Paul Franzon - Publications

Affiliations: 
North Carolina State University, Raleigh, NC 
Area:
Electronics and Electrical Engineering, Computer Science

204 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Yan Z, Aygun K, Braunisch H, Franzon PD. Multimode High-Density Link Design Methodology and Implementation Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2016.2585498  1
2016 Zhao W, Bhanushali K, Franzon P. Design of a rectifier-free UHF gen-2 compatible RFID tag using RF-only logic 2016 Ieee International Conference On Rfid, Rfid 2016. DOI: 10.1109/RFID.2016.7488013  1
2015 Di Spigna N, Schinke D, Jayanti S, Misra V, Franzon P. A novel double floating-gate unified memory device Ieee/Ifip International Conference On Vlsi and System-On-Chip, Vlsi-Soc. 7: 53-58. DOI: 10.1109/VLSI-SoC.2012.7332076  1
2015 Wyers EJ, Morton MA, Sollner TCLG, Kelley CT, Franzon PD. A Generally Applicable Calibration Algorithm for Digitally Reconfigurable Self-Healing RFICs Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. DOI: 10.1109/TVLSI.2015.2424211  1
2015 Charles G, Franzon PD. A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2416196  1
2015 Karim MA, Franzon PD. A 0.65 mW/Gbps 30 Gbps capacitive coupled 10 mm serial link in 2.5D silicon interposer 2014 Ieee 23rd Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2014. 131-134. DOI: 10.1109/EPEPS.2014.7103614  1
2015 Franzon P, Rotenberg E, Tuck J, Davis WR, Zhou H, Schabel J, Zhang Z, Dwiel JB, Forbes E, Huh J, Lipa S. Computing in 3D Proceedings of the Custom Integrated Circuits Conference. 2015. DOI: 10.1109/CICC.2015.7338401  1
2015 Harris TR, Wyers EJ, Lee W, Graham S, Pavlidis G, Franzon PD, Davis WR. Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks 2015 International 3d Systems Integration Conference, 3dic 2015. TS10.2.1-TS10.2.4. DOI: 10.1109/3DIC.2015.7334616  0.56
2015 Wyers EJ, Harris TR, Pitts WS, Massad JE, Franzon PD. Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment 2015 International 3d Systems Integration Conference, 3dic 2015. TS8.27.1-TS8.27.4. DOI: 10.1109/3DIC.2015.7334597  1
2015 Burr GW, Franzon P. Storage Class Memory Emerging Nanoelectronic Devices. 498-510. DOI: 10.1002/9781118958254.ch25  1
2014 Bapat OA, Franzon PD, Fastow RM. A generic and scalable architecture for a large acoustic model and large vocabulary speech recognition accelerator using logic on memory Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 22: 2701-2712. DOI: 10.1109/TVLSI.2013.2296526  1
2014 Chen X, Zhu T, Davis WR, Franzon PD. Adaptive and reliable clock distribution design for 3-D integrated circuits Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1862-1870. DOI: 10.1109/TCPMT.2014.2361356  1
2014 Gadfort P, Franzon PD. Millimeter-scale true 3-D antenna-in-package structures for near-field power transfer Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1574-1581. DOI: 10.1109/TCPMT.2014.2349983  1
2014 Priyadarshi S, Davis WR, Steer MB, Franzon PD. Thermal pathfinding for 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1159-1168. DOI: 10.1109/TCPMT.2014.2321005  1
2014 Sarkar B, Ramanan N, Jayanti S, Spigna ND, Lee B, Franzon P, Misra V. Dual floating gate unified memory MOSFET with simultaneous dynamic and non-volatile operation Ieee Electron Device Letters. 35: 48-50. DOI: 10.1109/LED.2013.2289751  1
2014 Priyadarshi S, Davis WR, Franzon PD. Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC Icicdt 2014 - Ieee International Conference On Integrated Circuit Design and Technology. DOI: 10.1109/ICICDT.2014.6838612  1
2014 Robert Harris T, Franzon P, Rhett Davis W, Wang L. Thermal effects of heterogeneous interconnects on InP/GaN/Si diverse integrated circuits 2014 International 3d Systems Integration Conference, 3dic 2014 - Proceedings. DOI: 10.1109/3DIC.2014.7152182  1
2014 Widialaksono R, Zhao W, Davis WR, Franzon P. Leveraging 3D-IC for on-chip timing uncertainty measurements 2014 International 3d Systems Integration Conference, 3dic 2014 - Proceedings. DOI: 10.1109/3DIC.2014.7152172  1
2014 Franzon PD, Rotenberg E, Tuck J, Zhou H, Davis WR, Dai H, Huh J, Ku S, Lipa S, Li C, Park JB, Schabel J. 3D-enabled customizable embedded computer (3DECC) 2014 International 3d Systems Integration Conference, 3dic 2014 - Proceedings. DOI: 10.1109/3DIC.2014.7152143  1
2014 Franzon P. Design strategies to leverage 3D technologies Designcon 2014: Where the Chip Meets the Board 1
2014 Franzon P, Nackashi D, Amsinck C, DiSpigna N, Sonkusale S. Molecular electronics – devices and circuits technology Ifip Advances in Information and Communication Technology. 240.  1
2013 Kim H, Won C, Franzon PD. Crosstalk-canceling multimode interconnect using transmitter encoding Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 21: 1562-1567. DOI: 10.1109/TVLSI.2012.2213281  1
2013 Wyers EJ, Steer MB, Kelley CT, Franzon PD. A bounded and discretized Nelder-Mead algorithm suitable for RFIC calibration Ieee Transactions On Circuits and Systems I: Regular Papers. 60: 1787-1799. DOI: 10.1109/TCSI.2012.2230496  1
