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Zhe Cheng - Publications

Affiliations: 
2015-2019 Georgia Institute of Technology, Atlanta, GA 
 2020-2022 University of Illinois, Urbana-Champaign, Urbana-Champaign, IL 
Area:
Heat transfer; semiconductors
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23 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2024 Cheng Z, Huang YJ, Zahiri B, Kwon P, Braun PV, Cahill DG. Ionic Peltier effect in Li-ion electrolytes. Physical Chemistry Chemical Physics : Pccp. PMID 38321982 DOI: 10.1039/d3cp05998g  0.618
2024 Li R, Hussain K, Liao ME, Huynh K, Hoque MSB, Wyant S, Koh YR, Xu Z, Wang Y, Luccioni DP, Cheng Z, Shi J, Lee E, Graham S, Henry A, et al. Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. Acs Applied Materials & Interfaces. PMID 38315970 DOI: 10.1021/acsami.3c16905  0.568
2023 Kagawa R, Cheng Z, Kawamura K, Ohno Y, Moriyama C, Sakaida Y, Ouchi S, Uratani H, Inoue K, Nagai Y, Shigekawa N, Liang J. High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C-SiC/Diamond Junctions for Practical Device Processes. Small (Weinheim An Der Bergstrasse, Germany). e2305574. PMID 37964293 DOI: 10.1002/smll.202305574  0.472
2023 Feng T, Zhou H, Cheng Z, Larkin LS, Neupane MR. A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces. Acs Applied Materials & Interfaces. PMID 37326498 DOI: 10.1021/acsami.3c02507  0.426
2022 Cheng Z, Liang J, Kawamura K, Zhou H, Asamura H, Uratani H, Tiwari J, Graham S, Ohno Y, Nagai Y, Feng T, Shigekawa N, Cahill DG. High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 13: 7201. PMID 36418359 DOI: 10.1038/s41467-022-34943-w  0.739
2022 Cheng Z, Mu F, Ji X, You T, Xu W, Suga T, Ou X, Cahill DG, Graham S. Correction to "Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance". Acs Applied Materials & Interfaces. 14: 22678. PMID 35533285 DOI: 10.1021/acsami.2c04500  0.723
2021 Cheng Z, Li R, Yan X, Jernigan G, Shi J, Liao ME, Hines NJ, Gadre CA, Idrobo JC, Lee E, Hobart KD, Goorsky MS, Pan X, Luo T, Graham S. Experimental observation of localized interfacial phonon modes. Nature Communications. 12: 6901. PMID 34824284 DOI: 10.1038/s41467-021-27250-3  0.678
2021 Hines NJ, Yates L, Foley BM, Cheng Z, Bougher TL, Goorsky MS, Hobart KD, Feygelson TI, Tadjer MJ, Graham S. Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications. The Review of Scientific Instruments. 92: 044907. PMID 34243450 DOI: 10.1063/5.0039966  0.781
2021 Cheng Z, Mu F, Ji X, You T, Xu W, Suga T, Ou X, Cahill DG, Graham S. Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance. Acs Applied Materials & Interfaces. PMID 34191480 DOI: 10.1021/acsami.1c06212  0.76
2021 Cheng Z, Zahiri B, Ji X, Chen C, Chalise D, Braun PV, Cahill DG. Good Solid-State Electrolytes Have Low, Glass-Like Thermal Conductivity. Small (Weinheim An Der Bergstrasse, Germany). e2101693. PMID 34117830 DOI: 10.1002/smll.202101693  0.757
2021 Shi J, Yuan C, Huang HL, Johnson J, Chae C, Wang S, Hanus R, Kim S, Cheng Z, Hwang J, Graham S. Thermal Transport across Metal/β-GaO Interfaces. Acs Applied Materials & Interfaces. PMID 34109790 DOI: 10.1021/acsami.1c05191  0.566
2021 Hoque MSB, Koh YR, Braun JL, Mamun A, Liu Z, Huynh K, Liao ME, Hussain K, Cheng Z, Hoglund ER, Olson DH, Tomko JA, Aryana K, Galib R, Gaskins JT, et al. High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films. Acs Nano. PMID 33908771 DOI: 10.1021/acsnano.0c09915  0.677
