Stephen E. Mick, Ph.D.

2004 North Carolina State University, Raleigh, NC 
Electronics and Electrical Engineering
"Stephen Mick"


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Paul Franzon grad student 2004 NCSU
 (Analysis and design considerations for AC coupled interconnection systems.)
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Allard LF, Bigelow WC, Jose-Yacaman M, et al. (2009) A new MEMS-based system for ultra-high-resolution imaging at elevated temperatures. Microscopy Research and Technique. 72: 208-15
Damiano J, Nackashi DP, Mick SE. (2008) A MEMS-based technology platform for in-situ TEM heating studies Microscopy and Microanalysis. 14: 1332-1333
Allard LF, Bigelow WC, Nackashi D, et al. (2008) A new paradigm for ultra-high-resolution imaging at elevated temperatures Microscopy and Microanalysis. 14: 792-793
Quispe J, Damiano J, Mick SE, et al. (2007) An improved holey carbon film for cryo-electron microscopy. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 13: 365-71
Wilson JM, Mick SE, Xu J, et al. (2007) Considerations for transmission line design on MCMs using AC coupled interconnect with buried solder bumps Proceedings - 10th Ieee Workshop On Signal Propagation On Interconnects, Spi 2006. 281-282
Luo L, Wilson JM, Mick SE, et al. (2006) 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver Ieee Journal of Solid-State Circuits. 41: 287-296
Luo L, Wilson J, Mick S, et al. (2006) A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver Proceedings of the Custom Integrated Circuits Conference. 773-776
Davis WR, Wilson J, Mick S, et al. (2005) Demystifying 3D ICs: The pros and cons of going vertical Ieee Design and Test of Computers. 22: 498-510
Wilson J, Mick S, Xu J, et al. (2005) Fully integrated AC coupled interconnect using buried bumps Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 7-10
Luo L, Wilson JM, Mick SE, et al. (2005) 3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 48
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