Thorlindur Thorolfsson, Ph.D.

2011 North Carolina State University, Raleigh, NC 
Computer Engineering, Electronics and Electrical Engineering
"Thorlindur Thorolfsson"


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Paul Franzon grad student 2011 NCSU
 (Three-Dimensional Integration of Synthetic Aperture Radar Processors.)
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Franzon PD, Priyadarshi S, Lipa S, et al. (2013) Exploring early design tradeoffs in 3DIC Proceedings - Ieee International Symposium On Circuits and Systems. 545-549
Franzon PD, Rotenberg E, Tuck J, et al. (2013) Applications and design styles for 3DIC Technical Digest - International Electron Devices Meeting, Iedm. 29.4.1-29.4.4
Melamed S, Thorolfsson T, Harris TR, et al. (2012) Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689
Thorolfsson T, Lipa S, Franzon PD. (2012) A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration Proceedings of the Custom Integrated Circuits Conference
Franzon PD, Davis WR, Thorolfsson T, et al. (2011) 3D specific systems design and CAD Proceedings - 2011 International Conference On Embedded Computer Systems: Architectures, Modeling and Simulation, Ic-Samos 2011. 326-329
Franzon PD, Davis WR, Thorolfsson T, et al. (2011) 3D specific systems: Design and CAD Proceedings of the Asian Test Symposium. 470-473
Thorolfsson T, Moezzi-Madani N, Franzon PD. (2011) Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor Iet Computers and Digital Techniques. 5: 198-204
Thorolfsson T, Melamed S, Davis WR, et al. (2010) Low-power hypercube divided memory FFT engine using 3D integration Acm Transactions On Design Automation of Electronic Systems. 16
Thorolfsson T, Luo G, Cong J, et al. (2010) Logic-on-logic 3D integration and placement Ieee 3d System Integration Conference 2010, 3dic 2010
Lipa S, Thorolfsson T, Franzon P. (2010) The NCSU Tezzaron design kit Ieee 3d System Integration Conference 2010, 3dic 2010
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