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Amy E. Wendt - Publications

Affiliations: 
University of Wisconsin, Madison, Madison, WI 
Area:
Materials Science Engineering, Electronics and Electrical Engineering, Fluid and Plasma Physics
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53 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Boffard JB, Lin CC, Wendt AE. Application of Excitation Cross-Section Measurements to Optical Plasma Diagnostics Advances in Atomic Molecular and Optical Physics. 67: 1-76. DOI: 10.1016/Bs.Aamop.2017.03.005  0.516
2015 Boffard JB, Lin CC, Wang S, Wendt AE, Culver C, Radovanov S, Persing H. Comparison of surface vacuum ultraviolet emissions with resonance level number densities. II. Rare-gas plasmas and Ar-molecular gas mixtures Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 33. DOI: 10.1116/1.4904036  0.43
2015 Boffard JB, Wang S, Lin CC, Wendt AE. Detection of fast electrons in pulsed argon inductively-coupled plasmas using the 420.1–419.8 nm emission line pair Plasma Sources Science and Technology. 24: 65005. DOI: 10.1088/0963-0252/24/6/065005  0.416
2014 Boffard JB, Lin CC, Culver C, Wang S, Wendt AE, Radovanov S, Persing H. Comparison of surface vacuum ultraviolet emissions with resonance level number densities. I. Argon plasmas Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 32. DOI: 10.1116/1.4859376  0.39
2013 Wang S, Wendt AE, Boffard JB, Lin CC, Radovanov S, Persing H. Noninvasive, real-time measurements of plasma parameters via optical emission spectroscopy Journal of Vacuum Science and Technology. 31: 21303. DOI: 10.1116/1.4792671  0.424
2012 Boffard JB, Jung RO, Lin CC, Aneskavich LE, Wendt AE. Argon 420.1–419.8 nm emission line ratio for measuring plasma effective electron temperatures Journal of Physics D: Applied Physics. 45: 045201. DOI: 10.1088/0022-3727/45/4/045201  0.39
2012 Boffard JB, Jung RO, Lin CC, Aneskavich LE, Wendt AE. Evidence of weak plasma series resonance heating in the H-mode of neon and neon/argon inductively coupled plasmas Journal of Physics D. 45: 382001. DOI: 10.1088/0022-3727/45/38/382001  0.503
2011 Chen F, Jiang H, Kiefer AM, Clausen AM, Ting YH, Wendt AE, Ding B, Lagally MG. Fabrication of ultrahigh-density nanowires by electrochemical nanolithography. Nanoscale Research Letters. 6: 444. PMID 21745363 DOI: 10.1186/1556-276X-6-444  0.357
2011 Boffard JB, Jung RO, Lin CC, Aneskavich LE, Wendt AE. Optical diagnostics for characterization of electron energy distributions: argon inductively coupled plasmas Plasma Sources Science and Technology. 20: 055006. DOI: 10.1088/0963-0252/20/5/055006  0.397
2010 Ting YH, Liu CC, Park SM, Jiang H, Nealey PF, Wendt AE. Surface roughening of polystyrene and poly(methyl methacrylate) in Ar/O2 plasma etching Polymers. 2: 649-663. DOI: 10.3390/Polym2040649  0.48
2010 Qin XV, Ting Y, Wendt AE. Tailored ion energy distributions at an rf-biased plasma electrode Plasma Sources Science and Technology. 19: 065014. DOI: 10.1088/0963-0252/19/6/065014  0.655
2010 Boffard JB, Jung RO, Lin CC, Wendt AE. Optical emission measurements of electron energy distributions in low-pressure argon inductively coupled plasmas Plasma Sources Science and Technology. 19: 65001. DOI: 10.1088/0963-0252/19/6/065001  0.471
2009 Ding R, Klein LJ, Friesen MG, Eriksson MA, Wendt AE. Sidewall damage in plasma etching of Si/SiGe heterostructures Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 27: 836-843. DOI: 10.1116/1.3097858  0.403
2009 Boffard JB, Jung RO, Lin CC, Wendt AE. Measurement of metastable and resonance level densities in rare-gas plasmas by optical emission spectroscopy Plasma Sources Science and Technology. 18: 35017. DOI: 10.1088/0963-0252/18/3/035017  0.387
2009 Buzzi FL, Ting Y, Wendt AE. Energy distribution of bombarding ions in plasma etching of dielectrics Plasma Sources Science and Technology. 18: 025009. DOI: 10.1088/0963-0252/18/2/025009  0.652
2008 Ting YH, Park SM, Liu CC, Liu X, Himpsel FJ, Nealey PF, Wendt AE. Plasma etch removal of poly(methyl methacrylate) in block copolymer lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 26: 1684-1689. DOI: 10.1116/1.2966433  0.349
