Sakethraman Mahalingam, Ph.D.

Affiliations: 
2005 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Materials Science Engineering
Google:
"Sakethraman Mahalingam"

Parents

Sign in to add mentor
Suresh Sitaraman grad student 2005 Georgia Tech
 (Study of interfacial crack propagation in flip chip assemblies with nano-filled underfill materials.)
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Goray K, Mahalingam S, Shah A, et al. (2006) Thermal shock testing as a reliability qualification test for lead-free solder American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp
Shah A, Mahalingam S, Goray K. (2006) Reliability evaluation of lead free electronics for automotive applications Carts Usa 2006. 184-191
Mahalingam S, Tonapi S, Sitaraman SK. (2005) The characterization of underfill-passivation interface under monotonic and fatigue loading and ITS application to flip chip reliability prediction American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 219-224
Mahalingam S, Joshi A, Lacey J, et al. (2005) Reliability of underfilled chip scale packages attached with heat sink American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 65-69
Mahalingam S, Tonapi S, Sitaraman SK. (2005) A fracture mechanics analysis of underfill delamination in flip chip packages Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1341-1346
Mahalingam S, Goray K, Joshi A. (2004) Design of underfill materials for lead free flip chip applications Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2: 473-479
See more...