| Year |
Citation |
Score |
| 2021 |
Liu L, Ngo KD, Lu G. Effects of SiO2 inclusions on sintering and permeability of NiCuZn ferrite for additive manufacturing of power magnets Journal of the European Ceramic Society. 41: 466-471. DOI: 10.1016/J.Jeurceramsoc.2020.08.004 |
0.328 |
|
| 2020 |
Li D, Mei Y, Xin Y, Li Z, Chu PK, Ma C, Lu G. Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature Ieee Transactions On Power Electronics. 35: 12646-12650. DOI: 10.1109/Tpel.2020.2994343 |
0.416 |
|
| 2020 |
Zhang X, Wang M, Li X, Ding Z, Ma C, Lu G, Mei Y. A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules Ieee Transactions On Power Electronics. 35: 8532-8539. DOI: 10.1109/Tpel.2019.2963236 |
0.373 |
|
| 2020 |
Liu J, Mei Y, Lu S, Li X, Lu G. Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC–DC Converter Ieee Transactions On Power Electronics. 35: 826-834. DOI: 10.1109/Tpel.2019.2907770 |
0.36 |
|
| 2020 |
Ding C, Liu L, Moss J, Mullenix J, Ngo KDT, Lu G. Reliability Assessment of Magnetic Cores and 3-D-Printed Constant-Flux Inductors Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1693-1699. DOI: 10.1109/Tcpmt.2020.2992190 |
0.339 |
|
| 2020 |
Jin J, Mei Y, Chen G, Chen X, Lu G. Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 982-989. DOI: 10.1109/Tcpmt.2020.2965117 |
0.371 |
|
| 2020 |
Liu L, Nam D, Guo B, Ewanchuk J, Burgos R, Lu G. Glass for Encapsulating High Temperature Power Modules Ieee Journal of Emerging and Selected Topics in Power Electronics. 1-1. DOI: 10.1109/Jestpe.2020.3004021 |
0.401 |
|
| 2020 |
DiMarino C, Mouawad B, Johnson CM, Wang M, Tan Y, Lu G, Boroyevich D, Burgos R. Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module Ieee Journal of Emerging and Selected Topics in Power Electronics. 8: 381-394. DOI: 10.1109/Jestpe.2019.2944138 |
0.344 |
|
| 2020 |
Tan Y, Li X, Chen G, Gao Q, Lu G, Chen X. Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint International Journal of Adhesion and Adhesives. 97: 102488. DOI: 10.1016/J.Ijadhadh.2019.102488 |
0.396 |
|
| 2019 |
Ding C, Mei Y, Ngo KDT, Lu G. A (Permalloy + NiZn Ferrite) Moldable Magnetic Composite for Heterogeneous Integration of Power Electronics. Materials (Basel, Switzerland). 12. PMID 31234493 DOI: 10.3390/Ma12121999 |
0.351 |
|
| 2019 |
Liu L, Ding C, Mei Y, Lu G. Tailoring a Silver Paste for Additive Manufacturing of Co-Fired Ferrite Magnetic Components. Materials (Basel, Switzerland). 12. PMID 30862005 DOI: 10.3390/Ma12050817 |
0.32 |
|
| 2019 |
Miao Z, Mao Y, Lu G, Ngo KDT. Magnetic Integration Into a Silicon Carbide Power Module for Current Balancing Ieee Transactions On Power Electronics. 34: 11026-11035. DOI: 10.1109/Tpel.2019.2899393 |
0.329 |
|
| 2019 |
Wang M, Mei Y, Li X, Burgos R, Boroyevich D, Lu G. Pressureless Silver Sintering on Nickel for Power Module Packaging Ieee Transactions On Power Electronics. 34: 7121-7125. DOI: 10.1109/Tpel.2019.2893238 |
0.44 |
|
| 2019 |
Gao S, Yang Z, Tan Y, Li X, Chen X, Sun Z, Lu G. Bonding of Large Substrates by Silver Sintering and Characterization of the Interface Thermal Resistance Ieee Transactions On Industry Applications. 55: 1828-1834. DOI: 10.1109/Tia.2018.2879957 |
0.473 |
|
| 2019 |
Liu W, Mei Y, Xie Y, Wang M, Li X, Lu G. Design and Characterizations of a Planar Multichip Half-Bridge Power Module by Pressureless Sintering of Nanosilver Paste Ieee Journal of Emerging and Selected Topics in Power Electronics. 7: 1627-1636. DOI: 10.1109/Jestpe.2019.2905773 |
0.433 |
|
| 2019 |
