Year |
Citation |
Score |
2020 |
Dick RP, Shang L, Wolf M, Yang S. Guest Editors’ Introduction: Embedded Intelligence in the Internet-of-Things Ieee Design & Test of Computers. 37: 5-6. DOI: 10.1109/Mdat.2019.2957370 |
0.301 |
|
2016 |
Hu T, You Q, Chen D, Tong J, Shang L, Luo J, Qiu Y, Yu H, Zeng L, Huang J. Inhibiting Matrix Metalloproteinase 3 Ameliorates Neuronal Loss in the Ganglion Cell Layer of Rats in Retinal Ischemia/Reperfusion. Neurochemical Research. PMID 26830289 DOI: 10.1007/s11064-015-1800-1 |
0.307 |
|
2014 |
Mohamed M, Li Z, Chen X, Shang L, Mickelson AR. Reliability-aware design flow for silicon photonics on-chip interconnect Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 22: 1763-1776. DOI: 10.1109/Tvlsi.2013.2278383 |
0.35 |
|
2013 |
Wu J, Wang J, Li K, Zhou H, Lv Q, Shang L, Sun Y. Large-Scale Energy Storage System Design and Optimization for Emerging Electric-Drive Vehicles Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 32: 325-338. DOI: 10.1109/Tcad.2012.2228268 |
0.313 |
|
2012 |
Li Z, Mohamed M, Chen X, Dudley E, Meng K, Shang L, Mickelson AR, Joseph R, Vachharajani M, Schwartz B, Sun Y. Reliability modeling and management of nanophotonic on-chip networks Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 20: 98-111. DOI: 10.1109/Tvlsi.2010.2089072 |
0.338 |
|
2011 |
Li Z, Mohamed M, Chen X, Zhou H, Mickelson A, Shang L, Vachharajani M. Iris: A hybrid nanophotonic network design for high-performance and low-power on-chip communication Acm Journal On Emerging Technologies in Computing Systems. 7. DOI: 10.1145/1970406.1970410 |
0.35 |
|
2011 |
Hassan Z, Allec N, Yang F, Shang L, Dick RP, Zeng X. Full-Spectrum Spatial–Temporal Dynamic Thermal Analysis for Nanometer-Scale Integrated Circuits Ieee Transactions On Very Large Scale Integration Systems. 19: 2276-2289. DOI: 10.1109/Tvlsi.2010.2076351 |
0.315 |
|
2010 |
Zhang W, Jha NK, Shang L. Low-power 3D nano/CMOS hybrid dynamically reconfigurable architecture Acm Journal On Emerging Technologies in Computing Systems. 6: 1-32. DOI: 10.1145/1777401.1777403 |
0.356 |
|
2010 |
Chen X, Yang L, Dick RP, Shang L, Lekatsas H. C-Pack: A High-Performance Microprocessor Cache Compression Algorithm Ieee Transactions On Very Large Scale Integration Systems. 18: 1196-1208. DOI: 10.1109/Tvlsi.2009.2020989 |
0.3 |
|
2010 |
Lu Y, Zhou H, Shang L, Zeng X. Multicore Parallelization of Min-Cost Flow for CAD Applications Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 29: 1546-1557. DOI: 10.1109/Tcad.2010.2061150 |
0.32 |
|
2010 |
Li Z, Mohamed M, Zhou H, Shang L, Mickelson A, Filipovic D, Vachharajani M, Park W, Sun Y. Global On-chip coordination at light speed Ieee Design and Test of Computers. 27: 54-65. DOI: 10.1109/Mdt.2010.75 |
0.332 |
|
2009 |
Zhang W, Jha NK, Shang L. Design space exploration and data memory architecture design for a hybrid nano/CMOS dynamically reconfigurable architecture Acm Journal On Emerging Technologies in Computing Systems. 5: 1-27. DOI: 10.1145/1629091.1629093 |
0.354 |
|
2009 |
Zhang W, Jha NK, Shang L. A hybrid nano/CMOS dynamically reconfigurable system—Part I Acm Journal On Emerging Technologies in Computing Systems. 5: 1-30. DOI: 10.1145/1629091.1629092 |
0.353 |
|
2009 |
Zhang W, Jha NK, Shang L. A hybrid Nano/CMOS dynamically reconfigurable system—Part II Acm Journal On Emerging Technologies in Computing Systems. 5: 1-31. DOI: 10.1145/1568485.1568487 |
0.336 |
|
2009 |
Zhu C, Gu Z, Dick RP, Shang L, Knobel RG. Characterization of single-electron tunneling transistors for designing low-power embedded systems Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 646-659. DOI: 10.1109/Tvlsi.2008.2009013 |
0.348 |
|
2009 |
Hassan Z, Allec N, Shang L, Dick RP, Venkatraman V, Yang R. Multiscale thermal analysis for nanometer-scale integrated circuits Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 28: 860-873. DOI: 10.1109/Tcad.2009.2017428 |
0.32 |
|
2008 |
Gu Z, Zhu C, Shang L, Dick RP. Application-Specific MPSoC Reliability Optimization Ieee Transactions On Very Large Scale Integration Systems. 16: 603-608. DOI: 10.1109/Tvlsi.2008.917574 |
0.319 |
|
2008 |
Zhu C, Gu Z, Shang L, Dick RP, Joseph R. Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 27: 1479-1492. DOI: 10.1109/Tcad.2008.925793 |
0.306 |
|
2008 |
Kumar A, Shang L, Peh LS, Jha NK. System-level dynamic thermal management for high-performance microprocessors Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 27: 96-107. DOI: 10.1109/Tcad.2007.907062 |
0.407 |
|
2008 |
Li Z, Zhu C, Shang L, Dick R, Sun Y. Transaction-Aware Network-on-Chip Resource Reservation Ieee Computer Architecture Letters. 7: 53-56. DOI: 10.1109/L-Ca.2008.9 |
0.314 |
|
2007 |
Shang L, Dick RP, Jha NK. SLOPES: Hardware–Software Cosynthesis of Low-Power Real-Time Distributed Embedded Systems With Dynamically Reconfigurable FPGAs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 26: 508-526. DOI: 10.1109/Tcad.2006.883909 |
0.315 |
|
2007 |
Yang Y, Gu Z, Zhu C, Dick RP, Shang L. ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 26: 86-99. DOI: 10.1109/Tcad.2006.882589 |
0.312 |
|
2007 |
Brooks D, Dick RP, Joseph R, Shang L. Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors Ieee Micro. 27: 49-62. DOI: 10.1109/Mm.2007.58 |
0.324 |
|
2006 |
Shang L, Dick RP. Thermal crisis: challenges and potential solutions Ieee Potentials. 25: 31-35. DOI: 10.1109/Mp.2006.1692283 |
0.33 |
|
2002 |
Shang L, Peh L, Jha NK. Power-efficient Interconnection Networks: Dynamic Voltage Scaling with Links Ieee Computer Architecture Letters. 1: 6-6. DOI: 10.1109/L-Ca.2002.10 |
0.304 |
|
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