| Year |
Citation |
Score |
| 2015 |
In'T Veld BH, Overmeyer L, Schmidt M, Wegener K, Malshe A, Bartolo P. Micro additive manufacturing using ultra short laser pulses Cirp Annals - Manufacturing Technology. 64: 701-724. DOI: 10.1016/J.Cirp.2015.05.007 |
0.323 |
|
| 2012 |
Kalita P, Malshe AP, Rajurkar KP. Study of tribo-chemical lubricant film formation during application of nanolubricants in minimum quantity lubrication (MQL) grinding Cirp Annals - Manufacturing Technology. 61: 327-330. DOI: 10.1016/J.Cirp.2012.03.031 |
0.496 |
|
| 2011 |
Kalita P, Malshe AP, Arun Kumar S, Yoganath VG, Gurumurthy T. Study of specific energy and friction coefficient in minimum quantity lubrication grinding using oil-based nanolubricants Transactions of the North American Manufacturing Research Institution of Sme. 39: 403-411. DOI: 10.1016/j.jmapro.2012.01.001 |
0.471 |
|
| 2011 |
Li L, Hong M, Schmidt M, Zhong M, Malshe A, Huis In'Tveld B, Kovalenko V. Laser nano-manufacturing - State of the art and challenges Cirp Annals - Manufacturing Technology. 60: 735-755. DOI: 10.1016/J.Cirp.2011.05.005 |
0.345 |
|
| 2010 |
Tao Y, Malshe AP, Brown WD, DeReus DR, Cunningham S. Correction to "Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices" [Aug 03 283-288] Ieee Transactions On Advanced Packaging. 33: 569-569. DOI: 10.1109/Tadvp.2010.2049287 |
0.456 |
|
| 2010 |
Kalita P, Malshe AP, Jiang W, Shih AJ. Tribological study of nano lubricant integrated soybean oil for minimum quantity lubrication (MQL) grinding Transactions of the North American Manufacturing Research Institution of Sme. 38: 137-144. |
0.505 |
|
| 2009 |
O'Neal CB, Malshe AP, Schmidt WF, Gordon MH, Brown WD. Effects of die attachment induced stress on the reliability of a packaged MEMS device Journal of Microelectronics and Electronic Packaging. 6: 164-171. DOI: 10.4071/1551-4897-6.3.164 |
0.662 |
|
| 2009 |
Kalita P, Shih AJ, Verma A, Malshe AP. Investigating tribological properties of MoS2 nanoparticles based machining fluids for minimum quantity lubrication (MQL) grinding Society of Tribologists and Lubrication Engineers Annual Meeting and Exhibition 2009. 315-320. |
0.509 |
|
| 2008 |
Shen B, Kalita P, Malshe AP, Shih AJ. Performance of novel MoS2 nanoparticles based grinding fluids in minimum quantity lubrication grinding Transactions of the North American Manufacturing Research Institution of Sme. 36: 357-364. |
0.469 |
|
| 2006 |
Al-Fandi M, Kim J, Malshe AP, Tung S, Jenkins J, Pooran R. Chemo-sensitivity and reliability of flagellar rotary motor in a MEMS microfluidic actuation system Sensors and Actuators B: Chemical. 114: 229-238. DOI: 10.1016/J.Snb.2005.04.032 |
0.637 |
|
| 2006 |
Rajurkar KP, Levy G, Malshe A, Sundaram MM, McGeough J, Hu X, Resnick R, DeSilva A. Micro and nano machining by electro-physical and chemical processes Cirp Annals - Manufacturing Technology. 55: 643-666. DOI: 10.1016/J.Cirp.2006.10.002 |
0.324 |
|
| 2005 |
Tao Y, Malshe AP. Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Microelectronics Reliability. 45: 559-566. DOI: 10.1016/J.Microrel.2004.08.004 |
0.376 |
|
| 2005 |
Mohan A, O'Neal CB, Malshe AP, Foster RB. A wafer-level packaging approach for MEMS & related microsystems using selective Laser-Assisted Bonding (LAB) Proceedings - Electronic Components and Technology Conference. 2: 1099-1102. |
0.647 |
|
| 2004 |
Tao Y, Malshe AP, Brown WD. Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems Microelectronics Reliability. 44: 251-258. DOI: 10.1016/S0026-2714(03)00192-6 |
0.5 |
|
| 2004 |
Malshe A, Deshpande D, Stach E, Rajurkar K, Alexander D. Investigation of Femtosecond Laser-assisted Micromachining of Lithium Niobate Cirp Annals. 53: 187-190. DOI: 10.1016/S0007-8506(07)60675-1 |
0.345 |
|
| 2004 |
Malshe A, Deshpande D. Nano and microscale surface and sub-surface modifications induced in optical materials by femtosecond laser machining Journal of Materials Processing Technology. 149: 585-590. DOI: 10.1016/J.Jmatprotec.2003.11.050 |
0.335 |
|
| 2003 |
Tao Y, Malshe AP, Brown WD, DeReus DR, Cunningham S. Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices Ieee Transactions On Advanced Packaging. 26: 283-288. DOI: 10.1109/Tadvp.2003.817969 |
0.448 |
|
| 2003 |
Stach EA, Radmilovic V, Deshpande D, Malshe A, Alexander D, Doerr D. Nanoscale surface and subsurface defects induced in lithium niobate by a femtosecond laser Applied Physics Letters. 83: 4420-4422. DOI: 10.1063/1.1629797 |
0.307 |
|
| 2003 |
Spencer D, Malshe AP, Foster RB, O'Neal CB. Novel Method for Wafer-Scale Packaging of Opto-electronic Devices Proceedings of Spie - the International Society For Optical Engineering. 5288: 708-713. |
0.675 |
|
| 2002 |
O'Neal CB, Malshe AP, Virwani K, Schmidt WF. Design consideration, process and mechanical modeling, and tolerance analysis of a MEMS-based mechanical machining system-on-a-chip (SOAC) for nanomanufacturing American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 529-534. |
0.675 |
|
| 2002 |
Tao Y, Malshe AP, Brown WD. Laser bonding and modeling for wafer-level & chip-scale packaging of micro -electro -mechanical systems American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 55-60. |
0.319 |
|
| 2002 |
Tao Y, Malshe AP, Brown WD. Laser-assisted selective bonding for wafer-level & chip-scale vacuum packaging of MEMS and related micro systems Proceedings of Spie - the International Society For Optical Engineering. 4931: 93-98. |
0.312 |
|
| 2002 |
Tao Y, Malshe AP, Brown WD. Investigation of Laser-assisted Bonding for MEMS Packaging International Journal of Nonlinear Sciences and Numerical Simulation. 3: 427-431. |
0.312 |
|
| Show low-probability matches. |