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Mitul B. Modi, Ph.D.

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Electronics and Electrical Engineering, Materials Science Engineering
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Suresh Sitaraman grad student 2003 Georgia Tech
 (Fracture in stress engineered, high density, thin film interconnects.)

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Publications

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Zheng J, Modi M, Ginga N, et al. (2009) Silicon and nanoscale metal interface characterization using stress-engineered superlayer test methods Ieee Transactions On Components and Packaging Technologies. 32: 333-338
Modi MB, Ginga N, Sitaraman SK. (2009) Microcontact spring reliability: Design against interfacial fracture Ieee Transactions On Components and Packaging Technologies. 32: 197-206
Modi M, Sitaraman SK. (2004) Interfacial fracture toughness measurement of a Ti/Si interface Journal of Electronic Packaging, Transactions of the Asme. 126: 301-307
Modi MB, Sitaraman SK. (2004) Single-sample decohesion test: Mechanics and implementataion International Journal of Fracture. 129: 1-20
Modi MB, Sitaraman SK. (2004) Interfacial fracture toughness measurement for thin film interfaces Engineering Fracture Mechanics. 71: 1219-1234
Modi MB, Sitaraman SK. (2003) Single-substrate decohesion test (SSDT) for interfacial fracture toughness measurement Proceedings of 5th Electronics Packaging Technology Conference, Eptc 2003. 456-461
Modi MB, Sitaraman SK. (2003) Measurement of the mode mix dependent interfacial fracture toughness for a Ti/Si interface using a modified decohesion test Advances in Electronic Packaging. 1: 559-573
Modi MB, Sitaraman SK. (2002) Modified decohesion test (MDT) for interfacial fracture toughness measurement in microelectronic/MEMS applications Asme International Mechanical Engineering Congress and Exposition, Proceedings. 277-282
Fork DK, Chua C, Kim P, et al. (2000) Nano-spring arrays for high-density interconnect Proceedings of Spie. 4176: 226-235
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