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Matthew Alexander Meitl - Publications

Affiliations: 
2007 University of Illinois, Urbana-Champaign, Urbana-Champaign, IL 
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Year Citation  Score
2016 Lee KT, Yao Y, He J, Fisher B, Sheng X, Lumb M, Xu L, Anderson MA, Scheiman D, Han S, Kang Y, Gumus A, Bahabry RR, Lee JW, Paik U, ... ... Meitl M, et al. Concentrator photovoltaic module architectures with capabilities for capture and conversion of full global solar radiation. Proceedings of the National Academy of Sciences of the United States of America. PMID 27930331 DOI: 10.1073/pnas.1617391113  0.6
2016 Lerner R, Eisenbrandt S, Bonafede S, Meitl MA, Fecioru A, Trindade AJ, Reiner R, Waltreit P, Bower CA. Heterogeneous Integration of Microscale Gallium Nitride Transistors by Micro-Transfer-Printing Proceedings - Electronic Components and Technology Conference. 2016: 1186-1189. DOI: 10.1109/ECTC.2016.373  0.6
2016 Prevatte C, Meitl MA, Gomez D, Ghosal K, Bonafede S, Raymond B, Moore T, Trindade AJ, Hines P, Guven I, Bower CA. Pressure-Activated Electrical Interconnection during Micro-Transfer-Printing Proceedings - Electronic Components and Technology Conference. 2016: 1209-1215. DOI: 10.1109/ECTC.2016.355  0.6
2016 Gomez D, Ghosal K, Meitl MA, Bonafede S, Prevatte C, Moore T, Raymond B, Kneeburg D, Fecioru A, Trindade AJ, Bower CA. Process Capability and Elastomer Stamp Lifetime in Micro Transfer Printing Proceedings - Electronic Components and Technology Conference. 2016: 680-687. DOI: 10.1109/ECTC.2016.349  0.6
2016 Prevatte C, Guven I, Ghosal K, Gomez D, Moore T, Bonafede S, Raymond B, Trindade AJ, Fecioru A, Kneeburg D, Meitl MA, Bower CA. Pressure activated interconnection of micro transfer printed components Applied Physics Letters. 108. DOI: 10.1063/1.4950992  0.6
2015 Lumb MP, Meitl M, Fisher B, Burroughs S, Schmieder KJ, Gonzalez M, Yakes MK, Mack S, Hoheisel R, Bennett MF, Ebert CW, Forbes DV, Bailey CG, Walters RJ. Transfer-printing for the next generation of multi-junction solar cells 2015 Ieee 42nd Photovoltaic Specialist Conference, Pvsc 2015. DOI: 10.1109/PVSC.2015.7356146  0.6
2015 Bower CA, Meitl MA, Bonafede S, Gomez D, Fecioru A, Kneeburg D. Heterogeneous integration of microscale compound semiconductor devices by micro-transfer-printing Proceedings - Electronic Components and Technology Conference. 2015: 963-967. DOI: 10.1109/ECTC.2015.7159711  0.6
2015 Yoon J, Lee SM, Kang D, Meitl MA, Bower CA, Rogers JA. Heterogeneously Integrated Optoelectronic Devices Enabled by Micro-Transfer Printing Advanced Optical Materials. 3: 1313-1335. DOI: 10.1002/adom.201500365  0.6
2014 Sheng X, Bower CA, Bonafede S, Wilson JW, Fisher B, Meitl M, Yuen H, Wang S, Shen L, Banks AR, Corcoran CJ, Nuzzo RG, Burroughs S, Rogers JA. Printing-based assembly of quadruple-junction four-terminal microscale solar cells and their use in high-efficiency modules. Nature Materials. 13: 593-8. PMID 24776535 DOI: 10.1038/nmat3946  0.6