2013 Sarkar B, Jayanti S, Di Spigna N, Lee B, Misra V, Franzon P. Investigation of intermediate dielectric for dual floating gate MOSFET 13th Non-Volatile Memory Technology Symposium, Nvmts 2013. DOI: 10.1109/NVMTS.2013.6851052  1
2013 Priyadarshi S, Choudhary NK, Dwiel B, Upreti A, Rotenberg E, Davis R, Franzon P. Hetero2 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors Proceedings - International Symposium On Quality Electronic Design, Isqed. 1-7. DOI: 10.1109/ISQED.2013.6523582  1
2013 Franzon PD, Priyadarshi S, Lipa S, Davis WR, Thorolfsson T. Exploring early design tradeoffs in 3DIC Proceedings - Ieee International Symposium On Circuits and Systems. 545-549. DOI: 10.1109/ISCAS.2013.6571901  1
2013 Franzon PD, Rotenberg E, Tuck J, Davis WR, Zhou H, Schabel J, Zhang Z, Park J, Dwiel B, Forbes E, Huh J, Priyadarshi S, Lipa S, Thorolfsson T. Applications and design styles for 3DIC Technical Digest - International Electron Devices Meeting, Iedm. 29.4.1-29.4.4. DOI: 10.1109/IEDM.2013.6724717  1
2013 Rotenberg E, Dwiel BH, Forbes E, Zhang Z, Widialaksono R, Basu Roy Chowdhury R, Tshibangu N, Lipa S, Davis WR, Franzon PD. Rationale for a 3D heterogeneous multi-core processor 2013 Ieee 31st International Conference On Computer Design, Iccd 2013. 154-168. DOI: 10.1109/ICCD.2013.6657038  1
2013 Zhao W, Gadfort P, Erickson E, Franzon PD. A compact inductively coupled connector for mobile devices Proceedings - Electronic Components and Technology Conference. 2385-2390. DOI: 10.1109/ECTC.2013.6575919  1
2013 Yan Z, Franzon PD, Aygun K, Braunisch H. Circuit/channel co-design methodology for multimode signaling Proceedings - Electronic Components and Technology Conference. 1356-1361. DOI: 10.1109/ECTC.2013.6575750  1
2013 Karim MA, Franzon PD, Kumar A. Power comparison of 2D, 3D and 2.5D interconnect solutions and power optimization of interposer interconnects Proceedings - Electronic Components and Technology Conference. 860-866. DOI: 10.1109/ECTC.2013.6575674  1
2013 Franzon P, Bar-Cohen A. Thermal requirements in future 3D processors 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702402  1
2013 Zhang Z, Franzon P. TSV-based, modular and collision detectable face-to-back shared bus design 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702399  1
2013 Tshibangu NM, Franzon PD, Rotenberg E, Davis WR. Design of controller for L2 cache mapped in Tezzaron stacked DRAM 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702397  1
2013 Zhang Z, Noia B, Chakrabarty K, Franzon P. Face-to-face bus design with built-in self-test in 3D ICs 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702395  1
2013 Suh EJ, Franzon PD. Design of 60 GHz contactless probe system for RDL in passive silicon interposer 2013 Ieee International 3d Systems Integration Conference, 3dic 2013. DOI: 10.1109/3DIC.2013.6702352  1
2013 Zhu T, Yelten MB, Steer MB, Franzon PD. Model-based variation-aware integrated circuit design Surrogate-Based Modeling and Optimization: Applications in Engineering. 2147483647: 171-188. DOI: 10.1007/978-1-4614-7551-4_8  0.56
2012 Di Spigna N, Schinke D, Jayanti S, Misra V, Franzon P. A novel double floating-gate unified memory device 20th Ifip/Ieee International Conference On Very Large Scale Integration, Vlsi-Soc 2012 - Proceedings. 53-58. DOI: 10.1109/VLSI-SoC.2012.6379005  1
2012 Yelten MB, Franzon PD, Steer MB. Analog negative-bias-temperature-instability monitoring circuit Ieee Transactions On Device and Materials Reliability. 12: 177-179. DOI: 10.1109/TDMR.2011.2178096  1
2012 Priyadarshi S, Saunders CS, Kriplani NM, Demircioglu H, Davis WR, Franzon PD, Steer MB. Parallel transient simulation of multiphysics circuits using delay-based partitioning Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 1522-1535. DOI: 10.1109/TCAD.2012.2201156  1
2012 Melamed S, Thorolfsson T, Harris TR, Priyadarshi S, Franzon P, Steer MB, Davis WR. Junction-level thermal analysis of 3-d integrated circuits using high definition power blurring Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 676-689. DOI: 10.1109/TCAD.2011.2180384  1
2012 Gadfort P, Franzon PD. Near threshold RF-only analog to digital converter 2012 Ieee Subthreshold Microelectronics Conference, Subvt 2012. DOI: 10.1109/SubVT.2012.6404321  1
2012 Ledford J, Gadfort P, Franzon PD. An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies 2012 Ieee Subthreshold Microelectronics Conference, Subvt 2012. DOI: 10.1109/SubVT.2012.6404316  1
2012 Zhu T, Steer MB, Franzon PD. Surrogate model-based self-calibrated design for process and temperature compensation in analog/RF circuits Ieee Design and Test of Computers. 29: 74-83. DOI: 10.1109/MDT.2012.2220332  1
2012 Yelten MB, Zhu T, Koziel S, Franzon PD, Steer MB. Demystifying surrogate modeling for circuits and systems Ieee Circuits and Systems Magazine. 12: 45-63. DOI: 10.1109/MCAS.2011.2181095  1
