Suresh Sitaraman

Affiliations: 
Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Computer Science
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"Suresh Sitaraman"

Children

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Rajiv C. Dunne grad student 2000 Georgia Tech
Weidong Xie grad student 2001 Georgia Tech
Lunyu Ma grad student 2003 Georgia Tech
Mitul B. Modi grad student 2003 Georgia Tech
Sai Zeng grad student 2004 Georgia Tech
Sakethraman Mahalingam grad student 2005 Georgia Tech
Injoong Kim grad student 2007 Georgia Tech
Andrew E. Perkins grad student 2007 Georgia Tech
Shashikant G. Hegde grad student 2008 Georgia Tech
Karan Kacker grad student 2008 Georgia Tech
Krishna R. Tunga grad student 2008 Georgia Tech
Jiantao Zheng grad student 2008 Georgia Tech
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Publications

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Tian Y, Ren N, Zhao Z, et al. (2018) Ag₃Sn Compounds Coarsening Behaviors in Micro-Joints. Materials (Basel, Switzerland). 11
Krieger WER, Raghavan S, Sitaraman SK. (2016) Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial Delamination Ieee Transactions On Components, Packaging and Manufacturing Technology
Samet D, Kwatra A, Sitaraman SK. (2015) A compliance-based approach to study fatigue crack propagation for a copper-epoxy interface Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2
Kwatra A, Samet D, Sitaraman SK. (2015) Effect of thermal aging on cohesive zone models to study copper leadframe/mold compound interfacial delamination Proceedings - Electronic Components and Technology Conference. 2015: 1531-1537
Raghavan S, Schmadlak I, Leal G, et al. (2014) Cohesive zone models to predict multiple white bumps in flip-chip assemblies Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10
Taylor C, Liu X, Sitaraman SK. (2014) Strain monitoring near through silicon vias using metal piezoresistive sensors Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10
Taylor C, Sitaraman SK. (2014) Crowd-funding for inspiring graduate students to educate K12 students about STEM Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 5
Raghavan S, Schmadlak I, Leal G, et al. (2014) Study of chip-package interaction parameters on interlayer dielectric crack propagation Ieee Transactions On Device and Materials Reliability. 14: 57-65
Chen W, Sitaraman SK. (2014) Response surface and multiobjective optimization methodology for the design of compliant interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1769-1777
Raghavan S, Schmadlak I, Leal G, et al. (2013) Chip-package co-design: Effect of substrate warpage on BEOL reliability Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10
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