Tan Y, Li X, Chen X, Yang Z, Lu G. Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates Soldering & Surface Mount Technology. 32: 129-136. DOI: 10.1108/Ssmt-07-2019-0023 |
0.471 |
|
| 2019 |
Wang M, Mei Y, Li X, Lu G. Die-attach on nickel substrate by pressureless sintering a trimodal silver paste Materials Letters. 253: 131-135. DOI: 10.1016/J.Matlet.2019.06.041 |
0.426 |
|
| 2019 |
Wang X, Mei Y, Li X, Wang M, Cui Z, Lu G. Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications Journal of Alloys and Compounds. 777: 578-585. DOI: 10.1016/J.Jallcom.2018.10.294 |
0.333 |
|
| 2019 |
Du C, Li X, Mei Y, Lu G. An explanation of sintered silver bonding formation on bare copper substrate in air Applied Surface Science. 490: 403-410. DOI: 10.1016/J.Apsusc.2019.06.105 |
0.372 |
|
| 2019 |
Du C, Li X, Mei Y, Lu G. Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures Journal of Materials Science: Materials in Electronics. 30: 12860-12868. DOI: 10.1007/S10854-019-01601-9 |
0.421 |
|
| 2019 |
Yan H, Mei Y, Wang M, Li X, Lu G. Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules Journal of Materials Science: Materials in Electronics. 30: 9634-9641. DOI: 10.1007/S10854-019-01297-X |
0.36 |
|
| 2018 |
Yan Y, Sun W, Gao S, Ge T, Ngo KDT, Lu G. Design, Fabrication, and Characterization of a Low-Temperature Curable Magnetic Composite for Power Electronics Integration Ieee Transactions On Magnetics. 54: 1-6. DOI: 10.1109/Tmag.2017.2757020 |
0.348 |
|
| 2018 |
Liu L, Ding C, Lu S, Ge T, Yan Y, Mei Y, Ngo KDT, Lu G. Design and Additive Manufacturing of Multipermeability Magnetic Cores Ieee Transactions On Industry Applications. 54: 3541-3547. DOI: 10.1109/Tia.2018.2819963 |
0.311 |
|
| 2018 |
Yan H, Mei Y, Li X, Ma C, Lu G. A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere Ieee Transactions On Electron Devices. 65: 4499-4505. DOI: 10.1109/Ted.2018.2867362 |
0.433 |
|
| 2018 |
Gao S, Yuki S, Osanai H, Sun W, Ngo KDT, Lu G. Effect of Surface Roughening of Temperature-Cycled Ceramic-Metal-Bonded Substrates on Thermomechanical Reliability of Sintered-Silver Joints Ieee Transactions On Device and Materials Reliability. 18: 291-297. DOI: 10.1109/Tdmr.2018.2836190 |
0.494 |
|
| 2018 |
Tan Y, Li X, Chen X, Lu G, Mei Y. Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 202-209. DOI: 10.1109/Tcpmt.2017.2773100 |
0.521 |
|
| 2018 |
Liu L, Ge T, Ngo KDT, Mei Y, Lu G. Ferrite Paste Cured With Ultraviolet Light for Additive Manufacturing of Magnetic Components for Power Electronics Ieee Magnetics Letters. 9: 1-5. DOI: 10.1109/Lmag.2018.2822622 |
0.32 |
|
| 2018 |
Wang M, Mei Y, Li X, Burgos R, Boroyevich D, Lu G. How to determine surface roughness of copper substrate for robust pressureless sintered silver in air Materials Letters. 228: 327-330. DOI: 10.1016/J.Matlet.2018.06.048 |
0.38 |
|
| 2018 |
Li J, Li X, Wang L, Mei Y, Lu G. A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air Materials & Design. 140: 64-72. DOI: 10.1016/J.Matdes.2017.11.054 |
0.515 |
|
| 2018 |
Liu J, Mei Y, Liu W, Li X, Hou F, Lu G. Effects of sintering temperature on properties of toroid cores using NiZnCu ferrites for power applications at >1 MHz Journal of Magnetism and Magnetic Materials. 454: 6-12. DOI: 10.1016/J.Jmmm.2018.01.031 |
0.442 |
|
| 2017 |
Ge T, Yan Y, Lu G, Ngo K. Over-Molded Inductor (OMI)—Feasibility Demonstration in a DC–DC Converter Ieee Transactions On Industrial Electronics. 64: 5738-5740. DOI: 10.1109/Tie.2017.2677316 |
0.364 |
|
| 2017 |
Liu L, Yan Y, Ngo KDT, Lu G. NiCuZn Ferrite Cores by Gelcasting: Processing and Properties Ieee Transactions On Industry Applications. 53: 5728-5733. DOI: 10.1109/Tia.2017.2746038 |