2012 Yelten MB, Franzon PD, Steer MB. Process mismatch analysis based on reduced-order models Proceedings - International Symposium On Quality Electronic Design, Isqed. 648-655. DOI: 10.1109/ISQED.2012.6187561  1
2012 Charles G, Franzon PD. Comparison of TSV-based PDN-design effects using various stacking topology methods 2012 Ieee 21st Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2012. 83-86. DOI: 10.1109/EPEPS.2012.6457848  1
2012 Yan Z, Won C, Franzon PD, Aygun K, Braunisch H. S-parameter based multimode signaling 2012 Ieee 21st Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2012. 11-14. DOI: 10.1109/EPEPS.2012.6457832  1
2012 Gadfort P, Franzon PD. Design, modeling, and fabrication of mm 3 three-dimensional integrated antennas Proceedings - Electronic Components and Technology Conference. 1794-1799. DOI: 10.1109/ECTC.2012.6249081  1
2012 Thorolfsson T, Lipa S, Franzon PD. A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration Proceedings of the Custom Integrated Circuits Conference. DOI: 10.1109/CICC.2012.6330589  1
2012 Priyadarshi S, Harris TR, Melamed S, Otero C, Kriplani NM, Christoffersen CE, Manohar R, Dooley SR, Davis WR, Franzon PD, Steer MB. Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels Iet Circuits, Devices and Systems. 6: 35-44. DOI: 10.1049/iet-cds.2011.0061  1
2012 Chakraborti P, Toprakci HAK, Yang P, Di Spigna N, Franzon P, Ghosh T. A compact dielectric elastomer tubular actuator for refreshable Braille displays Sensors and Actuators, a: Physical. 179: 151-157. DOI: 10.1016/j.sna.2012.02.004  1
2012 Lou Y, Yan Z, Zhang F, Franzon PD. Comparing through-silicon-via (TSV) void/pinhole defect self-test methods Journal of Electronic Testing: Theory and Applications (Jetta). 28: 27-38. DOI: 10.1007/s10836-011-5261-4  1
2012 Yelten MB, Franzon PD, Steer MB. Comparison of modeling techniques in circuit variability analysis International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 25: 288-302. DOI: 10.1002/jnm.836  1
2011 Yelten MB, Franzon PD, Steer MB. Surrogate-model-based analysis of analog circuits-part I: Variability analysis Ieee Transactions On Device and Materials Reliability. 11: 466-473. DOI: 10.1109/TDMR.2011.2160063  1
2011 Yelten MB, Franzon PD, Steer MB. Surrogate-model-based analysis of analog circuits-part II: Reliability analysis Ieee Transactions On Device and Materials Reliability. 11: 458-465. DOI: 10.1109/TDMR.2011.2160062  1
2011 Zhu T, Steer MB, Franzon PD. Accurate and scalable IO buffer macromodel based on surrogate modeling Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1240-1249. DOI: 10.1109/TCPMT.2011.2138704  1
2011 Franzon PD, Davis WR, Thorolfsson T, Melamed S. 3D specific systems design and CAD Proceedings - 2011 International Conference On Embedded Computer Systems: Architectures, Modeling and Simulation, Ic-Samos 2011. 326-329. DOI: 10.1109/SAMOS.2011.6045479  1
2011 Schinke D, Di Spigna N, Shiveshwarkar M, Franzon P. Computing with novel floating-gate devices Computer. 44: 29-36. DOI: 10.1109/MC.2010.366  1
2011 Charles G, Franzon PD, Kim J, Levin A. Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1 st-droop and resonant noise in 3DIC 2011 Ieee 20th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps-2011. 267-270. DOI: 10.1109/EPEPS.2011.6100243  1
2011 Chen X, Davis WR, Franzon PD. Adaptive clock distribution for 3D integrated circuits 2011 Ieee 20th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps-2011. 91-94. DOI: 10.1109/EPEPS.2011.6100195  1
2011 Su B, Pitts WS, Franzon PD, Wilson J. A zero power consumption multi-capacitor structure for voltage summing in high-speed FFE 2010 Ieee 19th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2010. 13-16. DOI: 10.1109/EPEPS.2010.5642532  1
2011 Franzon PD, Davis WR, Thorolfsson T, Melamed S. 3D specific systems: Design and CAD Proceedings of the Asian Test Symposium. 470-473. DOI: 10.1109/ATS.2011.99  1
2011 Wang R, Charles G, Franzon P. Modeling and compare of through-silicon-via (TSV) in high frequency 2011 Ieee International 3d Systems Integration Conference, 3dic 2011. DOI: 10.1109/3DIC.2012.6263048  1
2011 Priyadarshi S, Hu J, Choi WH, Melamed S, Chen X, Davis WR, Franzon PD. Pathfinder 3D: A flow for system-level design space exploration 2011 Ieee International 3d Systems Integration Conference, 3dic 2011. DOI: 10.1109/3DIC.2012.6262961  1
2011 Franzon PD, Davis WR, Zhou Z, Priyadarshi S, Hogan M, Karnik T, Srinavas G. Coordinating 3D designs: Interface IP, standards or free form? 2011 Ieee International 3d Systems Integration Conference, 3dic 2011. DOI: 10.1109/3DIC.2012.6262960  1
2011 Thorolfsson T, Moezzi-Madani N, Franzon PD. Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor Iet Computers and Digital Techniques. 5: 198-204. DOI: 10.1049/iet-cdt.2009.0106  1
2011 Schinke D, Priyadarshi S, Shepherd Pitts W, Di Spigna N, Franzon P. SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation Iet Circuits, Devices and Systems. 5: 477-483. DOI: 10.1049/iet-cds.2010.0410  1