2007 Silapunt R, Wendt AE, Kirmse KHR. Ion energy control at substrates during plasma etching of patterned structures Journal of Vacuum Science & Technology B. 25: 1882-1887. DOI: 10.1116/1.2803723  0.549
2007 Liu CC, Nealey PF, Ting YH, Wendt AE. Pattern transfer using poly(styrene-block-methyl methacrylate) copolymer films and reactive ion etching Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 25: 1963-1968. DOI: 10.1116/1.2801884  0.428
2007 Ding R, Klein LJ, Eriksson MA, Wendt AE. Anisotropic fluorocarbon plasma etching of Si/SiGe heterostruetures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 25: 404-409. DOI: 10.1116/1.2712199  0.374
2007 Patterson MM, Chu HY, Wendt AE. Arbitrary substrate voltage wave forms for manipulating energy distribution of bombarding ions during plasma processing Plasma Sources Science and Technology. 16: 257-264. DOI: 10.1088/0963-0252/16/2/007  0.423
2004 Silapunt R, Wendt AE, Kirmse K, Losey LP. Ion bombardment energy control for selective fluorocarbon plasma etching of organosilicate glass Journal of Vacuum Science & Technology B. 22: 826-831. DOI: 10.1116/1.1676641  0.662
2003 Wilson CG, Gianchandani YB, Wendt AE. High-voltage constraints for vacuum packaged microstructures Journal of Microelectromechanical Systems. 12: 835-839. DOI: 10.1109/Jmems.2003.820278  0.337
2003 Wilson CG, Gianchandani YB, Arslanbekov RR, Kolobov V, Wendt AE. Profiling and modeling of dc nitrogen microplasmas Journal of Applied Physics. 94: 2845-2851. DOI: 10.1063/1.1595143  0.427
2001 Wang SB, Wendt AE. Ion bombardment energy and SiO2/Si fluorocarbon plasma etch selectivity Journal of Vacuum Science and Technology, Part a: Vacuum, Surfaces and Films. 19: 2425-2432. DOI: 10.1116/1.1387056  0.581
2001 Wendt AE. Passive external radio frequency filter for Langmuir probes Review of Scientific Instruments. 72: 2926-2930. DOI: 10.1063/1.1376139  0.409
2000 Andrew Y, Lu Z, Snodgrass T, Teitzel G, Wendt AE. Interactions between plasmas in ionized physical vapor deposition discharges Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 18: 2137. DOI: 10.1116/1.1286360  0.449
2000 Andrew Y, Booske JH, Lu S, Snodgrass TG, Wendt AE. Reduction of effects of rarefaction in ionized physical vapour deposition discharges Plasma Sources Science and Technology. 9: 562-567. DOI: 10.1088/0963-0252/9/4/311  0.426
2000 Wang S, Wendt AE. Control of ion energy distribution at substrates during plasma processing Journal of Applied Physics. 88: 643-646. DOI: 10.1063/1.373715  0.559
2000 Andrew Y, Abraham I, Booske JH, Lu ZC, Wendt AE. Absolute densities of long lived species in an ionized physical vapor deposition copper-argon plasma Journal of Applied Physics. 88: 3208-3219. DOI: 10.1063/1.1289219  0.361
2000 Wendt AE. High-density plasma sources Thin Films. 27: 9-35. DOI: 10.1016/S1079-4050(00)80004-6  0.487
1999 Lu ZC, Foster JE, Snodgrass TG, Booske JH, Wendt AE. Measurement of electron energy distribution function in an argon/copper plasma for ionized physical vapor deposition Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 17: 840-844. DOI: 10.1116/1.581656  0.55
1999 Foster JE, Wendt AE, Wang WW, Booske JH. Erratum: “Determination of metal vapor ion concentration in an argon/copper plasma for ionized physical vapor deposition” [J. Vac. Sci. Technol. A 16, 2198 (1998)] Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 17: 322-322. DOI: 10.1116/1.581589  0.479
1999 Wang SB, Wendt AE. Sheath thickness evaluation for collisionless or weakly collisional bounded plasmas Ieee Transactions On Plasma Science. 27: 1358-1365. DOI: 10.1109/27.799813  0.388
1999 Wang W, Foster J, Snodgrass T, Wendt AE, Booske JH. An rf sustained argon and copper plasma for ionized physical vapor deposition of copper Journal of Applied Physics. 85: 7556-7561. DOI: 10.1063/1.370554  0.493
1999 Snodgrass TG, Booske JH, Wang W, Wendt AE, Shohet JL. Gridless ionized metal flux fraction measurement tool for use in ionized physical vapor deposition studies Review of Scientific Instruments. 70: 1525-1529. DOI: 10.1063/1.1149618  0.456