0.414 |
|
| 2017 |
Yan Y, Moss J, Ngo KDT, Mei Y, Lu G. Additive Manufacturing of Toroid Inductor for Power Electronics Applications Ieee Transactions On Industry Applications. 53: 5709-5714. DOI: 10.1109/Tia.2017.2729504 |
0.31 |
|
| 2017 |
Stuckner JA, Lu G, Mitsuhara M, Reynolds WT, Murayama M. The Influence of Processing Conditions on the 3-D Interconnected Structure of Nanosilver Paste Ieee Transactions On Electron Devices. 64: 494-499. DOI: 10.1109/Ted.2016.2639363 |
0.419 |
|
| 2017 |
Tan Y, Li X, Chen X, Lu G. Elevated-temperature shear creep evolution and life prediction of sintered nano-silver lap-shear joint Journal of Materials Science: Materials in Electronics. 29: 303-312. DOI: 10.1007/S10854-017-7917-Z |
0.415 |
|
| 2016 |
Feng ST, Mei YH, Chen G, Li X, Lu GQ. Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips. Materials (Basel, Switzerland). 9. PMID 28773686 DOI: 10.3390/ma9070564 |
0.385 |
|
| 2016 |
Yang CX, Li X, Lu GQ, Mei YH. Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature Materials Science and Engineering A. 660: 71-76. DOI: 10.1016/J.Msea.2016.02.082 |
0.481 |
|
| 2016 |
Berry D, Townsend A, He W, Zheng H, Ngo KD, Lu G. Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection Microelectronics Reliability. 63: 104-110. DOI: 10.1016/J.Microrel.2016.04.008 |
0.446 |
|
| 2016 |
Xu Q, Mei Y, Li X, Lu GQ. Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates Journal of Alloys and Compounds. 675: 317-324. DOI: 10.1016/J.Jallcom.2016.03.133 |
0.444 |
|
| 2016 |
Li H, Jing H, Han Y, Lu GQ, Xu L, Liu T. Interface evolution analysis of graded thermoelectric materials joined by low temperature sintering of nano-silver paste Journal of Alloys and Compounds. 659: 95-100. DOI: 10.1016/j.jallcom.2015.11.057 |
0.301 |
|
| 2016 |
Zhao SY, Li X, Mei YH, Lu GQ. Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu) Journal of Electronic Materials. 45: 5789-5799. DOI: 10.1007/S11664-016-4739-3 |
0.479 |
|
| 2016 |
Zhao SY, Li X, Mei YH, Lu GQ. Novel interface material used in high power electronic die-attaching on bare Cu substrates Journal of Materials Science: Materials in Electronics. 27: 10941-10950. DOI: 10.1007/S10854-016-5208-8 |
0.411 |
|
| 2015 |
Kong YF, Li X, Mei YH, Lu GQ. Effects of die-attach material and ambient temperature on properties of high-power COB blue LED module Ieee Transactions On Electron Devices. 62: 2251-2256. DOI: 10.1109/Ted.2015.2436820 |
0.478 |
|
| 2015 |
Zheng H, Ngo KDT, Lu G. Temperature Cycling Reliability Assessment of Die Attachment on Bare Copper by Pressureless Nanosilver Sintering Ieee Transactions On Device and Materials Reliability. 15: 214-219. DOI: 10.1109/Tdmr.2015.2417114 |
0.478 |
|
| 2015 |
Yao Y, Lu GQ, Boroyevich D, Ngo KDT. Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2014.2337300 |
0.473 |
|
| 2015 |
Zhao SY, Li X, Mei YH, Lu GQ. Silver paste pressureless sintering on bare copper substrates for large area chip bonding in high power electronic packaging Icep-Iaac 2015 - 2015 International Conference On Electronic Packaging and Imaps All Asia Conference. 491-494. DOI: 10.1109/ICEP-IAAC.2015.7111065 |
0.305 |
|
| 2015 |
Zhao SY, Li X, Mei YH, Lu GQ. Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate Microelectronics Reliability. 55: 2524-2531. DOI: 10.1016/J.Microrel.2015.10.017 |
0.479 |
|
| 2015 |
Zheng H, Ngo KDT, Lu GQ. Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules Microelectronics Reliability. 55: 2575-2581. DOI: 10.1016/J.Microrel.2015.08.016 |
