Year |
Citation |
Score |
2016 |
Cheng YH, Zhang CY, Ren J, Tong KY. Hydrogen storage in Li-doped fullerene-intercalated hexagonal boron nitrogen layers Frontiers of Physics. 11. DOI: 10.1007/s11467-016-0559-4 |
0.349 |
|
2013 |
Wang C, Lee I, Wu C, Cheng Y, Yang P, Cheng H. High-performance polycrystalline silicon thin-film transistors prepared via the laser crystallization of the prepatterned channel layer on the bottom-gate structure Thin Solid Films. 529: 421-425. DOI: 10.1016/J.Tsf.2012.09.048 |
0.317 |
|
2012 |
Wang CL, Lee IC, Wu CY, Liao CY, Cheng YT, Cheng HC. High-performance polycrystalline silicon thin-film transistors with two-dimensional location control of the grain boundary via excimer laser crystallization. Journal of Nanoscience and Nanotechnology. 12: 5505-9. PMID 22966599 DOI: 10.1166/Jnn.2012.6308 |
0.305 |
|
2012 |
Wang C, Cheng H, Lee I, Wu C, Cheng Y, Yang P. High-performance excimer-laser-crystallized polycrystalline silicon thin-film transistors with the pre-patterned recessed channel Japanese Journal of Applied Physics. 51: 66502. DOI: 10.1143/Jjap.51.066502 |
0.305 |
|
2012 |
Wang C, Lee I, Wu C, Chou C, Yang P, Cheng Y, Cheng H. High-Performance Polycrystalline-Silicon Nanowire Thin-Film Transistors With Location-Controlled Grain Boundary via Excimer Laser Crystallization Ieee Electron Device Letters. 33: 1562-1564. DOI: 10.1109/Led.2012.2211857 |
0.304 |
|
2010 |
Chao T, Li C, Chen YC, Chen H, Cheng Y, Kuo C. An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration Ieee Transactions On Electron Devices. 57: 928-938. DOI: 10.1109/Ted.2010.2040660 |
0.304 |
|
2009 |
Liu CM, Tseng YC, Chen C, Hsu MC, Chao TY, Cheng YT. Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition. Nanotechnology. 20: 415703. PMID 19762942 DOI: 10.1088/0957-4484/20/41/415703 |
0.312 |
|
2007 |
Kou CT, Chao TY, Chiang IT, Cheng Y. Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application Sensors and Actuators a-Physical. 139: 259-264. DOI: 10.1016/J.Sna.2006.10.043 |
0.311 |
|
2006 |
Tsai L, Cheng Y, Hsu W, Fang W. Ni-carbon nanotubes nanocomposite for robust microelectromechanical systems fabrication Journal of Vacuum Science & Technology B. 24: 205-210. DOI: 10.1116/1.2161222 |
0.317 |
|
2006 |
Liang Z, Cheng Y, Hsu W, Lee Y. A wafer-level hermetic encapsulation for MEMS manufacture application Ieee Transactions On Advanced Packaging. 29: 513-519. DOI: 10.1109/Tadvp.2006.875092 |
0.305 |
|
2006 |
Tsai L, Shen G, Cheng Y, Hsu W. Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite Ieee\/Asme Journal of Microelectromechanical Systems. 15: 149-158. DOI: 10.1109/Jmems.2005.863737 |
0.324 |
|
2005 |
Shen G, Cheng Y, Tsai L. Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications Ieee Transactions On Nanotechnology. 4: 539-547. DOI: 10.1109/Tnano.2005.851397 |
0.321 |
|
2005 |
Teh KS, Cheng YT, Lin L. MEMS fabrication based on nickel-nanocomposite: Film deposition and characterization Journal of Micromechanics and Microengineering. 15: 2205-2215. DOI: 10.1088/0960-1317/15/12/001 |
0.324 |
|
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