Year |
Citation |
Score |
2012 |
Xie S, Chung J, Purcell B, Ko KS, Vartuli C, Lian G, Clark F. Electron Tomography of Stacked Contact/Via Structures Microscopy and Microanalysis. 18: 1798-1799. DOI: 10.1017/S1431927612010847 |
0.344 |
|
2011 |
Diercks D, Lian G, Chung J, Kaufman M. Comparison of convergent beam electron diffraction and geometric phase analysis for strain measurement in a strained silicon device Journal of Microscopy. 241: 195-199. PMID 21118218 DOI: 10.1111/J.1365-2818.2010.03423.X |
0.549 |
|
2010 |
Choi YS, Lian G, Vartuli C, Olubuyide O, Chung J, Riley D, Baldwin G. Layout Variation Effects in Advanced MOSFETs: STI-Induced Embedded SiGe Strain Relaxation and Dual-Stress-Liner Boundary Proximity Effect Ieee Transactions On Electron Devices. 57: 2886-2891. DOI: 10.1109/Ted.2010.2066567 |
0.439 |
|
2010 |
Chung J, Lian G, Rabenberg L. Practical and Reproducible Mapping of Strains in Si Devices Using Geometric Phase Analysis of Annular Dark-Field Images From Scanning Transmission Electron Microscopy Ieee Electron Device Letters. 31: 854-856. DOI: 10.1109/Led.2010.2049562 |
0.568 |
|
2010 |
Diercks D, Lian G, Chung J, Kaufman M. Direct Comparison of Convergent Beam Electron Diffraction and Geometric Phase Analysis for Local Strain Measurement Microscopy and Microanalysis. 16: 742-743. DOI: 10.1017/S143192761005645X |
0.499 |
|
2010 |
Chung J, Lian G, Rabenberg L. Local Lattice Strain Measurement using Geometric Phase Analysis of Annular Dark Field Images from Scanning Transmission Electron Microscopy Microscopy and Microanalysis. 16: 1476-1477. DOI: 10.1017/S1431927610056369 |
0.684 |
|
2010 |
Vartuli C, Lian G, Choi Y, Chung J. Strain Profiles in Si Channel of PMOS Devices Affected by Shallow-Trench Isolation Strain Relaxation In Embedded SiGe Microscopy and Microanalysis. 16: 1924-1925. DOI: 10.1017/S1431927610054577 |
0.446 |
|
2008 |
Chung J, Rabenberg L. Effects of strain gradients on strain measurements using geometrical phase analysis in the transmission electron microscope. Ultramicroscopy. 108: 1595-602. PMID 18635317 DOI: 10.1016/j.ultramic.2008.05.010 |
0.685 |
|
2008 |
Chung J, Lian G, Rabenberg L. Local strain measurement in a strain-engineered complementary metal-oxide-semiconductor device by geometrical phase analysis in the transmission electron microscope Applied Physics Letters. 93: 081909. DOI: 10.1063/1.2970050 |
0.682 |
|
2008 |
Lian G, Vartuli C, Chung J. Challenging analysis for the gate stack and strained channel of the advanced CMOS Microscopy and Microanalysis. 14: 384-385. DOI: 10.1017/S1431927608082421 |
0.39 |
|
2008 |
Chung J, Lian G, Vartuli C, Rajagopalan S, Rabenberg LK. Local Strain Measurement by Geometrical Phase Analysis in the Transmission Electron Microscope Applied to Strain-Engineered CMOS Devices Microscopy and Microanalysis. 14: 388-389. DOI: 10.1017/S1431927608082196 |
0.546 |
|
2007 |
Chung J, Rabenberg L. Measurement of incomplete strain relaxation in a silicon heteroepitaxial film by geometrical phase analysis in the transmission electron microscope Applied Physics Letters. 91: 231902. DOI: 10.1063/1.2821843 |
0.676 |
|
2006 |
Chung J, Rabenberg L. Two-dimensional imaging of the potential distribution within a core/shell nanowire by electron holography Journal of Materials Research. 21: 1215-1220. DOI: 10.1557/JMR.2006.0142 |
0.621 |
|
2006 |
Chung J, Rabenberg L. Mapping of electrostatic potentials within core-shell nanowires by electron holography Applied Physics Letters. 88: 013106. DOI: 10.1063/1.2159560 |
0.621 |
|
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