2014 Lumb MP, Meitl M, Wilson J, Bonafede S, Burroughs S, Forbes DV, Bailey CG, Hoven NM, González M, Hoheisel R, Yakes MK, Polly SJ, Hubbard SM, Walters RJ. Development of InGaAs solar cells for >44% efficient transfer-printed multi-junctions 2014 Ieee 40th Photovoltaic Specialist Conference, Pvsc 2014. 491-494. DOI: 10.1109/PVSC.2014.6924967  0.6
2014 Sheng X, Bower CA, Bonafede S, Wilson JW, Fisher B, Meitl M, Yuen H, Wang S, Shen L, Banks AR, Corcoran CJ, Nuzzo RG, Burroughs S, Rogers JA. High efficiency quadruple junction, four-terminal solar cells and modules by transfer printing 2014 Ieee 40th Photovoltaic Specialist Conference, Pvsc 2014. 3605-3607. DOI: 10.1109/PVSC.2014.6924886  0.6
2014 Sheng X, Bower CA, Bonafede S, Wilson JW, Fisher B, Meitl M, Yuen H, Wang S, Shen L, Banks AR, Corcoran CJ, Nuzzo RG, Burroughs S, Rogers JA. Printed high-efficiency quadruple-junction, four-terminal solar cells and modules for full spectrum utilization 2014 Ieee Photonics Conference, Ipc 2014. 433-434. DOI: 10.1109/IPCon.2014.6995434  0.6
2014 Bower CA, Meitl M, Kneeburg D. Micro-transfer-printing: Heterogeneous integration of microscale semiconductor devices using elastomer stamps Proceedings of Ieee Sensors. 2014: 2111-2113. DOI: 10.1109/ICSENS.2014.6985454  0.6
2012 Lee J, Wu J, Ryu JH, Liu Z, Meitl M, Zhang YW, Huang Y, Rogers JA. Stretchable semiconductor technologies with high areal coverages and strain-limiting behavior: demonstration in high-efficiency dual-junction GaInP/GaAs photovoltaics. Small (Weinheim An Der Bergstrasse, Germany). 8: 1851-6. PMID 22467638 DOI: 10.1002/smll.201102437  0.6
2012 Justice J, Bower C, Meitl M, Mooney MB, Gubbins MA, Corbett B. Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers Nature Photonics. 6: 610-614. DOI: 10.1038/nphoton.2012.204  0.6
2011 Menard E, Wagner W, Furman B, Ghosal K, Gabriel J, Meitl M, Burroughs S. Multi-physics circuit network performance model for CPV modules/systems Conference Record of the Ieee Photovoltaic Specialists Conference. 002268-002272. DOI: 10.1109/PVSC.2011.6186407  0.6
2011 Bukovnik R, Menard E, Meitl M, Bonafede S, McNeill R, Wagner W, Seel S, Burroughs S. A micro-transfer printed high efficiency flexible photovoltaic panel Conference Record of the Ieee Photovoltaic Specialists Conference. 001543-001547. DOI: 10.1109/PVSC.2011.6186254  0.6
2011 Ghosal K, Gabriel J, Lilly D, Furman B, Menard E, Meitl M, Bonafede S, Kneeburg D, Kendrick B, Bukovnik R, Wagner W, Seel S, Burroughs S, Krause P, Fiedler M. On-sun performance of a novel microcell based HCPV system located in the southwest US Aip Conference Proceedings. 1407: 354-357. DOI: 10.1063/1.3658360  0.6
2010 Yoon J, Jo S, Chun IS, Jung I, Kim HS, Meitl M, Menard E, Li X, Coleman JJ, Paik U, Rogers JA. GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies. Nature. 465: 329-33. PMID 20485431 DOI: 10.1038/nature09054  0.6
2010 Furman B, Menard E, Gray A, Meitl M, Bonafede S, Kneeburg D, Ghosal K, Bukovnik R, Wagner W, Gabriel J, Seel S, Burroughs S. A high concentration photovoltaic module utilizing micro-transfer printing and surface mount technology Conference Record of the Ieee Photovoltaic Specialists Conference. 475-480. DOI: 10.1109/PVSC.2010.5616766  0.6