1998 Foster JE, Wendt AE, Wang WW, Booske JH. Determination of metal vapor ion concentration in an argon/copper plasma for ionized physical vapor deposition Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 16: 2198-2203. DOI: 10.1116/1.581512  0.579
1997 Wang W, Foster J, Wendt AE, Booske JH, Onuoha T, Sandstrom PW, Liu HL, Gearhart SS, Hershkowitz N. Magnetic-field-enhanced rf argon plasma for ionized sputtering of copper Applied Physics Letters. 71: 1622-1624. DOI: 10.1063/1.119997  0.478
1996 Kirmse KHR, Wendt AE, Disch SB, Wu JZ, Abraham IC, Meyer JA, Breun RA, Woods RC. SiO2 to Si selectivity mechanisms in high density fluorocarbon plasma etching Journal of Vacuum Science & Technology B. 14: 710-715. DOI: 10.1116/1.588702  0.494
1996 Stittsworth JA, Wendt AE. Striations in a radio frequency planar inductively coupled plasma Ieee Transactions On Plasma Science. 24: 125-126. DOI: 10.1109/27.491744  0.334
1996 Stittsworth JA, Wendt AE. Reactor geometry and plasma uniformity in a planar inductively coupled radio frequency argon discharge Plasma Sources Science and Technology. 5: 429-435. DOI: 10.1088/0963-0252/5/3/011  0.402
1996 Meyer JA, Mau R, Wendt AE. Plasma properties determined with induction loop probes in a planar inductively coupled plasma source Journal of Applied Physics. 79: 1298-1302. DOI: 10.1063/1.361025  0.431
1995 Meyer JA, Wendt AE. Measurements of electromagnetic fields in a planar radio-frequency inductively coupled plasma source Journal of Applied Physics. 78: 90-96. DOI: 10.1063/1.360585  0.326
1995 Cielaszyk ES, Kirmse KHR, Stewart RA, Wendt AE. Mechanisms for polycrystalline silicon defect passivation by hydrogenation in an electron cyclotron resonance plasma Applied Physics Letters. 67: 3099-3101. DOI: 10.1063/1.114877  0.484
1994 Kirmse KHR, Oehrlein GS, Wendt AE, Zhang Y. Fluorocarbon high density plasmas. VIII. Study of the ion flux composition at the substrate in electron cyclotron resonance etching processes using fluorocarbon gases Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 12: 1287-1292. DOI: 10.1116/1.579310  0.559
1994 Beale DF, Wendt AE, Mahoney LJ. Spatially resolved optical emission for characterization of a planar radio frequency inductively coupled discharge Journal of Vacuum Science and Technology. 12: 2775-2779. DOI: 10.1116/1.579103  0.382
1994 Mahoney LJ, Wendt AE, Barrios E, Richards CJ, Shohet JL. Electron-density and energy distributions in a planar inductively coupled discharge Journal of Applied Physics. 76: 2041-2047. DOI: 10.1063/1.357672  0.483
1994 Kolobov VI, Beale DF, Mahoney LJ, Wendt AE. Nonlocal electron kinetics in a low‐pressure inductively coupled radio‐frequency discharge Applied Physics Letters. 65: 537-539. DOI: 10.1063/1.112290  0.363
1994 Meyer JA, Kirmse KHR, Jenq JS, Perez-Montero SY, Maynard HL, Wendt AE, Taylor JW, Hershkowitz N. Experiments with back side gas cooling using an electrostatic wafer holder in an electron cyclotron resonance etching tool Applied Physics Letters. 64: 1926-1928. DOI: 10.1063/1.111744  0.357
1993 Lai C, Breun RA, Sandstrom PW, Wendt AE, Woods RC, Hershkowitz N. Langmuir Probe Measurements of Electron Temperature and Density Scaling in Multidipoie Radio Frequency Plasmas Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 11: 1199-1205. DOI: 10.1116/1.578493  0.485
1992 Wendt AE, Hitchon WNG. Electron heating by sheaths in radio frequency discharges Journal of Applied Physics. 71: 4718-4726. DOI: 10.1063/1.350662  0.423
1991 Friedmann JB, Shohet JL, Wendt AE. Ion-Cyclotron-Resonance Mass Spectrometry with a Microwave Plasma Source Ieee Transactions On Plasma Science. 19: 47-51. DOI: 10.1109/27.62366  0.433
1990 Wendt AE, Lieberman MA. Spatial structure of a planar magnetron discharge Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 8: 902-907. DOI: 10.1116/1.576894  0.301
1988 Wendt AE, Lieberman MA, Meuth H. Radial current distribution at a planar magnetron cathode Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 6: 1827-1831. DOI: 10.1116/1.575263  0.349
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