2011 Zhu T, Yelten MB, Steer MB, Franzon PD. Application of surrogate modeling in variation-aware macromodel and circuit design Simultech 2011 - Proceedings of 1st International Conference On Simulation and Modeling Methodologies, Technologies and Applications. 502-508.  1
2010 Thorolfsson T, Melamed S, Davis WR, Franzon PD. Low-power hypercube divided memory FFT engine using 3D integration Acm Transactions On Design Automation of Electronic Systems. 16. DOI: 10.1145/1870109.1870114  1
2010 Di Spigna N, Chakraborti P, Winick D, Yang P, Ghosh T, Franzon P. The integration of novel EAP-based Braille cells for use in a refreshable tactile display Proceedings of Spie - the International Society For Optical Engineering. 7642. DOI: 10.1117/12.847666  1
2010 Choi Y, Braunisch H, Aygün K, Franzon PD. Multimode transceiver for high-density interconnects: Measurement and validation Proceedings - Electronic Components and Technology Conference. 1733-1738. DOI: 10.1109/ECTC.2010.5490738  1
2010 Thorolfsson T, Luo G, Cong J, Franzon PD. Logic-on-logic 3D integration and placement Ieee 3d System Integration Conference 2010, 3dic 2010. DOI: 10.1109/3DIC.2010.5751451  1
2010 Lipa S, Thorolfsson T, Franzon P. The NCSU Tezzaron design kit Ieee 3d System Integration Conference 2010, 3dic 2010. DOI: 10.1109/3DIC.2010.5751418  1
2010 Franzon PD, Davis WR, Thorolffson T. Creating 3D specific systems: Architecture, design and CAD Proceedings -Design, Automation and Test in Europe, Date. 1684-1688.  1
2010 Franzon PD, Davis WR, Thorolfsson T, Melamed S. Creating 3D specific systems: Architecture, design and CAD 43rd International Symposium On Microelectronics 2010, Imaps 2010. 23-27.  1
2010 Melamed S, Thorolfsson T, Srinivasany A, Chengy E, Franzon P, Davis WR. Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs 16th International Workshop On Thermal Investigations of Ics and Systems, Therminic 2010. 74-79.  1
2009 Kumar P, Reinitz HW, Simunovic J, Sandeep KP, Franzon PD. Overview of RFID technology and its applications in the food industry. Journal of Food Science. 74: R101-6. PMID 19799677 DOI: 10.1111/j.1750-3841.2009.01323.x  1
2009 He T, Corley DA, Lu M, Di Spigna NH, He J, Nackashi DP, Franzon PD, Tour JM. Controllable molecular modulation of conductivity in silicon-based devices. Journal of the American Chemical Society. 131: 10023-30. PMID 19569647 DOI: 10.1021/ja9002537  1
2009 Thorolfsson T, Moezzi-Madani N, Franzon PD. A low power 3D integrated FFT engine using hypercube memory division Proceedings of the International Symposium On Low Power Electronics and Design. 231-236. DOI: 10.1145/1594233.1594289  1
2009 Di Spigna N, Chakraborti P, Yang P, Ghosh T, Franzon P. Application of EAP materials toward a refreshable Braille display Proceedings of Spie - the International Society For Optical Engineering. 7287. DOI: 10.1117/12.816009  1
2009 Davis WR, Oh EC, Sule AM, Franzon PD. Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 496-506. DOI: 10.1109/TVLSI.2008.2009352  1
2009 Zhang L, Wilson JM, Bashirullah R, Luo L, Xu J, Franzon PD. A 32-Gb/s on-chip bus with driver pre-emphasis signaling Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 1267-1274. DOI: 10.1109/TVLSI.2008.2002682  1
2009 Gadfort P, Franzon PD. Low-power self-equalizing driver for silicon carrier interconnects with low bit error rate 2009 Ieee 18th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps '09. 37-40. DOI: 10.1109/EPEPS.2009.5338482  1
2009 Zhu T, Franzon PD. Application of surrogate modeling to generate compact and PVT-sensitive IBIS models 2009 Ieee 18th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps '09. 77-80. DOI: 10.1109/EPEPS.2009.5338472  1
2009 Erickson E, Wilson J, Chandrasekar K, Franzon PD. Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors 2009 Ieee 18th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps '09. 121-124. DOI: 10.1109/EPEPS.2009.5338463  1
2009 Zhu T, Franzon PD. An enhanced macromodeling approach for differential output drivers Bmas 2009 - 2009 Ieee International Behavioral Modeling and Simulation Workshop. 54-59. DOI: 10.1109/BMAS.2009.5338889  1
2009 Thorolfsson T, Melamed S, Charles G, Franzon PD. Comparative analysis of two 3D integration implementations of a SAR processor 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306598  1
2009 Tsai M, Klooz A, Leonard A, Appel J, Franzon P. Through silicon via(TSV) defect/pinhole self test circuit for 3D-IC 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306569  1
2009 Oh EC, Franzon PD. Technology impact analysis for 3D TCAM 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306563  1
2009 Melamed S, Thorolfsson T, Srinivasany A, Chengy E, Franzon P, Davis R. Junction-level thermal extraction and simulation of 3DICs 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306529  1
2009 Thorolfsson T, Gonsalves K, Franzon PD. Design automation for a 3DIC FFT processor for synthetic aperture radar: A case study Proceedings - Design Automation Conference. 51-56.  1
