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Aleksandar Radisic, Ph.D. - Publications

Affiliations: 
2005 Johns Hopkins University, Baltimore, MD 
Area:
Materials Science Engineering
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30 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Nagar M, Radisic A, Strubbe K, Vereecken PM. The Effect of the Substrate Characteristics on the Electrochemical Nucleation and Growth of Copper Journal of the Electrochemical Society. 163: D3053-D3061. DOI: 10.1149/2.0081612JES  0.461
2014 Nagar M, Radisic A, Strubbe K, Vereecken PM. The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating Electrochimica Acta. 127: 315-326. DOI: 10.1016/j.electacta.2014.02.052  0.405
2013 Armini S, El-Mekki Z, Nagar M, Radisic A, Ruythooren W, Vereecken PM. Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below? Ecs Transactions. 58: 3-15. DOI: 10.1149/05817.0003ecst  0.323
2013 Nagar M, Radisic A, Strubbe K, Vereecken PM. The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates Electrochimica Acta. 92: 474-483. DOI: 10.1016/j.electacta.2013.01.037  0.445
2012 Nagar M, Radisic A, Strubbe K, Vereecken PM. Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive Ecs Transactions. 41: 99-110. DOI: 10.1149/1.3699384  0.336
2012 Nagar M, Vereecken PM, Strubbe K, Radisic A. Nucleation and growth of copper on ru-based substrates: I. The effect of the inorganic components Ecs Transactions. 41: 75-82. DOI: 10.1149/1.3699382  0.346
2011 Armini S, Demuynck S, El-Mekki Z, Swerts J, Nagar M, Radisic A, Heylen N, Beyer G, Leunissen L, Vereecken PM. Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and 1/2 pitch lines: From coupon to full-wafer experiments Ecs Transactions. 35: 117-123. DOI: 10.1149/1.3568853  0.323
2011 Guo L, Oskam G, Radisic A, Hoffmann PM, Searson PC. Island growth in electrodeposition Journal of Physics D: Applied Physics. 44. DOI: 10.1088/0022-3727/44/44/443001  0.698
2011 Armini S, Tokei Z, Volders H, El-Mekki Z, Radisic A, Beyer G, Ruythooren W, Vereecken PM. Impact of "terminal effect" on Cu electrochemical deposition: Filling capability for different metallization options Microelectronic Engineering. 88: 754-759. DOI: 10.1016/j.mee.2010.08.013  0.304
2010 Armini S, Wilson CJ, Moussa A, Franquet A, Vanstreels K, Atanasova T, Radisic A, Civale Y, Redolfi A, Van Ammel A, El-Mekki Z, Bryce G, Ruythooren W. Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs Ecs Transactions. 28: 77-87. DOI: 10.1149/1.3502446  0.339
2010 Nagar M, Vereecken PM, Radisic A, Strubbe K. Tailoring copper island density for copper plating on a RuTa substrate Ecs Transactions. 28: 9-16. DOI: 10.1149/1.3502439  0.403
2010 Radisic A, Nagar M, Strubbe K, Armini S, El-Mekki Z, Volders H, Ruythooren W, Vereecken PM. Copper plating on resistive substrates, diffusion barrier and alternative seed layers Ecs Transactions. 25: 175-184. DOI: 10.1149/1.3318516  0.31
2010 Luhn O, Radisic A, Van Hoof C, Ruythooren W, Celis JP. Monitoring the superfilling of blind holes with electrodeposited copper Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3301623  0.314
2009 Lühn O, Radisic A, Vereecken PM, Van Hoof C, Ruythooren W, Celis JP. Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration Electrochemical and Solid-State Letters. 12. DOI: 10.1149/1.3087790  0.31
2008 Radisic A, Boelen P, Rosenfeld A, Hernandez JL, Beyer GP, Vereecken PM. Electrochemical nucleation and growth of copper on resistive substrates Ecs Transactions. 11: 25-33. DOI: 10.1149/1.2931339  0.408
2008 Lühn O, Radisic A, Vereecken PM, Swinnen B, Van Hoof C, Ruythooren W, Celis JP. Reducing the electrodeposition time for filling microvias with copper for 3D technology Proceedings - Electronic Components and Technology Conference. 866-870. DOI: 10.1109/ECTC.2008.4550078  0.338
2007 Radisic A, Hernandez JL, Tokei Z, Beyer GP, Vereecken PM. Electrochemical deposition of manganese and copper-manganese alloy on silicon Ecs Transactions. 3: 69-76. DOI: 10.1149/1.2721519  0.351
2006 Nikolov V, Radisic A, Hristova K, Searson PC. Bias-dependent admittance in hybrid bilayer membranes. Langmuir : the Acs Journal of Surfaces and Colloids. 22: 7156-8. PMID 16893210 DOI: 10.1021/La061562K  0.446
2006 Radisic A, Ross FM, Searson PC. In situ study of the growth kinetics of individual island electrodeposition of copper. The Journal of Physical Chemistry. B. 110: 7862-8. PMID 16610883 DOI: 10.1021/jp057549a  0.618
2006 Radisic A, Vereecken PM, Hannon JB, Searson PC, Ross FM. Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data. Nano Letters. 6: 238-42. PMID 16464042 DOI: 10.1021/Nl052175I  0.602
2006 Guo L, Radisic A, Searson PC. Electrodeposition of copper on oxidized ruthenium Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2354454  0.687
2006 Drews TO, Radisic A, Erlebacher J, Braatz RD, Searson PC, Alkire RC. Stochastic simulation of the early stages of kinetically limited electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2191167  0.582
2006 Pesika NS, Radisic A, Stebe KJ, Searson PC. Fabrication of complex architectures using electrodeposition into patterned self-assembled monolayers Nano Letters. 6: 1023-1026. DOI: 10.1021/Nl060368F  0.609
2006 Radisic A, Vereecken PM, Searson PC, Ross FM. The morphology and nucleation kinetics of copper islands during electrodeposition Surface Science. 600: 1817-1826. DOI: 10.1016/J.Susc.2006.02.025  0.597
2005 Guo L, Radisic A, Searson PC. Kinetic Monte Carlo simulations of nucleation and growth in electrodeposition. The Journal of Physical Chemistry. B. 109: 24008-15. PMID 16375391 DOI: 10.1021/Jp055077U  0.666
2004 Radisic A, Oskam G, Searson PC. Influence of oxide thickness on nucleation and growth of copper on tantalum Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1738673  0.605
2003 Radisic A, Cao Y, Taephaisitphongse P, West AC, Searson PC. Direct copper electrodeposition on TaN barrier layers Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1565137  0.638
2002 Radisic A, West AC, Searson PC. Influence of additives on nucleation and growth of copper on n-Si(111) from acidic sulfate solutions Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1430719  0.654
2001 Radisic A, Long JG, Hoffmann PM, Searson PC. Nucleation and growth of copper on TiN from pyrophosphate solution Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1344539  0.686
2000 Hoffmann PM, Radisic A, Searson PC. Growth kinetics for copper deposition on Si(100) from pyrophosphate solution Journal of the Electrochemical Society. 147: 2576-2580. DOI: 10.1149/1.1393571  0.689
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