0.365 |
|
| 2015 |
Fu S, Mei Y, Li X, Ning P, Lu GQ. Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging Journal of Electronic Materials. 44: 3973-3984. DOI: 10.1007/S11664-015-3842-1 |
0.46 |
|
| 2015 |
Yan Y, Ngo KDT, Hou D, Mu M, Mei Y, Lu GQ. Effect of Sintering Temperature on Magnetic Core-Loss Properties of a NiCuZn Ferrite for High-Frequency Power Converters Journal of Electronic Materials. 44: 3788-3794. DOI: 10.1007/S11664-015-3836-Z |
0.409 |
|
| 2014 |
Xiao K, Ngo KD, Lu G. A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line Journal of Materials Research. 29: 1006-1017. DOI: 10.1557/Jmr.2014.42 |
0.756 |
|
| 2014 |
Fukumoto A, Berry D, Ngo KDT, Lu GQ. Effects of extreme temperature swings (-55 °C to 250 °C) on silicon nitride active metal brazing substrates Ieee Transactions On Device and Materials Reliability. 14: 751-756. DOI: 10.1109/Tdmr.2014.2320057 |
0.485 |
|
| 2014 |
Mei YH, Lian JY, Chen X, Chen G, Li X, Lu GQ. Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver Ieee Transactions On Device and Materials Reliability. 14: 194-202. DOI: 10.1109/Tdmr.2013.2280668 |
0.455 |
|
| 2014 |
Mei YH, Cao Y, Chen G, Li X, Lu GQ, Chen X. Characterization and reliability of sintered nanosilver joints by a rapid current-assisted method for power electronics packaging Ieee Transactions On Device and Materials Reliability. 14: 262-267. DOI: 10.1109/Tdmr.2013.2278979 |
0.422 |
|
| 2014 |
Zheng H, Berry D, Ngo KDT, Lu G. Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 377-384. DOI: 10.1109/Tcpmt.2013.2296882 |
0.432 |
|
| 2014 |
Jiang L, Lei TG, Ngo KDT, Lu G, Luo S. Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 751-761. DOI: 10.1109/Tcpmt.2013.2296315 |
0.463 |
|
| 2014 |
Yao Y, Lu GQ, Boroyevich D, Ngo KDT. Effect of Al2O3 fibers on the high-temperature stability of silicone elastomer Polymer (United Kingdom). 55: 4232-4240. DOI: 10.1016/J.Polymer.2014.05.044 |
0.407 |
|
| 2014 |
Fu S, Mei Y, Lu GQ, Li X, Chen G, Chen X. Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packaging Materials Letters. 128: 42-45. DOI: 10.1016/J.Matlet.2014.04.127 |
0.488 |
|
| 2014 |
Chen G, Yu L, Mei YH, Li X, Chen X, Lu GQ. Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging Journal of Materials Processing Technology. 214: 1900-1908. DOI: 10.1016/J.Jmatprotec.2014.04.007 |
0.404 |
|
| 2014 |
Yao Y, Chen Z, Lu G, Boroyevich D, Ngo KDT. Dielectric strength of Al2O3/silicone composites after high-temperature aging Journal of Applied Polymer Science. 131: n/a-n/a. DOI: 10.1002/App.41170 |
0.382 |
|
| 2013 |
Yan Y, Guan Y, Chen X, Lu G. Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode Journal of Electronic Packaging. 135. DOI: 10.1115/1.4025247 |
0.355 |
|
| 2013 |
Mei Y, Cao Y, Chen G, Li X, Lu GQ, Chen X. Rapid sintering nanosilver joint by pulse current for power electronics packaging Ieee Transactions On Device and Materials Reliability. 13: 258-265. DOI: 10.1109/Tdmr.2012.2237552 |
0.483 |
|
| 2013 |
Xiao K, Calata JN, Zheng H, Ngo KDT, Lu G. Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200 $^{\circ}{\rm C}$ Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1271-1278. DOI: 10.1109/Tcpmt.2013.2261439 |
0.774 |
|
| 2013 |
Zheng H, Berry D, Calata JN, Ngo KDT, Luo S, Lu G. Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 915-922. DOI: 10.1109/Tcpmt.2013.2258971 |
0.802 |
|
| 2013 |
Mei Y, Chen G, Li X, Lu GQ, Chen X. Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste Soldering and Surface Mount Technology. 25: 107-116. DOI: 10.1108/09540911311309077 |
