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Ming Kong, Ph.D. - Publications

Affiliations: 
2012 Mechanical Engineering University of Colorado, Boulder, Boulder, CO, United States 
Area:
Mechanical Engineering
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2011 Kong M, Jeon S, Au H, Hwang C, Lee Y. Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1523-1532. DOI: 10.1109/Tcpmt.2011.2162837  0.301
2007 Kong M, Dai J, Lao J, Li G. Crystallization of amorphous SiC and superhardness effect in TiN/SiC nanomultilayers Applied Surface Science. 253: 4734-4739. DOI: 10.1016/J.Apsusc.2006.10.050  0.3
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