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Shih-kang Lin - Publications

Affiliations: 
Materials Science and Engineering National Cheng Kung University, Tainan City, Tainan City, Taiwan 
 2008 National Tsing Hua University, Taiwan 
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27 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Liu Y, Yu Y, Lin S, Chiu S. Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study Scripta Materialia. 173: 134-138. DOI: 10.1016/J.SCRIPTAMAT.2019.08.008  0.388
2019 Tseng T, Yang C, Chiang J, Huang J, Chen C, Lin S, Wang C, Wu AT. Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates Materials Science and Engineering: A. 759: 506-513. DOI: 10.1016/J.MSEA.2019.05.074  0.442
2018 Lin S, Yeh C, Wang M. On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system Materials Characterization. 137: 14-23. DOI: 10.1016/J.MATCHAR.2018.01.020  0.35
2017 Lin S, Wang M, Yeh C, Chang H, Liu Y. High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy Journal of Alloys and Compounds. 702: 561-567. DOI: 10.1016/J.JALLCOM.2016.12.444  0.339
2015 Lin S, Chang R, Chen S, Tsai M, Hsu C. Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates Materials Chemistry and Physics. 154: 60-65. DOI: 10.1016/J.MATCHEMPHYS.2015.01.045  0.582
2015 Lin S, Wang Y, Kuo H. Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C Intermetallics. 58: 91-97. DOI: 10.1016/J.INTERMET.2014.12.002  0.452
2015 Lin Sk, Chang Hm, Cho Cl, Liu Yc, Kuo Yk. Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits Electronic Materials Letters. 11: 687-694. DOI: 10.1007/s13391-015-5015-z  0.302
2014 Lin SK, Tsai MY, Tsai PC, Hsu BH. Formation of alternating interfacial layers in Au-12Ge/Ni joints. Scientific Reports. 4: 4557. PMID 24690992 DOI: 10.1038/srep04557  0.597
2014 Lin S, Chang R, Chen S, Tsai M, Hsu C. Effects of zinc on the interfacial reactions of tin–indium solder joints with copper Journal of Materials Science. 49: 3805-3815. DOI: 10.1007/s10853-014-8092-8  0.554
2013 Chen S, Hsu C, Lin S, Hsu C. Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples Journal of Materials Research. 28: 3257-3260. DOI: 10.1557/JMR.2013.308  0.577
2013 Lin S, Hsu C, Chen S, Hsu C. Interfacial reactions in Sn–20In–2.8Ag/Cu couples Materials Chemistry and Physics. 142: 268-275. DOI: 10.1016/J.MATCHEMPHYS.2013.07.014  0.587
2013 Lin S, Cho C, Chang H. Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples Journal of Electronic Materials. 43: 204-211. DOI: 10.1007/s11664-013-2721-x  0.314
2012 Chen S, Zi A, Gierlotka W, Yang C, Wang C, Lin S, Hsu C. Phase equilibria of Sn–Sb–Cu system Materials Chemistry and Physics. 132: 703-715. DOI: 10.1016/J.MATCHEMPHYS.2011.11.088  0.484
2010 Lin S, Chen K, Chen H, Liou W, Yen Y. Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions Journal of Materials Research. 25: 2278-2286. DOI: 10.1557/JMR.2010.0305  0.523
2009 Lin S, Chung T, Chen S, Chang C. 250 °C isothermal section of ternary Sn-In-Cu phase equilibria Journal of Materials Research. 24: 2628-2637. DOI: 10.1557/JMR.2009.0317  0.6
2008 Lin S, Yang C, Wu S, Chen S. Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys Journal of Electronic Materials. 37: 498-506. DOI: 10.1007/S11664-008-0380-0  0.567
2007 Gierlotka W, Chen S, Lin S. Thermodynamic description of the Cu–Sn system Journal of Materials Research. 22: 3158-3165. DOI: 10.1557/JMR.2007.0396  0.546
2007 Lin S, Yorikado Y, Jiang J, Kim K, Suganuma K, Chen S, Tsujimoto M, Yanada I. Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging Journal of Materials Research. 22: 1975-1986. DOI: 10.1557/JMR.2007.0232  0.495
2007 Chen S, Wang C, Lin S, Chiu C, Chen C. Phase transformation and microstructural evolution in solder joints Jom. 59: 39-43. DOI: 10.1007/S11837-007-0008-5  0.518
2007 Lin S, Yorikado Y, Jiang J, Kim K, Suganuma K, Chen S, Tsujimoto M, Yanada I. Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers Journal of Electronic Materials. 36: 1732-1734. DOI: 10.1007/S11664-007-0284-4  0.477
2007 Chen S, Wang C, Lin S, Chiu C. Phase Diagrams of Pb-Free Solders and Their Related Materials Systems Cheminform. 38. DOI: 10.1002/CHIN.200724212  0.505
2006 Chen S, Lin S. Electric current-induced abnormal Cu/γ-InSn4 interfacial reactions Journal of Materials Research. 21: 3065-3071. DOI: 10.1557/JMR.2006.0378  0.609
2006 Lin S, Chen S. Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160 °C Journal of Materials Research. 21: 1712-1717. DOI: 10.1557/JMR.2006.0200  0.678
2006 Chen S, Lin S. Effects of temperature on interfacial reactions in γ–InSn4/Ni couples Journal of Materials Research. 21: 1161-1166. DOI: 10.1557/JMR.2006.0137  0.663
2006 Chen S, Lin S, Yang C. Interfacial reactions in the pb-free composite solders with indium layers Journal of Electronic Materials. 35: 72-75. DOI: 10.1007/S11664-006-0186-X  0.565
2006 Chen S, Wang C, Lin S, Chiu C. Phase Diagrams of Pb-Free Solders and their Related Materials Systems Journal of Materials Science: Materials in Electronics. 18: 19-37. DOI: 10.1007/S10854-006-9010-X  0.505
2004 Chen S, Lin S, Jao J. Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints Materials Transactions. 45: 661-665. DOI: 10.2320/MATERTRANS.45.661  0.548
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