0.475 |
|
| 2013 |
Li X, Chen G, Wang L, Mei YH, Chen X, Lu GQ. Creep properties of low-temperature sintered nano-silver lap shear joints Materials Science and Engineering A. 579: 108-113. DOI: 10.1016/J.Msea.2013.05.001 |
0.432 |
|
| 2013 |
Li X, Chen G, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force Microelectronics Reliability. 53: 174-181. DOI: 10.1016/J.Microrel.2012.07.028 |
0.409 |
|
| 2013 |
Calata JN, Lu G, Ngo K. Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application Journal of Electronic Materials. 43: 126-131. DOI: 10.1007/S11664-013-2866-7 |
0.758 |
|
| 2013 |
Calata JN, Lu G, Ngo K, Nguyen L. Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature Journal of Electronic Materials. 43: 109-116. DOI: 10.1007/S11664-013-2783-9 |
0.814 |
|
| 2012 |
Yan Y, Chen X, Liu X, Mei Y, Lu GQ. Die bonding of high power 808 nm laser diodes with nanosilver paste Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4007271 |
0.39 |
|
| 2012 |
Chen G, Han D, Mei YH, Cao X, Wang T, Chen X, Lu GQ. Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver Ieee Transactions On Device and Materials Reliability. 12: 124-132. DOI: 10.1109/TDMR.2011.2173573 |
0.311 |
|
| 2012 |
Chen G, Cao Y, Mei Y, Han D, Lu GQ, Chen X. Pressure-assisted low-temperature sintering of nanosilver paste for 5×5-mm2 chip attachment Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1759-1767. DOI: 10.1109/Tcpmt.2012.2214481 |
0.516 |
|
| 2012 |
Cao X, Lu G, Ngo KDT. Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1247-1259. DOI: 10.1109/Tcpmt.2012.2196799 |
0.4 |
|
| 2012 |
Yao Y, Chen Z, Lu G, Boroyevich D, Ngo KDT. Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 539-547. DOI: 10.1109/Tcpmt.2011.2173344 |
0.429 |
|
| 2012 |
Li X, Chen G, Chen X, Lu GQ, Wang L, Mei YH. Mechanical property evaluation of nano-Silver paste sintered joint using lap-Shear test Soldering and Surface Mount Technology. 24: 120-126. DOI: 10.1108/09540911211214695 |
0.385 |
|
| 2012 |
Mei Y, Wang T, Cao X, Chen G, Lu GQ, Chen X. Transient thermal impedance measurements on low-temperature-sintered nanoscale silver joints Journal of Electronic Materials. 41: 3152-3160. DOI: 10.1007/S11664-012-2233-0 |
0.455 |
|
| 2012 |
Wang T, Zhao M, Chen X, Lu G, Ngo K, Luo S. Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste Journal of Electronic Materials. 41: 2543-2552. DOI: 10.1007/S11664-012-2134-2 |
0.397 |
|
| 2011 |
Xiao K, Calata J, Ngo K, Ibitayo D, Lu G. Large-Area Chip Attachment by Sintering Nanosilver Paste: Process Improvement by Nondestructive Characterization Transactions of the Japan Institute of Electronics Packaging. 4: 101-109. DOI: 10.5104/Jiepeng.4.101 |
0.782 |
|
| 2011 |
Mei Y, Lu GQ, Chen X, Luo S, Ibitayo D. Migration of sintered nanosilver die-attach material on alumina substrate between 250 °c and 400 °c in dry air Ieee Transactions On Device and Materials Reliability. 11: 316-322. DOI: 10.1109/Tdmr.2010.2064775 |
0.428 |
|
| 2011 |
Mei Y, Lu GQ, Chen X, Luo S, Ibitayo D. Effect of oxygen partial pressure on silver migration of low-temperature sintered nanosilver die-attach material Ieee Transactions On Device and Materials Reliability. 11: 312-315. DOI: 10.1109/Tdmr.2010.2056372 |
0.449 |
|
| 2011 |
Cao X, Wang T, Ngo KDT, Lu G. Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 495-501. DOI: 10.1109/Tcpmt.2011.2104958 |
0.439 |
|
| 2011 |
