Mitul B. Modi, Ph.D.

2003 Georgia Institute of Technology, Atlanta, GA 
Mechanical Engineering, Electronics and Electrical Engineering, Materials Science Engineering
"Mitul Modi"


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Suresh Sitaraman grad student 2003 Georgia Tech
 (Fracture in stress engineered, high density, thin film interconnects.)
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Modi MB, Ginga N, Sitaraman SK. (2009) Microcontact spring reliability: Design against interfacial fracture Ieee Transactions On Components and Packaging Technologies. 32: 197-206
Modi MB, Sitaraman SK. (2004) Single-sample decohesion test: Mechanics and implementataion International Journal of Fracture. 129: 1-20
Modi MB, Sitaraman SK. (2004) Interfacial fracture toughness measurement for thin film interfaces Engineering Fracture Mechanics. 71: 1219-1234
Modi MB, Sitaraman SK. (2003) Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement Proceedings of 5th Electronics Packaging Technology Conference, Eptc 2003. 456-461
Modi MB, Sitaraman SK. (2003) Measurement of the mode mix dependent interfacial fracture toughness for a Ti/Si interface using a modified decohesion test Advances in Electronic Packaging. 1: 559-573
Modi MB, Sitaraman SK. (2002) Modified decohesion test (MDT) for interfacial fracture toughness measurement in microelectronic/MEMS applications Asme International Mechanical Engineering Congress and Exposition, Proceedings. 277-282
Modi MB, Fork DK, Sitaraman SK. (2001) Numerical approximation of the energy release rate in intrinsically stressed micro-spring structures Advances in Electronic Packaging. 1: 357-364
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