Year |
Citation |
Score |
2020 |
Chuang H, Sanchez J. Parametric Characterization of Copper Metal Coatings Produced by Supercritical Argon Electroplating Jom. 72: 711-720. DOI: 10.1007/S11837-019-03739-7 |
0.33 |
|
2019 |
Chuang HC, Su HC, Sanchez J. The characteristics of nickel film produced by supercritical carbon dioxide electroplating with ultrasonic agitation. Ultrasonics Sonochemistry. 57: 48-56. PMID 31208618 DOI: 10.1016/J.Ultsonch.2019.05.005 |
0.326 |
|
2019 |
Chuang H, Sanchez J. Fabrication of Cu coatings by ultrasound-assisted supercritical argon electroplating Materials Letters. 243: 54-57. DOI: 10.1016/J.Matlet.2019.02.001 |
0.324 |
|
2018 |
Chuang HC, Yang HM, Wu GL, Sánchez J, Shyu JH. The effects of ultrasonic agitation on supercritical CO2 copper electroplating. Ultrasonics Sonochemistry. 40: 147-156. PMID 28946408 DOI: 10.1016/J.Ultsonch.2017.06.029 |
0.353 |
|
2017 |
Chuang HC, Sánchez J, Cheng HY. The Effect of Surfactant Content over Cu-Ni Coatings Electroplated by the sc-CO₂ Technique. Materials (Basel, Switzerland). 10. PMID 28772787 DOI: 10.3390/Ma10040428 |
0.311 |
|
2016 |
Chuang HC, Teng YC, Sanchez J. Study on the effects of pressure and material characterization in thin film and TSV fabricated by supercritical carbon dioxide electrolyte Materials Science in Semiconductor Processing. 56: 5-13. DOI: 10.1016/J.Mssp.2016.07.016 |
0.317 |
|
2016 |
Chuang HC, Hong GY, Sanchez J. Fabrication of high aspect ratio copper nanowires using supercritical CO2 fluids electroplating technique in AAO template Materials Science in Semiconductor Processing. 45: 17-26. DOI: 10.1016/J.Mssp.2016.01.009 |
0.344 |
|
2015 |
Chuang H, Lai W, Sanchez J. An investigation of supercritical-CO2 copper electroplating parameters for application in TSV chips Journal of Micromechanics and Microengineering. 25: 15004. DOI: 10.1088/0960-1317/25/1/015004 |
0.325 |
|
2014 |
Chuang HC, Huang CS, Chen HP, Huang CS, Lin YH. The design, fabrication and characterization of a transparent atom chip. Sensors (Basel, Switzerland). 14: 10292-305. PMID 24922456 DOI: 10.3390/S140610292 |
0.378 |
|
2014 |
Chuang HC, Huang CS. The development of a portable ultrahigh vacuum chamber via silicon block. The Review of Scientific Instruments. 85: 053107. PMID 24880353 DOI: 10.1063/1.4879115 |
0.324 |
|
2014 |
Chuang H, Lin Y, Lin Y, Huang C. The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell Journal of Micromechanics and Microengineering. 24: 45013. DOI: 10.1088/0960-1317/24/4/045013 |
0.355 |
|
2014 |
Chuang H, Lee W. Parametric optimization of Nd–YVO4 laser for straight scribing on silver nanowire based conductive thin films by Taguchi method Optics and Laser Technology. 57: 149-153. DOI: 10.1016/J.Optlastec.2013.10.010 |
0.326 |
|
2013 |
Chuang H, Li H, Lin Y, Lin Y, Huang C. The development of an atom chip with through silicon vias for an ultra-high-vacuum cell Journal of Micromechanics and Microengineering. 23: 85004. DOI: 10.1088/0960-1317/23/8/085004 |
0.38 |
|
2012 |
Chuang HC, Chang CR, Chen CC, Chang MS. An external cavity diode laser using a volume holographic grating Optics and Laser Technology. 44: 2182-2185. DOI: 10.1016/J.Optlastec.2012.03.004 |
0.302 |
|
2011 |
Chuang H, Huang K. A compact extended cavity laser using a micromachined silicon flexure for atomic spectroscopy Sensors and Actuators a-Physical. 169: 227-233. DOI: 10.1016/J.Sna.2011.05.008 |
0.372 |
|
2011 |
Chuang HC, Salim EA, Vuletic V, Anderson DZ, Bright VM. Multi-layer atom chips for atom tunneling experiments near the chip surface Sensors and Actuators, a: Physical. 165: 101-106. DOI: 10.1016/J.Sna.2010.01.003 |
0.503 |
|
2008 |
Chuang HC, Jiménez-Martínez R, Braun S, Anderson DZ, Bright VM. Tunable external cavity diode laser using a micromachined silicon flexure and a volume holographic reflection grating for applications in atomic optics Journal of Micro/Nanolithography, Mems, and Moems. 7. DOI: 10.1117/1.2911630 |
0.511 |
|
2006 |
Chuang H, Tso P. An investigation of lapping characteristics for improving the form error of an aspheric lens Journal of Materials Processing Technology. 176: 183-190. DOI: 10.1016/J.Jmatprotec.2006.03.134 |
0.301 |
|
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