Mei Y, Ibitayo D, Chen X, Luo S, Lu GQ. Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures Icept-Hdp 2011 Proceedings - 2011 International Conference On Electronic Packaging Technology and High Density Packaging. 787-792. DOI: 10.1109/ICEPT.2011.6066949 |
0.31 |
|
| 2011 |
Mei Y, Lu GQ, Chen X, Gang C, Luo S, Ibitayo D. Investigation of post-etch copper residue on direct bonded copper (DBC) substrates Journal of Electronic Materials. 40: 2119-2125. DOI: 10.1007/S11664-011-1716-8 |
0.399 |
|
| 2010 |
Panaccione P, Wang T, Chen X, Luo S, Lu G. Improved Heat Dissipation and Optical Performance of High-Power LED Packaging with Sintered Nanosilver Die-Attach Material Journal of Microelectronics and Electronic Packaging. 7: 164-168. DOI: 10.4071/imaps.264 |
0.361 |
|
| 2010 |
Panaccione P, Wang T, Lu G, Chen X, Luo S. Improved Heat Dissipation and Optical Performance of High-power LED Packaging with Sintered Nanosilver Die-attach Material Additional Conferences (Device Packaging, Hitec, Hiten, and Cicmt). 2010: 001585-001605. DOI: 10.4071/2010Dpc-Wa44 |
0.467 |
|
| 2010 |
Ning P, Lei TG, Wang F, Lu G, Ngo KDT, Rajashekara K. A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module Ieee Transactions On Power Electronics. 25: 2059-2067. DOI: 10.1109/Tpel.2010.2046498 |
0.444 |
|
| 2010 |
Cao X, Wang T, Ngo KDT, Lu G. Parametric Study of Joint Height for a Medium-Voltage Planar Package Ieee Transactions On Components and Packaging Technologies. 33: 553-562. DOI: 10.1109/Tcapt.2010.2046639 |
0.375 |
|
| 2010 |
Lei TG, Calata JN, Lu G, Chen X, Luo S. Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips Ieee Transactions On Components and Packaging Technologies. 33: 98-104. DOI: 10.1109/Tcapt.2009.2021256 |
0.518 |
|
| 2010 |
Dong G, Chen X, Zhang X, Ngo KD, Lu G. Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading Soldering & Surface Mount Technology. 22: 43-48. DOI: 10.1108/09540911011036280 |
0.404 |
|
| 2010 |
Wang T, Chen G, Wang Y, Chen X, Lu G. Uniaxial ratcheting and fatigue behaviors of low-temperature sintered nano-scale silver paste at room and high temperatures Materials Science and Engineering: A. 527: 6714-6722. DOI: 10.1016/J.Msea.2010.07.012 |
0.349 |
|
| 2009 |
Calata JN, Lei TG, Lu GQ. Sintered nanosilver paste for high-temperature power semiconductor device attachment International Journal of Materials and Product Technology. 34: 95. DOI: 10.1504/Ijmpt.2009.022406 |
0.8 |
|
| 2009 |
Lei TG, Calata JN, Ngo KDT, Lu G. Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate Ieee Transactions On Device and Materials Reliability. 9: 563-568. DOI: 10.1109/Tdmr.2009.2033668 |
0.465 |
|
| 2009 |
Dong G, Lei G(, Chen X, Ngo K, Lu G. Edge tail length effect on reliability of DBC substrates under thermal cycling Soldering & Surface Mount Technology. 21: 10-15. DOI: 10.1108/09540910910970367 |
0.337 |
|
| 2009 |
Yu D, Chen X, Chen G, Lu G, Wang Z. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment Materials & Design. 30: 4574-4579. DOI: 10.1016/J.Matdes.2009.04.006 |
0.416 |
|
| 2008 |
Qi K, Chen X, Lu GQ. Effect of interconnection area on shear strength of sintered joint with nano-silver paste Soldering and Surface Mount Technology. 20: 8-12. DOI: 10.1108/09540910810861431 |
0.451 |
|
| 2008 |
Chen X, Li R, Qi K, Lu G. Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste Journal of Electronic Materials. 37: 1574-1579. DOI: 10.1007/S11664-008-0516-2 |
0.368 |
|
| 2007 |
Bai JG, Lei TG, Calata JN, Lu G. Control of nanosilver sintering attained through organic binder burnout Journal of Materials Research. 22: 3494-3500. DOI: 10.1557/Jmr.2007.0440 |
0.75 |
|
| 2007 |
