Suresh Sitaraman

Affiliations: 
Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Computer Science
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"Suresh Sitaraman"

Children

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Rajiv C. Dunne grad student 2000 Georgia Tech
Weidong Xie grad student 2001 Georgia Tech
Lunyu Ma grad student 2003 Georgia Tech
Mitul B. Modi grad student 2003 Georgia Tech
Sai Zeng grad student 2004 Georgia Tech
Sakethraman Mahalingam grad student 2005 Georgia Tech
Injoong Kim grad student 2007 Georgia Tech
Andrew E. Perkins grad student 2007 Georgia Tech
Shashikant G. Hegde grad student 2008 Georgia Tech
Karan Kacker grad student 2008 Georgia Tech
Krishna R. Tunga grad student 2008 Georgia Tech
Jiantao Zheng grad student 2008 Georgia Tech
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Publications

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Tian Y, Ren N, Zhao Z, et al. (2018) Ag₃Sn Compounds Coarsening Behaviors in Micro-Joints. Materials (Basel, Switzerland). 11
Krieger WER, Raghavan S, Sitaraman SK. (2016) Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination Ieee Transactions On Components, Packaging and Manufacturing Technology
Liu X, Thadesar PA, Taylor CL, et al. (2016) Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias Ieee Transactions On Components, Packaging and Manufacturing Technology
Abbaspour R, Woodrum DC, Kottke PA, et al. (2016) Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1388-1392
Asrar P, Zhang X, Woodrum CD, et al. (2016) Flow boiling of R245fa in a microgap with integrated staggered pin fins Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1007-1012
Chow J, Sitaraman SK. (2016) Electroplated copper nanowires as Thermal Interface Materials Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 151-155
Zhang X, Nasr MH, Woodrum DC, et al. (2016) Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 85-90
Raghavan S, Schmadlak I, Leal G, et al. (2016) Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability Engineering Fracture Mechanics. 153: 259-277
Samet D, Kwatra A, Sitaraman SK. (2015) A compliance-based approach to study fatigue crack propagation for a copper-epoxy interface Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2
Green C, Kottke P, Han X, et al. (2015) A review of two-phase forced cooling in three-dimensional stacked electronics: Technology integration Journal of Electronic Packaging, Transactions of the Asme. 137
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