Mary W. Seto, Ph.D.

Affiliations: 
2004 University of Alberta, Edmonton, Alberta, Canada 
Area:
Electronics and Electrical Engineering, Materials Science Engineering
Google:
"Mary Seto"

Parents

Sign in to add mentor
Michael J. Brett grad student 2004 University of Alberta
 (Mechanical response of microspring thin films.)
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Seto M, Westra K, Brett M. (2002) Arrays of self-sealed microchambers and channels Journal of Materials Chemistry. 12: 2348-2351
Seto MW, Dick B, Brett MJ. (2001) Nanoindentation of microspring thin films Materials Research Society Symposium - Proceedings. 657
Seto MW, Dick B, Brett MJ. (2001) Microsprings and microcantilevers: Studies of mechanical response Journal of Micromechanics and Microengineering. 11: 582-588
Seto MW, Robbie K, Vick D, et al. (1999) Mechanical response of thin films with helical microstructures Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 17: 2172
Vick D, Freiedrich L, Dew S, et al. (1999) Erratum to “Self-shadowing and surface diffusion effects in obliquely deposited thin films” [Thin solid Films 339 (1999) 88–94] Thin Solid Films. 349: 303
Vick D, Friedrich L, Dew S, et al. (1999) Self-shadowing and surface diffusion effects in obliquely deposited thin films Thin Solid Films. 339: 88-94
Seto MW. (1999) Mechanical response of thin films with helical microstructures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 17: 2172-2177
Seto MW, Robbie K, Brett MJ. (1999) Mechanical properties of microspring thin films fabricated by Glancing Angle Deposition (GLAD) Canadian Conference On Electrical and Computer Engineering. 3: 1616-1620
Brett MJ, Seto MW, Sit JC, et al. (1999) Glancing angle deposition: recent research results Proceedings of Spie - the International Society For Optical Engineering. 3790: 114-118
See more...