☰

Yubo Jiao, Ph.D. - Publications

Affiliations: 
2012 Chemical Engineering University of Arizona, Tucson, AZ 
Area:
Chemical Engineering
Tree Info Similar researchers PubMed Report error

7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Mu Y, Jiao Y, Sampurno Y, Zhuang Y, Theng S, Philipossian A. Effect of temperature in titanium chemical mechanical planarization Japanese Journal of Applied Physics. 54. DOI: 10.7567/Jjap.54.076502  0.756
2015 Wu C, Sampurno Y, Liao X, Jiao Y, Theng S, Zhuang Y, Borucki L, Philipossian A. Pad surface thermal management during copper chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 4: P206-P212. DOI: 10.1149/2.0101507Jss  0.741
2013 Wu C, Zhuang Y, Liao X, Jiao Y, Sampurno YA, Theng S, Sun F, Naman A, Philipossian A. Aggressive diamond characterization and wear analysis during chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 2. DOI: 10.1149/2.036301Jss  0.73
2012 Jiao Y, Zhuang Y, Wei X, Sampurno Y, Meled A, Theng S, Cheng J, Hooper D, Moinpour M, Philipossiana A. Pad wear analysis during interlayer dielectric chemical mechanical planarization Ecs Journal of Solid State Science and Technology. 1. DOI: 10.1149/2.022205Jss  0.689
2011 Jiao Y, Sampurno YA, Zhuang Y, Wei X, Meled A, Philipossian A. Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process Japanese Journal of Applied Physics. 50. DOI: 10.1143/Jjap.50.05Ec02  0.675
2011 Meled A, Zhuang Y, Sampurno YA, Theng S, Jiao Y, Borucki L, Philipossian A. Analysis of a novel slurry injection system in chemical mechanical planarization Japanese Journal of Applied Physics. 50. DOI: 10.1143/Jjap.50.05Ec01  0.673
2010 Jiao Y, Zhuang Y, Han Z, Liao X, Sampuno YA, Naman A, Philipossian A. Effect of temperature on pad surface contact area in chemical mechanical planarization Advanced Metallization Conference (Amc). 286-287. DOI: 10.1149/2.016202Ssl  0.67
Show low-probability matches.