Weidong Xie, Ph.D.
Affiliations: | 2001 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical EngineeringGoogle:
"Weidong Xie"Parents
Sign in to add mentor| Suresh Sitaraman | grad student | 2001 | Georgia Tech | |
| (Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages.) | ||||
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Publications
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| Xie W, Sitaraman SK. (2003) Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Experimental characterization Ieee Transactions On Advanced Packaging. 26: 447-452 |
| Xie W, Sitaraman SK. (2003) Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Modeling and evaluation Ieee Transactions On Advanced Packaging. 26: 441-446 |
| Xie W, Sitaraman SK. (2003) An experimental technique to determine critical stress intensity factors for delamination initiation Engineering Fracture Mechanics. 70: 1193-1201 |
| Variyam MN, Xie W, Sitaraman SK. (1999) Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling Journal of Electronic Packaging. 122: 121-127 |