2008 Xie Y, Cong J, Franzon P. Editorial: Special issue on 3D integrated circuits and microarchitectures Acm Journal On Emerging Technologies in Computing Systems. 4. DOI: 10.1145/1412587.1412588  1
2008 Franzon PD, Lipa S, Oh J, Thorolfsson T, Davis R. Memory rich applications for 3D integration Proceedings of Spie - the International Society For Optical Engineering. 7268. DOI: 10.1117/12.810061  1
2008 Canavero F, Franzon PD. Special section on electrical performance analysis and simulation of interconnects, packages and devices composing electronic systems for high-performance applications Ieee Transactions On Advanced Packaging. 31: 662-663. DOI: 10.1109/TADVP.2008.2009342  1
2008 Chandrasekar K, Wilson J, Erickson E, Feng Z, Xu J, Mick S, Franzon P. Inductively coupled connectors and sockets for multi-Gb/s pulse signaling Ieee Transactions On Advanced Packaging. 31: 749-758. DOI: 10.1109/TADVP.2008.2005465  1
2008 Varma AK, Steer M, Franzon PD. Improving behavioral IO buffer modeling based on IBIS Ieee Transactions On Advanced Packaging. 31: 711-721. DOI: 10.1109/TADVP.2008.2004995  1
2008 Davis WR, Sule AM, Franzon PD. An 8192-point fast fourier transform 3D-IC case study Midwest Symposium On Circuits and Systems. 438-441. DOI: 10.1109/MWSCAS.2008.4616830  1
2008 Su B, Patel P, Hunter SW, Cases M, Franzon PD. AC coupled backplane communication using embedded capacitor Electrical Performance of Electronic Packaging, Epep. 295-298. DOI: 10.1109/EPEP.2008.4675938  1
2008 Choi Y, Won C, Franzon PD, Braunisch H, Aygtün K. Multimode signaling on non-ideal channels Electrical Performance of Electronic Packaging, Epep. 51-54. DOI: 10.1109/EPEP.2008.4675874  1
2008 Choi Y, Braunisch H, Aygün K, Franzon PD. Analysis of inter-bundle crosstalk in multimode signaling for high-density interconnects Proceedings - Electronic Components and Technology Conference. 664-668. DOI: 10.1109/ECTC.2008.4550043  1
2008 Franzon PD. Design for 3D Integration at North Carolina State University Handbook of 3d Integration: Technology and Applications of 3d Integrated Circuits. 2: 517-527. DOI: 10.1002/9783527623051.ch27  1
2007 Blum AS, Soto CM, Wilson CD, Amsinck C, Franzon P, Ratna BR. Electronic properties of molecular memory circuits on a nanoscale scaffold. Ieee Transactions On Nanobioscience. 6: 270-4. PMID 18217619 DOI: 10.1109/TNB.2007.908978  1
2007 Oh EC, Franzon PD. TCAM core design in 3D IC for low matchline capacitance and low power Proceedings of Spie - the International Society For Optical Engineering. 6414. DOI: 10.1117/12.695915  1
2007 Zhang L, Wilson JM, Bashirullah R, Luo L, Xu J, Franzon PD. Voltage-mode driver preemphasis technique for on-chip global buses Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 15: 231-236. DOI: 10.1109/TVLSI.2007.893588  1
2007 Yuce MR, Liu W, Damiano J, Bharath B, Franzon PD, Dogan NS. SOI CMOS implementation of a multirate PSK demodulator for space communications Ieee Transactions On Circuits and Systems I: Regular Papers. 54: 420-431. DOI: 10.1109/TCSI.2006.885988  1
2007 Wilson JM, Mick SE, Xu J, Luo L, Erickson EL, Franzon PD. Considerations for transmission line design on MCMs using AC coupled interconnect with buried solder bumps Proceedings - 10th Ieee Workshop On Signal Propagation On Interconnects, Spi 2006. 281-282. DOI: 10.1109/SPI.2006.289245  1
2007 Chandra D, Pazhayaveetil U, Franzon PD. Architecture for low power large vocabulary speech recognition 2006 Ieee International Systems-On-Chip Conference, Soc. 25-28. DOI: 10.1109/SOCC.2006.283836  1
2007 Franzon PD. Molecular electronic circuits Proceedings of the 2nd Ieee International Workshop On Advances in Sensors and Interfaces, Iwasi. DOI: 10.1109/IWASI.2007.4420001  1
2007 Varma A, Steer M, Franzon P. System level validation of improved IO buffer behavioral modeling methodology based on IBIS Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 351-356. DOI: 10.1109/EPEP.2007.4387200  1
2007 Thorolfsson T, Franzon PD. System design for 3D multi-FPGA packaging Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 171-174. DOI: 10.1109/EPEP.2007.4387152  1
2007 Franzon P, Lambert M. Proceedings of 2007 9th International Conference on Transparent Optical Networks, ICTON 2007: Introduction Ieee Topical Meeting On Electrical Performance of Electronic Packaging. DOI: 10.1109/EPEP.2007.4387104  1
2007 Oh EC, Franzon PD. Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory Proceedings of the Ieee 2007 Custom Integrated Circuits Conference, Cicc 2007. 591-594. DOI: 10.1109/CICC.2007.4405801  1
2007 Sonkusale SR, Di Spigna NH, Franzon PD. Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process Microelectronic Engineering. 84: 1523-1527. DOI: 10.1016/j.mee.2007.01.210  1
2007 Franzon P, Nackashi D, Amsinck C, Dispigna N, Sonkusale S. Molecular electronics - Devices and circuits technology Ifip International Federation For Information Processing. 240: 1-10. DOI: 10.1007/978-0-387-73661-7_1  1
