Ki Jin Han, Ph.D.

Affiliations: 
2009 Georgia Institute of Technology, Atlanta, GA 
 2017- Dongguk University, Seoul, South Korea 
Area:
Electronics and Electrical Engineering, Electricity and Magnetism Physics
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"Ki Jin Han"

Parents

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Madhavan Swaminathan grad student 2009 Georgia Tech
 (Electromagnetic modeling of interconnections in three-dimensional integration.)
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Publications

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Park HP, Ryu Y, Han KJ, et al. (2016) Design considerations of resonant network and transformer magnetics for high frequency LLC resonant converter Journal of Electrical Engineering and Technology. 11: 383-392
Ryu Y, Han KJ. (2016) Extraction of High-Frequency Phase-to-Phase Coupling in AC Machine Using Mixed-Mode Network Parameters Ieee Transactions On Magnetics. 52
Han KJ, Martin B, Swaminathan M. (2016) Robust method for analysis of power distribution networks 2015 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2015. 213-216
Kim S, Kim Y, Han KJ. (2016) Identification of parameter domain for the design of high-speed I/O interface 2015 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2015. 67-70
Ryu Y, Park BR, Han KJ. (2015) Estimation of high-frequency parameters of AC machine from transmission line model Ieee Transactions On Magnetics. 51
Xie B, Swaminathan M, Han KJ. (2015) FDFD Nonconformal Domain Decomposition Method for the Electromagnetic Modeling of Interconnections in Silicon Interposer Ieee Transactions On Electromagnetic Compatibility
Patel R, Han KJ. (2015) Utilization of higher-mode resonance in broadening the E-plane HPBW of printed antenna for automotive radar application 2015 International Workshop On Antenna Technology, Iwat 2015. 330-332
Han KJ, Sandeep S, Martin B, et al. (2015) Modeling of Power Distribution Networks for path finding 2015 Ieee 24th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2015. 11-14
Han KJ, Swaminathan M. (2015) Efficient computation of capacitive coupling between planar and cylindrical interconnections 2014 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Edaps 2014. 13-16
Han KJ, Lim Y, Kim Y. (2014) A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameter Journal of Semiconductor Technology and Science. 14: 649-657
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