Shivam Priyadarshi, Ph.D.
Affiliations: | 2013 | Electrical Engineering | North Carolina State University, Raleigh, NC |
Area:
Electronics and Electrical Engineering, Computer EngineeringGoogle:
"Shivam Priyadarshi"Parents
Sign in to add mentorPaul Franzon | grad student | 2013 | NCSU | |
(System and Gate-level Dynamic Electrothermal Simulation of Three Dimensional Integrated Circuits.) |
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Publications
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Cerqueira JP, Repetti TJ, Pu Y, et al. (2020) Catena: A Near-Threshold, Sub-0.4-mW, 16-Core Programmable Spatial Array Accelerator for the Ultralow-Power Mobile and Embedded Internet of Things Ieee Journal of Solid-State Circuits. 55: 2270-2284 |
Priyadarshi S, Davis WR, Steer MB, et al. (2014) Thermal pathfinding for 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1159-1168 |
Priyadarshi S, Davis WR, Franzon PD. (2014) Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC Icicdt 2014 - Ieee International Conference On Integrated Circuit Design and Technology |
Priyadarshi S, Choudhary NK, Dwiel B, et al. (2013) Hetero2 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors Proceedings - International Symposium On Quality Electronic Design, Isqed. 1-7 |
Franzon PD, Priyadarshi S, Lipa S, et al. (2013) Exploring early design tradeoffs in 3DIC Proceedings - Ieee International Symposium On Circuits and Systems. 545-549 |
Franzon PD, Rotenberg E, Tuck J, et al. (2013) Applications and design styles for 3DIC Technical Digest - International Electron Devices Meeting, Iedm. 29.4.1-29.4.4 |
Harris TR, Priyadarshi S, Melamed S, et al. (2012) A transient electrothermal analysis of three-dimensional integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 660-667 |
Priyadarshi S, Saunders CS, Kriplani NM, et al. (2012) Parallel transient simulation of multiphysics circuits using delay-based partitioning Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 1522-1535 |
Melamed S, Thorolfsson T, Harris TR, et al. (2012) Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689 |
Priyadarshi S, Harris TR, Melamed S, et al. (2012) Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels Iet Circuits, Devices and Systems. 6: 35-44 |