2007 Pazhayaveetil U, Chandra D, Franzon P. Flexible low power probability density estimation unit for speech recognition Proceedings - Ieee International Symposium On Circuits and Systems. 1117-1120.  1
2007 Yadav M, Venkatachaliah A, Franzon PD. Hardware architecture of a parallel pattern matching engine Proceedings - Ieee International Symposium On Circuits and Systems. 1369-1372.  1
2007 Chandrasekar K, Wilson J, Erickson E, Feng Z, Xu J, Mick S, Franzon P. Signal integrity analysis for inductively coupled connectors and sockets International Engineering Consortium - Designcon 2007. 3: 1519-1539.  1
2006 He T, He J, Lu M, Chen B, Pang H, Reus WF, Nolte WM, Nackashi DP, Franzon PD, Tour JM. Controlled modulation of conductance in silicon devices by molecular monolayers. Journal of the American Chemical Society. 128: 14537-41. PMID 17090037 DOI: 10.1021/ja063571l  1
2006 Di Spigna NH, Nackashi DP, Amsinck CJ, Sonkusale SR, Franzon PD. Deterministic nanowire fanout and interconnect without any critical translational alignment Ieee Transactions On Nanotechnology. 5: 356-361. DOI: 10.1109/TNANO.2006.876926  1
2006 Sonkusale S, Franzon P. Controlled nanowire fabrication by PEDAL process 2006 1st International Conference On Nano-Networks and Workshops, Nano-Net. DOI: 10.1109/NANONET.2006.346225  1
2006 Luo L, Wilson JM, Mick SE, Xu J, Zhang L, Franzon PD. 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver Ieee Journal of Solid-State Circuits. 41: 287-296. DOI: 10.1109/JSSC.2005.859881  1
2006 Varma A, Steer M, Franzon P. Developing improved IO buffer behavioral modeling methodology based on IBIS Electrical Performance of Electronic Packaging, Epep. 69-72. DOI: 10.1109/EPEP.2006.321193  1
2006 Chandrasekar K, Wilson J, Erickson E, Feng Z, Xu J, Mick S, Franzon P. Fine pitch inductively coupled connectors for multi-gbps pulse signaling Electrical Performance of Electronic Packaging, Epep. 11-14. DOI: 10.1109/EPEP.2006.321178  1
2006 Wilson J, Luo L, Xu J, Mick S, Erickson E, Su HJ, Chan B, Lin H, Franzon P. AC coupled interconnect using buried bumps for laminated organic packages Proceedings - Electronic Components and Technology Conference. 2006: 41-48. DOI: 10.1109/ECTC.2006.1645624  1
2006 Kang TH, Merritt C, Karaguzel B, Wilson J, Franzon P, Pourdeyhimi B, Grant E, Nagle T. Sensors on textile substrates for home-based healthcare monitoring Conference Proceedings - 1st Transdisciplinary Conference On Distributed Diagnosis and Home Healthcare, D2h2 2006. 2006: 5-7. DOI: 10.1109/DDHH.2006.1624783  1
2006 Luo L, Wilson J, Mick S, Xu J, Zhang L, Erickson E, Franzon P. A 36Gb/s ACCI multi-channel bus using a fully differential pulse receiver Proceedings of the Custom Integrated Circuits Conference. 773-776. DOI: 10.1109/CICC.2006.320976  1
2006 Zhang L, Wilson J, Bashirullah R, Luo L, Xu J, Franzon P. A 32Gb/s on-chip bus with driver pre-emphasis signaling Proceedings of the Custom Integrated Circuits Conference. 265-268. DOI: 10.1109/CICC.2006.320855  1
2005 Amsinck CJ, Di Spigna NH, Nackashi DP, Franzon PD. Scaling constraints in nanoelectronic random-access memories. Nanotechnology. 16: 2251-60. PMID 20818005 DOI: 10.1088/0957-4484/16/10/047  1
2005 Blum AS, Soto CM, Wilson CD, Brower TL, Pollack SK, Schull TL, Chatterji A, Lin T, Johnson JE, Amsinck C, Franzon P, Shashidhar R, Ratna BR. An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale. Small (Weinheim An Der Bergstrasse, Germany). 1: 702-6. PMID 17193509 DOI: 10.1002/smll.200500021  1
2005 Wilson JM, Bashirullah R, Nackashi DP, Winick DA, Franzon PD. An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process Proceedings of Spie - the International Society For Optical Engineering. 5836: 138-152. DOI: 10.1117/12.607592  1
2005 Mehrotra P, Rao V, Conte TM, Franzon PD. Optimal chip-package codesign for high-performance DSP Ieee Transactions On Advanced Packaging. 28: 288-297. DOI: 10.1109/TADVP.2005.846937  1
2005 Varma AK, Glaser A, Franzon PD. CAD flows for chip-package coverification Ieee Transactions On Advanced Packaging. 28: 96-101. DOI: 10.1109/TADVP.2004.841475  1
2005 Nackashi DP, Amsinck CJ, Dispigna NH, Franzon PD. Molecular electronic latches and memories 2005 5th Ieee Conference On Nanotechnology. 2: 89-92. DOI: 10.1109/NANO.2005.1500658  1
2005 Nath J, Ghosh D, Fathelbab W, Maria JP, Kingon AI, Franzon PD, Steer MB. A tunable combline bandpass filter using barium strontium titanate interdigital varactors on an alumina substrate Ieee Mtt-S International Microwave Symposium Digest. 2005: 595-598. DOI: 10.1109/MWSYM.2005.1516670  1
2005 Dogan NS, Franzon P, Liu W. Impact of an SoC research project on microelectronics education: A case study Proceedings - 2005 Ieee International Conference On Microelectronic Systems Education, Mse '05 - Promoting Excellence and Innovation in Microelectronic Systems Education. 2005: 33-34. DOI: 10.1109/MSE.2005.35  1
2005 Davis WR, Wilson J, Mick S, Xu J, Hua H, Mineo C, Sule AM, Steer M, Franzon PD. Demystifying 3D ICs: The pros and cons of going vertical Ieee Design and Test of Computers. 22: 498-510. DOI: 10.1109/MDT.2005.136  1
