Stephen E. Mick, Ph.D.
Affiliations: | 2004 | North Carolina State University, Raleigh, NC |
Area:
Electronics and Electrical EngineeringGoogle:
"Stephen Mick"Parents
Sign in to add mentor| Paul Franzon | grad student | 2004 | NCSU | |
| (Analysis and design considerations for AC coupled interconnection systems.) | ||||
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Publications
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| Allard LF, Bigelow WC, Jose-Yacaman M, et al. (2009) A new MEMS-based system for ultra-high-resolution imaging at elevated temperatures. Microscopy Research and Technique. 72: 208-15 |
| Damiano J, Nackashi DP, Mick SE. (2008) A MEMS-based technology platform for in-situ TEM heating studies Microscopy and Microanalysis. 14: 1332-1333 |
| Allard LF, Bigelow WC, Nackashi D, et al. (2008) A new paradigm for ultra-high-resolution imaging at elevated temperatures Microscopy and Microanalysis. 14: 792-793 |
| Quispe J, Damiano J, Mick SE, et al. (2007) An improved holey carbon film for cryo-electron microscopy. Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada. 13: 365-71 |
| Wilson JM, Mick SE, Xu J, et al. (2007) Considerations for transmission line design on MCMs using AC coupled interconnect with buried solder bumps Proceedings - 10th Ieee Workshop On Signal Propagation On Interconnects, Spi 2006. 281-282 |
| Luo L, Wilson JM, Mick SE, et al. (2006) 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver Ieee Journal of Solid-State Circuits. 41: 287-296 |
| Luo L, Wilson J, Mick S, et al. (2006) A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver Proceedings of the Custom Integrated Circuits Conference. 773-776 |
| Davis WR, Wilson J, Mick S, et al. (2005) Demystifying 3D ICs: The pros and cons of going vertical Ieee Design and Test of Computers. 22: 498-510 |
| Wilson J, Mick S, Xu J, et al. (2005) Fully integrated AC coupled interconnect using buried bumps Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 7-10 |
| Luo L, Wilson JM, Mick SE, et al. (2005) 3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 48 |