voit W. Smart polymers for neural interfaces Polymer Reviews. 53: 108-129. DOI: 10.1080/15583724.2012.751924  0.736
2013 Dei DK, Lund BR, Wu J, Simon D, Ware T, Voit WE, MacFarlane D, Liff SM, Smith DW. High performance and multipurpose triarylamine-enchained semifluorinated polymers Acs Macro Letters. 2: 35-39. DOI: 10.1021/Mz300532Z  0.7
2012 Dei DK, Lund BR, Wu J, Simon D, Ware T, Voit WE, MacFarlane D, Liff SM, Smith DW. High Performance and Multipurpose Triarylamine-Enchained Semifluorinated Polymers. Acs Macro Letters. 2: 35-39. PMID 35581822 DOI: 10.1021/mz300532z  0.676
2012 Ware T, Simon D, Hearon K, Liu C, Shah S, Reeder J, Khodaparast N, Kilgard MP, Maitland DJ, Rennaker RL, Voit WE. Three-Dimensional Flexible Electronics Enabled by Shape Memory Polymer Substrates for Responsive Neural Interfaces. Macromolecular Materials and Engineering. 297: 1193-1202. PMID 25530708 DOI: 10.1002/Mame.201200241  0.717
2012 Lima MD, Li N, Jung de Andrade M, Fang S, Oh J, Spinks GM, Kozlov ME, Haines CS, Suh D, Foroughi J, Kim SJ, Chen Y, Ware T, Shin MK, Machado LD, ... ... Voit WE, et al. Electrically, chemically, and photonically powered torsional and tensile actuation of hybrid carbon nanotube yarn muscles. Science (New York, N.Y.). 338: 928-32. PMID 23161994 DOI: 10.1126/Science.1226762  0.604
2012 Ware T, Hearon K, Lonnecker A, Wooley KL, Maitland DJ, Voit W. Triple-Shape Memory Polymers Based on Self-Complementary Hydrogen Bonding. Macromolecules. 45: 1062-1069. PMID 22287811 DOI: 10.1021/Ma202098S  0.711
2012 Ware T, Simon D, Arreaga-Salas DE, Reeder J, Rennaker R, Keefer EW, Voit W. Fabrication of responsive, softening neural interfaces Advanced Functional Materials. 22: 3470-3479. DOI: 10.1002/Adfm.201200200  0.728
2011 Ware T, Ellson G, Kwasnik A, Drewicz S, Gall K, Voit W. Tough shape-memory polymer-fiber composites Journal of Reinforced Plastics and Composites. 30: 371-380. DOI: 10.1177/0731684410395418  0.735
2010 Ware T, Voit W, Gall K. Effects of sensitizer length on radiation crosslinked shape-memory polymers Radiation Physics and Chemistry. 79: 446-453. DOI: 10.1016/J.Radphyschem.2009.10.006  0.745
2010 Voit W, Ware T, Gall K. Radiation crosslinked shape-memory polymers Polymer. 51: 3551-3559. DOI: 10.1016/J.Polymer.2010.05.049  0.778
2010 Voit W, Ware T, Dasari RR, Smith P, Danz L, Simon D, Barlow S, Marder SR, Gall K. High-strain shape-memory polymers Advanced Functional Materials. 20: 162-171. DOI: 10.1002/Adfm.200901409  0.76
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