2010 Burroughs S, Conner R, Furman B, Menard E, Gray A, Meitl M, Bonafede S, Kneeburg D, Ghosal K, Bukovnik R, Wagner W, Seel S, Sullivan M. A new approach for a low cost CPV module design utilizing micro-transfer printing technology Aip Conference Proceedings. 1277: 163-166. DOI: 10.1063/1.3509179  0.6
2009 Park SI, Xiong Y, Kim RH, Elvikis P, Meitl M, Kim DH, Wu J, Yoon J, Yu CJ, Liu Z, Huang Y, Hwang KC, Ferreira P, Li X, Choquette K, et al. Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays. Science (New York, N.Y.). 325: 977-81. PMID 19696346 DOI: 10.1126/science.1175690  0.6
2008 Baca AJ, Ahn JH, Sun Y, Meitl MA, Menard E, Kim HS, Choi WM, Kim DH, Huang Y, Rogers JA. Semiconductor wires and ribbons for high-performance flexible electronics. Angewandte Chemie (International Ed. in English). 47: 5524-42. PMID 18615769 DOI: 10.1002/anie.200703238  0.6
2008 Kim TH, Choi WM, Kim DH, Meitl MA, Menard E, Jiang H, Carlisle JA, Rogers JA. Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management Advanced Materials. 20: 2171-2176. DOI: 10.1002/adma.200702434  0.6
2008 Ahn JH, Meitl MA, Baca AJ, Khang DY, Kim HS, Rogers JA. Transfer Printing Techniques and Inorganic Single-Crystalline Materials for Flexible and Stretchable Electronics Solution Processing of Inorganic Materials. 407-447. DOI: 10.1002/9780470407790.ch13  0.6
2007 Feng X, Meitl MA, Bowen AM, Huang Y, Nuzzo RG, Rogers JA. Competing fracture in kinetically controlled transfer printing. Langmuir : the Acs Journal of Surfaces and Colloids. 23: 12555-60. PMID 17990898 DOI: 10.1021/la701555n  0.6
2007 Kang SJ, Kocabas C, Kim HS, Cao Q, Meitl MA, Khang DY, Rogers JA. Printed multilayer superstructures of aligned single-walled carbon nanotubes for electronic applications. Nano Letters. 7: 3343-8. PMID 17935374 DOI: 10.1021/nl071596s  0.6
2007 Menard E, Meitl MA, Sun Y, Park JU, Shir DJ, Nam YS, Jeon S, Rogers JA. Micro- and nanopatterning techniques for organic electronic and optoelectronic systems. Chemical Reviews. 107: 1117-60. PMID 17428024 DOI: 10.1021/cr050139y  0.6
2007 Meitl MA, Feng X, Dong J, Menard E, Ferreira PM, Huang Y, Rogers JA. Stress focusing for controlled fracture in microelectromechanical systems Applied Physics Letters. 90. DOI: 10.1063/1.2679072  0.6
2007 Baca AJ, Meitl MA, Ko HC, Mack S, Kim HS, Dong J, Ferreira PM, Rogers JA. Printable single-crystal silicon micro/nanoscale ribbons, platelets and bars generated from bulk wafers Advanced Functional Materials. 17: 3051-3062. DOI: 10.1002/adfm.200601161  0.6
2006 Park JU, Meitl MA, Hur SH, Usrey ML, Strano MS, Kenis PJ, Rogers JA. In situ deposition and patterning of single-walled carbon nanotubes by laminar flow and controlled flocculation in microfluidic channels. Angewandte Chemie (International Ed. in English). 45: 581-5. PMID 16342126 DOI: 10.1002/anie.200501799  0.6
2006 Lee KJ, Meitl MA, Ahn JH, Rogers JA, Nuzzo RG, Kumar V, Adesida I. Bendable GaN high electron mobility transistors on plastic substrates Journal of Applied Physics. 100. DOI: 10.1063/1.2349837  0.6
