Yakup Bayram, Ph.D.

Affiliations: 
2006 Ohio State University, Columbus, Columbus, OH 
Area:
Electronics and Electrical Engineering
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"Yakup Bayram"

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John L. Volakis grad student 2006 Ohio State
 (Hybrid methods for mixed signal circuits subject to on and off -board electromagnetic interference.)
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Publications

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Walton EK, Bayram Y, Ruege AC, et al. (2013) Structural health monitoring of furnace walls Ceramic Engineering and Science Proceedings. 34: 201-206
Volakis JL, Zhang L, Wang Z, et al. (2012) Embroidered flexible RF electronics 2012 Ieee International Workshop On Antenna Technology, Iwat 2012. 8-11
Chung JY, Nahar NK, Zhang L, et al. (2012) Broadband radio frequency conductivity measurement technique for engineered composites Iet Microwaves, Antennas and Propagation. 6: 371-376
Yang T, Bayram Y, Volakis JL. (2010) Hybrid analysis of electromagnetic interference effects on microwave active circuits within cavity enclosures Ieee Transactions On Electromagnetic Compatibility. 52: 745-748
Bayram Y, Zhou Y, Shim BS, et al. (2010) E-textile conductors and polymer composites for conformal lightweight antennas Ieee Transactions On Antennas and Propagation. 58: 2732-2736
Zhou Y, Bayram Y, Du F, et al. (2010) Polymer-carbon nanotube sheets for conformal load bearing antennas Ieee Transactions On Antennas and Propagation. 58: 2169-2175
Chang PC, Burkholder RJ, Volakis JL, et al. (2009) High-frequency em characterization of through-wall building imaging Ieee Transactions On Geoscience and Remote Sensing. 47: 1375-1387
Khan Z, Bayram Y, Volakis JL. (2009) EMI/EMC analysis of printed circuit boards subject to near-zone illuminations Ieee Transactions On Electromagnetic Compatibility. 51: 406-408
Zhou Y, Bayram Y, Dai L, et al. (2009) Conformal load-bearing polymer-carbon nanotube antennas and RF front-ends Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest)
Khan ZA, Bayram Y, Volakis JL. (2008) EMI/EMC measurements and simulations for cables and PCBs enclosed within metallic structures Ieee Transactions On Electromagnetic Compatibility. 50: 441-445
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