Bai JG, Calata JN, Lu G. Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices Ieee Transactions On Electronics Packaging Manufacturing. 30: 241-245. DOI: 10.1109/Tepm.2007.906508 |
0.459 |
|
| 2007 |
Bai JG, Yin J, Zhang Z, Lu G, van Wyk JD. High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment Ieee Transactions On Advanced Packaging. 30: 506-510. DOI: 10.1109/Tadvp.2007.898628 |
0.497 |
|
| 2007 |
Wang T, Chen X, Lu G, Lei G. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection Journal of Electronic Materials. 36: 1333-1340. DOI: 10.1007/S11664-007-0230-5 |
0.508 |
|
| 2006 |
Bai J, Lu G. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly Ieee Transactions On Device and Materials Reliability. 6: 436-441. DOI: 10.1109/Tdmr.2006.882196 |
0.529 |
|
| 2006 |
Bai J, Zhang Z, Calata J, Lu G. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material Ieee Transactions On Components and Packaging Technologies. 29: 589-593. DOI: 10.1109/Tcapt.2005.853167 |
0.464 |
|
| 2005 |
Bai JG, Calata JN, Lu G. Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability Journal of Electronic Packaging. 128: 208-214. DOI: 10.1115/1.2229218 |
0.787 |
|
| 2005 |
Calata JN, Bai JG, Liu X, Wen S, Lu G. Three-dimensional packaging for power semiconductor devices and modules Ieee Transactions On Advanced Packaging. 28: 404-412. DOI: 10.1109/Tadvp.2005.852837 |
0.351 |
|
| 2005 |
Lin Y, Chen X, Liu X, Lu G. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling Microelectronics Reliability. 45: 143-154. DOI: 10.1016/J.Microrel.2004.06.009 |
0.591 |
|
| 2005 |
Chen X, Lin Y, Liu X, Lu G. Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability Engineering Fracture Mechanics. 72: 2628-2646. DOI: 10.1016/J.Engfracmech.2005.02.008 |
0.373 |
|
| 2004 |
Lu G, Liu X, Wen S, Noel Calata J, Bai JG. Strategies for improving the reliability of solder joints on power semiconductor devices Soldering & Surface Mount Technology. 16: 27-40. DOI: 10.1108/09540910410537309 |
0.601 |
|
| 2003 |
Liu X, Lu G. Effects of solder joint shape and height on thermal fatigue lifetime Ieee Transactions On Components and Packaging Technologies. 26: 455-465. DOI: 10.1109/Tcapt.2003.815089 |
0.318 |
|
| 2002 |
Zhang Z, Lu G. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow Ieee Transactions On Electronics Packaging Manufacturing. 25: 279-283. DOI: 10.1109/Tepm.2002.807719 |
0.467 |
|
| 2002 |
Lee FC, Wyk JDv, Boroyevich D, Lu G, Liang Z, Barbosa P. Technology trends toward a system-in-a-module in power electronics Ieee Circuits and Systems Magazine. 2: 4-22. DOI: 10.1109/Mcas.2002.1173132 |
0.317 |
|
| 2002 |
Liu X, Xu S, Lu G, Dillard DA. Effect of substrate flexibility on solder joint reliability Microelectronics Reliability. 42: 1883-1891. DOI: 10.1016/S0026-2714(02)00269-X |
0.618 |
|
| 2001 |
Wen SS, Huff D, Lu G. A Dimple-Array Interconnect Technique for Power Semiconductor Devices Mrs Proceedings. 682. DOI: 10.1557/Proc-682-N5.3 |
0.385 |
|
| 2001 |
Liu X, Haque S, Lu GQ. Three-dimensional flip-chip on flex packaging for power electronics applications Ieee Transactions On Advanced Packaging. 24: 1-9. DOI: 10.1109/6040.909618 |
0.414 |
|
| 2001 |
Liu X, Xu S, Lu G, Dillard DA. Stacked solder bumping technology for improved solder joint reliability Microelectronics Reliability. 41: 1979-1992. DOI: 10.1016/S0026-2714(01)00117-2 |
0.587 |
|
| 2001 |
Haque S, Lu GQ. Effects of device passivation materials on solderable metallization of IGBTs Microelectronics and Reliability. 41: 639-647. DOI: 10.1016/S0026-2714(01)00008-7 |
0.331 |
|
