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Sakethraman Mahalingam, Ph.D.

Affiliations: 
2005 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Materials Science Engineering
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"Sakethraman Mahalingam"
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Suresh Sitaraman grad student 2005 Georgia Tech
 (Study of interfacial crack propagation in flip chip assemblies with nano-filled underfill materials.)

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Mahalingam S, Tonapi S, Sitaraman SK. (2005) The characterization of underfill-passivation interface under monotonic and fatigue loading and ITS application to flip chip reliability prediction American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 219-224
Mahalingam S, Tonapi S, Sitaraman SK. (2005) A fracture mechanics analysis of underfill delamination in flip chip packages Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1341-1346
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