Vinu Govind, Ph.D.

Affiliations: 
2005 Georgia Institute of Technology, Atlanta, GA 
Area:
Electronics and Electrical Engineering, Packaging Engineering
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"Vinu Govind"

Parents

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Madhavan Swaminathan grad student 2005 Georgia Tech
 (Design of baluns and low noise amplifiers in integrated mixed -signal organic substrates.)
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Publications

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Choi J, Govind V, Swaminathan M, et al. (2010) Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN) Ieee Transactions On Advanced Packaging. 33: 2-12
White G, Dalmia S, Carastro L, et al. (2008) A novel methodology for 3D integration using multilayer organics Imaps International Conference and Exhibition On Device Packaging - in Conjunction With the Global Business Council, Gbc 2008 Spring Conference. 331-336
Raj PM, Balaraman D, Govind V, et al. (2007) Processing and dielectric properties of nanocomposite thin film "supercapacitors" for high-frequency embedded decoupling Ieee Transactions On Components and Packaging Technologies. 30: 569-578
Choi J, Kam DG, Chung D, et al. (2007) Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications Ieee Transactions On Advanced Packaging. 30: 180-190
Dalmia S, Govind V, Dekosky J, et al. (2006) Design and implementations of RF systems and sub-systems in LCP-type multilayer technology Proceedings - Electronic Components and Technology Conference. 2006: 1658-1662
Choi J, Govind V, Mandrekar R, et al. (2005) Noise reduction and design methodology in mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structure Ieee Mtt-S International Microwave Symposium Digest. 2005: 849-852
Govind V, Yun W, Dalmia S, et al. (2005) Analysis and design of compact wideband baluns on multilayer Liquid Crystalline Polymer (LCP) based substrates Ieee Mtt-S International Microwave Symposium Digest. 2005: 543-546
Swaminathan M, Bavisi A, Yun W, et al. (2005) Design and fabrication of integrated RF modules in Liquid Crystalline Polymer (LCP) substrates Iecon Proceedings (Industrial Electronics Conference). 2005: 2346-2351
Choi J, Govind V, Swaminathan M. (2005) Noise suppression in Ultra Wide Band (UWB) applications using Alternating Impedance Electromagnetic Bandgap (AI-EBG) structures 35th European Microwave Conference 2005 - Conference Proceedings. 3: 2003-2006
Yun W, Govind V, Dalmia S, et al. (2005) An integrated double balanced mixer on Multilayer Liquid Crystalline Polymer (M-LCP) based substrate 35th European Microwave Conference 2005 - Conference Proceedings. 3: 1635-1638
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