| 2001 |
Haque S, Siddabattula K, Craven M, Wen S, Liu X, Boroyevich D, Lu G. Design issues of a three-dimensional packaging scheme for power modules Microelectronics Reliability. 41: 295-305. DOI: 10.1016/S0026-2714(00)00208-0 |
0.695 |
|
| 2001 |
Calata JN, Lu G, Chuang T. Constrained sintering of glass, glass-ceramic and ceramic coatings on metal substrates Surface and Interface Analysis. 31: 673-681. DOI: 10.1002/Sia.1093 |
0.778 |
|
| 2000 |
Lu G, Calata JN. Adhesion strength of cordierite glass-ceramic coatings on molybdenum substrates Journal of Materials Research. 15: 2857-2863. DOI: 10.1557/Jmr.2000.0408 |
0.765 |
|
| 2000 |
Haque S, Lu G, Goings J, Sigmund J. Characterization of interfacial thermal resistance by acoustic micrography imaging Microelectronics Reliability. 40: 465-476. DOI: 10.1016/S0026-2714(99)00239-5 |
0.643 |
|
| 1999 |
Calata JN, Lu G, Kuhr TA. Enhancement of the Adhesion of Cordierite Glass-Ceramic Coatings on Molybdenum by the Deposition of Metallic Interlayers on the Substrate Mrs Proceedings. 586. DOI: 10.1557/Proc-586-243 |
0.766 |
|
| 1999 |
Bang J, Lu G, Calata JN. Determination of shear viscosity of borosilicate glass + silica powder compacts by an optical system Journal of Materials Research. 14: 1062-1068. DOI: 10.1557/Jmr.1999.0141 |
0.775 |
|
| 1999 |
Haque S, Xing K, Lin R, Suchicital CTA, Lu G, Nelson DJ, Borojevic D, Lee FC. An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures Ieee Transactions On Advanced Packaging. 22: 136-144. DOI: 10.1109/6040.763184 |
0.363 |
|
| 1999 |
Haque S, Stinnett WA, Nelson DJ, Lu G. Thermal management of power electronics modules packaged by a stacked-plate technique Microelectronics Reliability. 39: 1343-1349. DOI: 10.1016/S0026-2714(99)00055-4 |
0.652 |
|
| 1998 |
Calata JN, Matthys A, Lu G. Constrained-film sintering of cordierite glass-ceramic on silicon substrate Journal of Materials Research. 13: 2334-2341. DOI: 10.1557/Jmr.1998.0326 |
0.761 |
|
| 1997 |
Calata JN, Wen S, Lu G. Densification and Crystallization Kinetics of Cordierite Glass-Ceramic Coatings on Rigid Substrates Mrs Proceedings. 481. DOI: 10.1557/Proc-481-483 |
0.79 |
|
| 1995 |
Bang J, Lu G. Constrained-Film Sintering of a Borosilicate Glass: In Situ Measurement of Film Stresses Journal of the American Ceramic Society. 78: 813-815. DOI: 10.1111/J.1151-2916.1995.Tb08253.X |
0.314 |
|
| 1994 |
Schinazi RG, Lu G, Spaepen F. Thermo-Electric Properties of Thin-Film Refractory Metal Thermocouples Mrs Proceedings. 360. DOI: 10.1557/Proc-360-145 |
0.32 |
|
| 1993 |
Lu G, Sutterlin RC, Gupta TK. Effect of Mismatched Sintering Kinetics on Camber in a Low-Temperature Cofired Ceramic Package Journal of the American Ceramic Society. 76: 1907-1914. DOI: 10.1111/J.1151-2916.1993.Tb08311.X |
0.384 |
|
| 1992 |
Lu G, Gupta TK. Effect of Biaxial Stress on Solid Phase Epitaxy of Silicon Mrs Proceedings. 263. DOI: 10.1557/Proc-263-169 |
0.319 |
|
| 1991 |
Lu G, Mogilevsky B, Gupta TK. Curvature Measurements of Tri-Material Structures Under Thermal Excursion Mrs Proceedings. 226. DOI: 10.1557/Proc-226-339 |
0.437 |
|
| 1990 |
Aziz MJ, Sabin PC, Lu G. Effect of Nonhydrostatic Stress on Crystal Growth Kinetics Mrs Proceedings. 202. DOI: 10.1557/Proc-202-567 |
0.308 |
|
| 1988 |
Lu GQ, Nygren E, Aziz MJ, Turnbull D, White CW. Time-Resolved Reflectivity Measurement of the Pressure-Enhanced Crystallization Rate of Amorphous Si in a Diamond Anvil Cell Mrs Proceedings. 100. DOI: 10.1557/Proc-100-435 |
0.342 |
|
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