2005 Xu J, Grant E, Kingon AI, Wilson JM, Franzon PD. Drive circuit for a mode conversion rotary ultrasonic motor Iecon Proceedings (Industrial Electronics Conference). 2005: 1588-1592. DOI: 10.1109/IECON.2005.1569141  1
2005 Zhang L, Wilson J, Bashirullah R, Franzon P. Differential current-mode signaling for robust and power efficient on-chip global interconnects Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 315-318. DOI: 10.1109/EPEP.2005.1563768  1
2005 Varma A, Steer M, Franzon P. A new method to achieve improved accuracy with IBIS models Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 119-122. DOI: 10.1109/EPEP.2005.1563716  1
2005 Luo L, Wilson J, Xu J, Mick S, Franzon P. Signal integrity and robustness of ACCI packaged systems Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 11-14. DOI: 10.1109/EPEP.2005.1563687  1
2005 Wilson J, Mick S, Xu J, Luo L, Bonafede S, Huffman A, LaBennett R, Franzon P. Fully integrated AC coupled interconnect using buried bumps Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 7-10. DOI: 10.1109/EPEP.2005.1563686  1
2005 Xu J, Wilson J, Mick S, Luo L, Franzon P. 2.8Gb/s inductively coupled interconnect for 3-D ICs Ieee Symposium On Vlsi Circuits, Digest of Technical Papers. 2005: 352-355.  1
2005 Chandrasekar K, Feng Z, Wilson J, Mick S, Franzon P. Inductively coupled board-to-board connectors Proceedings - Electronic Components and Technology Conference. 2: 1109-1113.  1
2005 Davis WR, Hua H, Sule A, Mineo C, Melamed S, Steer M, Franzon P. Wire-delay reduction analysis of a 3-tier, 8-point fast fourier transform 3D-IC 2005 Proceedings - 22nd International Vlsi Multilevel Interconnection Conference, Vmic 2005. 474-479.  1
2005 Zhang L, Wilson J, Bashirullah R, Luo L, Xu J, Franzon P. Driver pre-emphasis techniques for on-chip global buses Proceedings of the International Symposium On Low Power Electronics and Design. 186-191.  1
2005 Luo L, Wilson JM, Mick SE, Xu J, Zhang L, Franzon PD. 3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 48.  1
2005 Luo L, Wilson JM, Mick SE, Xu J, Zhang L, Franzon PD. 3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 48.  1
2005 Kim T, Nath J, Wilson J, Mick S, Franzon PD, Steer MB, Kingon AI. A high K nanocomposite for high density chip-to-package interconnections Materials Research Society Symposium Proceedings. 833: 201-206.  1
2004 Seminario JM, Ma Y, Agapito LA, Yan L, Araujo RA, Bingi S, Vadlamani NS, Chagarlamudi K, Sudarshan TS, Myrick ML, Colavita PE, Franzon PD, Nackashi DP, Cheng L, Yao Y, et al. Clustering effects on discontinuous gold film NanoCells. Journal of Nanoscience and Nanotechnology. 4: 907-17. PMID 15570981 DOI: 10.1166/jnn.2004.104  1
2004 Franzon P, Mick S, Wilson J, Luo L, Chandrasakhar K. AC Coupled Interconnect for high-density high-bandwidth packaging Proceedings of Spie - the International Society For Optical Engineering. 5274: 67-69. DOI: 10.1117/12.528076  1
2004 Scheffler M, Franzon PD, Tröster G. A "defect level versus cost" system tradeoff for electronics manufacturing Ieee Transactions On Electronics Packaging Manufacturing. 27: 67-76. DOI: 10.1109/TEPM.2004.830513  1
2004 Mick S, Luo L, Wilson J, Franzon P. Buried bump and AC coupled interconnection technology Ieee Transactions On Advanced Packaging. 27: 121-125. DOI: 10.1109/TADVP.2004.825482  1
2004 Schaffer T, Glaser A, Franzon PD. Chip-package co-implementation of a triple DES processor Ieee Transactions On Advanced Packaging. 27: 194-202. DOI: 10.1109/TADVP.2004.824944  1
2004 Damiano J, Franzon PD. Integrated dynamic body contact for H-gate PD-SOI MOSFETs for high performance / low power Proceedings - Ieee International Soi Conference. 115-116.  1
2004 Varma A, Steer M, Franzon P. SSN issues with IBIS models Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 87-90.  1
2004 Amsinck C, Di Spigna N, Nackashi D, Franzon P. Translating the integration challenges to molecular device requirements - Analysis of scaling constraints in molecular random access memories 2004 Nsti Nanotechnology Conference and Trade Show - Nsti Nanotech 2004. 3: 61-64.  1
2004 Zhang L, Liu W, Bashirullah R, Wilson J, Franzon P. Simplified delay design guidelines for on-chip global interconnects Proceedings of the Acm Great Lakes Symposium On Vlsi. 29-32.  1
2004 Varma A, Lipa S, Glaser A, Steer M, Franzon P. Simultaneous switching noise in IBIS models Ieee International Symposium On Electromagnetic Compatibility. 3: 1000-1004.  1
2004 Yuce MR, Liu W, Bharat B, Damiano J, Franzon PD. The performance and experimental results of a multiple bit rate symbol timing recovery circuit for PSK receivers Proceedings of the Custom Integrated Circuits Conference. 591-594.  1
2003 Tour JM, Cheng L, Nackashi DP, Yao Y, Flatt AK, St Angelo SK, Mallouk TE, Franzon PD. NanoCell electronic memories. Journal of the American Chemical Society. 125: 13279-83. PMID 14570505 DOI: 10.1021/ja036369g  1