2020 Cheng Z, Mu F, You T, Xu W, Shi J, Liao ME, Wang Y, Huynh K, Suga T, Goorsky MS, Ou X, Graham S. Thermal Transport across Ion-cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3-SiC Interfaces. Acs Applied Materials & Interfaces. PMID 32909730 DOI: 10.1021/Acsami.0C11672  0.695
2020 Koh YR, Cheng Z, Mamun A, Hoque MSB, Liu Z, Bai T, Hussain K, Liao ME, Li R, Gaskins JT, Giri A, Tomko J, Braun J, Gaevski M, Lee E, et al. Bulk-like intrinsic phonon thermal conductivity of micrometer thick AlN films. Acs Applied Materials & Interfaces. PMID 32491824 DOI: 10.1021/Acsami.0C03978  0.666
2020 Cheng Z, Mu F, Yates L, Suga T, Graham S. Interfacial Thermal Conductance across Room-Temperature Bonded GaN-Diamond Interfaces for GaN-on-Diamond Devices. Acs Applied Materials & Interfaces. PMID 31986013 DOI: 10.1021/Acsami.9B16959  0.661
2019 Mu F, Cheng Z, Shi J, Shin S, Xu B, Shiomi J, Graham S, Suga T. High Thermal Boundary Conductance across Heterogeneous GaN-SiC Bonded Interfaces. Acs Applied Materials & Interfaces. PMID 31408316 DOI: 10.1021/Acsami.9B10106  0.679
2019 Cheng Z, Bai T, Shi J, Feng T, Wang Y, Mecklenburg M, Li C, Hobart KD, Feygelson T, Tadjer MJ, Pate BB, Foley B, Yates L, Pantelides ST, Cola BA, et al. Tunable Thermal Energy Transport across Diamond Membranes and Diamond-Si Interfaces by Nanoscale Graphoepitaxy. Acs Applied Materials & Interfaces. PMID 31042348 DOI: 10.1021/Acsami.9B02234  0.771
2019 Gaskins JT, Kotsonis G, Giri A, Ju S, Rohskopf A, Wang Y, Bai T, Sachet E, Shelton CT, Liu Z, Cheng Z, Foley BM, Graham S, Luo T, Henry A, et al. Corrrection to Thermal Boundary Conductance Across Heteroepitaxial ZnO/GaN Interfaces: Assessment of the Phonon Gas Model. Nano Letters. PMID 30673236 DOI: 10.1021/Acs.Nanolett.9B00022  0.723
2018 Gaskins JT, Kotsonis G, Giri A, Ju S, Rohskopf A, Wang Y, Bai T, Sachet E, Shelton CT, Liu Z, Cheng Z, Foley B, Graham S, Luo T, Henry A, et al. Thermal boundary conductance across heteroepitaxial ZnO/GaN interfaces: Assessment of the phonon gas model. Nano Letters. PMID 30412411 DOI: 10.1021/Acs.Nanolett.8B02837  0.72
2018 Cheng Z, Bougher T, Bai T, Wang SY, Li C, Yates L, Foley B, Goorsky MS, Cola BA, Faili F, Graham S. Probing Growth-Induced Anisotropic Thermal Transport in High-Quality CVD Diamond Membranes by Multi-frequency and Multi-spot-size Time-Domain Thermoreflectance. Acs Applied Materials & Interfaces. PMID 29328632 DOI: 10.1021/Acsami.7B16812  0.767
2015 Liu J, Xu Z, Cheng Z, Xu S, Wang X. Thermal Conductivity of Ultra-high Molecular Weight Polyethylene Crystal: Defect-effect Uncovered by 0 K limit Phonon Diffusion. Acs Applied Materials & Interfaces. PMID 26593380 DOI: 10.1021/Acsami.5B08578  0.457
2015 Cheng Z, Liu L, Xu S, Lu M, Wang X. Temperature dependence of electrical and thermal conduction in single silver nanowire. Scientific Reports. 5: 10718. PMID 26035288 DOI: 10.1038/Srep10718  0.424
2014 Cheng Z, Xu Z, Zhang L, Wang X. Thermophysical properties of lignocellulose: a cell-scale study down to 41 K. Plos One. 9: e114821. PMID 25532131 DOI: 10.1371/Journal.Pone.0114821  0.435
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