2006 MacK S, Meitl MA, Baca AJ, Zhu ZT, Rogers JA. Mechanically flexible thin-film transistors that use ultrathin ribbons of silicon derived from bulk wafers Applied Physics Letters. 88. DOI: 10.1063/1.2206688  0.6
2006 Meitl MA, Zhu ZT, Kumar V, Lee KJ, Feng X, Huang YY, Adesida I, Nuzzo RG, Rogers JA. Transfer printing by kinetic control of adhesion to an elastomeric stamp Nature Materials. 5: 33-38. DOI: 10.1038/nmat1532  0.6
2006 Cao Q, Hur SH, Zhu ZT, Sun Y, Wang C, Meitl MA, Shim M, Rogers JA. Highly bendable, transparent thin-film transistors that use carbon-nanotube-based conductors and semiconductors with elastomeric dielectrics Advanced Materials. 18: 304-309. DOI: 10.1002/adma.200501740  0.6
2005 Kocabas C, Hur SH, Gaur A, Meitl MA, Shim M, Rogers JA. Guided growth of large-scale, horizontally aligned arrays of single-walled carbon nanotubes and their use in thin-film transistors. Small (Weinheim An Der Bergstrasse, Germany). 1: 1110-6. PMID 17193404 DOI: 10.1002/smll.200500120  0.6
2005 Lee KJ, Motala MJ, Meitl MA, Childs WR, Menard E, Shim AK, Rogers JA, Nuzzo RG. Large-area, selective transfer of microstructured silicon: A printing-based approach to high-performance thin-film transistors supported on flexible substrates Advanced Materials. 17: 2332-2336. DOI: 10.1002/adma.200500578  0.6
2005 Sun Y, Mack S, Meitl M, Rogers JA. Materials and patterning techniques for macroelectronics Technical Digest - International Electron Devices Meeting, Iedm. 2005: 454-457.  0.6
2004 Meitl MA, Zhou Y, Gaur A, Jeon S, Usrey ML, Strano MS, Rogers JA. Solution casting and transfer printing single-walled carbon nanotube films Nano Letters. 4: 1643-1647. DOI: 10.1021/nl0491935  0.6
2004 Zhou Y, Gaur A, Hur SH, Kocabas C, Meitl MA, Shim M, Rogers JA. p-Channel, n-channel thin film transistors and p-n diodes based on single wall carbon nanotube networks Nano Letters. 4: 2031-2035. DOI: 10.1021/nl048905o  0.6
2004 Kocabas C, Meitl MA, Gaur A, Shim M, Rogers JA. Aligned arrays of single-walled carbon nanotubes generated from random networks by orientationally selective laser ablation Nano Letters. 4: 2421-2426. DOI: 10.1021/nl048487n  0.6
2004 Hua F, Sun Y, Gaur A, Meitl MA, Bilhaut L, Rotkina L, Wang J, Geil P, Shim M, Rogers JA, Shim A. Polymer imprint lithography with molecular-scale resolution Nano Letters. 4: 2467-2471. DOI: 10.1021/nl048355u  0.6
2004 Jeon S, Menard E, Park JU, Maria J, Meitl M, Zaumseil J, Rogers JA. Three-dimensional nanofabrication with rubber stamps and conformable photomasks Advanced Materials. 16: 1369-1373. DOI: 10.1002/adma.200400593  0.6
2003 Zaumseil J, Meitl MA, Hsu JWP, Acharya BR, Baldwin KW, Loo YL, Rogers JA. Three-dimensional and multilayer nanostructures formed by nanotransfer printing Nano Letters. 3: 1223-1227. DOI: 10.1021/nl0344007  0.6
2003 Meitl MA, Dellinger TM, Braun PV. Bismuth-Ceramic Nanocomposites with Unusual Thermal Stability via High-Energy Ball Milling Advanced Functional Materials. 13: 795-799. DOI: 10.1002/adfm.200304433  0.6
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