2003 Stan MR, Franzon PD, Goldstein SC, Lach JC, Ziegler MM. Molecular electronics: From devices and interconnect to circuits and architecture Proceedings of the Ieee. 91: 1940-1957. DOI: 10.1109/JPROC.2003.818327  1
2003 Varma A, Glaser A, Lipa S, Steer M, Franzon P. The development of a macro-modeling tool to develop IBIS models Electrical Performance of Electronic Packaging. 277-280. DOI: 10.1109/EPEP.2003.1250049  1
2003 Vanna A, Glaser A, Franzon P. CAD flows for chip-package codesign Electrical Performance of Electronic Packaging. 11-14. DOI: 10.1109/EPEP.2003.1249989  1
2003 Yuce MR, Liu W, Damiano J, Bharat B, Franzon PD, Dogan NS. A low power PSK receiver for space applications in 0.35-μm SOI CMOS Proceedings of the Custom Integrated Circuits Conference. 155-158.  1
2002 Tour JM, Van Zandt WL, Husband CP, Husband SM, Wilson LS, Franzon PD, Nackashi DP. Nanocell logic gates for molecular computing Ieee Transactions On Nanotechnology. 1: 100-108. DOI: 10.1109/TNANO.2002.804744  1
2002 Mehrotra P, Franzon PD. Novel hardware architecture for fast address lookups Ieee International Conference On High Performance Switching and Routing, Hpsr. 105-110. DOI: 10.1109/HPSR.2002.1024217  1
2002 Mick S, Luo L, Wilson J, Franzon P. Buried solder bump connections for high-density capacitive coupling Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2002: 205-208. DOI: 10.1109/EPEP.2002.1057916  0.56
2002 Mick S, Wilson J, Franzon P. 4 Gbps high-density AC coupled interconnection Proceedings of the Custom Integrated Circuits Conference. 133-140.  1
2002 Mehrotra P, Franzon PD. Binary search schemes for fast IP lookups Conference Record / Ieee Global Telecommunications Conference. 2: 2005-2009.  1
2001 Duewer B, Winick D, Oberhofer AE, Muth J, Franzon PD. Improving interconnect characteristics of thin film MEMS processes Proceedings of Spie - the International Society For Optical Engineering. 4592: 196-204. DOI: 10.1117/12.448966  1
2001 Wilson J, Bashirullah R, Nackashi D, Winick D, Duewer B, Franzon PD. Design of rotating MEMS tunable capacitors for use at RF and Microwave frequencies Proceedings of Spie - the International Society For Optical Engineering. 4593: 186-197. DOI: 10.1117/12.448850  1
2001 Nackashi DP, Franzon PD. Molectronics: A circuit design perspective Proceedings of Spie - the International Society For Optical Engineering. 4236: 80-88. DOI: 10.1117/12.418782  1
2001 Franzon PD. Proceeding of SPIE - The International Society for Optical Engineering: Introduction Proceedings of Spie - the International Society For Optical Engineering. 4593.  1
2001 Mehrotra P, Baldine I, Stevenson D, Franzon P. Network processor design for optical burst switched networks Proceedings of the Annual Ieee International Asic Conference and Exhibit. 296-300.  1
2001 Wood J, Lipa S, Franzon P, Steer M. Multi-gigaHertz low-power low-skew rotary clock scheme Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 400-401+470.  1
2000 Gahide S, Hodge GL, Oxenham W, Seyam AM, Franzon PD. Micromachines and textiles: Matching two industries Proceedings of the 80th World Conference of the Textile Institute, Manchester, April 16 - 19, 2000.. 1.  1
2000 Gahide S, Hodge GL, Oxenham W, Seyam AM, Franzon PD. Micromachines and textiles; matching two industries Textile Asia. 31: 58-66.  1
2000 Mulling J, Usher T, Dessent B, Palmer J, Franzon P, Grant E, Kingon A. High displacement piezoelectric actuators: Characterization at high load with controlled end conditions Ieee International Symposium On Applications of Ferroelectrics. 2: 745-748.  1
1999 Louis Lo H, Frank Kauffman J, Franzon PD. High frequency loss and electromagnetic field distribution for striplines and microstrips Ieee Transactions On Advanced Packaging. 22: 16-25. DOI: 10.1109/6040.746538  1
1999 Duewer B, Winick D, Wilson J, Palmer J, Franzon P. Methodology for design of electrostatic MEMS devices using the SUMMiT process Instrumentation in the Aerospace Industry : Proceedings of the International Symposium. 507-516.  1
1999 Duewer BE, Wilson JM, Winick DA, Franzon PD. Programmable MEMS capacitor arrays Proceedings of Spie - the International Society For Optical Engineering. 3893: 262-271.  1
1998 Nakkar M, Harding J, Schwartz D, Franzon P, Conte T. Dynamically programmable cache Proceedings of Spie - the International Society For Optical Engineering. 3526: 218-226. DOI: 10.1117/12.327035  1
1998 Winick D, Duewer B, Chaudhury S, Wilson J, Tucker J, Eksi U, Franzon P. MEMS-based diffractive optical beam steering technology Proceedings of Spie - the International Society For Optical Engineering. 3276: 81-87. DOI: 10.1117/12.302411  1
1998 Al-sarawi SF, Abbott D, Franzon PD. A review of 3-D packaging technology Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 21: 2-14. DOI: 10.1109/96.659500  1
1998 Lipa S, Schaffer JT, Glaser AW, Franzon PD. Flip-chip power distribution Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 39-41.  1
1997 Abbott D, Al-sarawi SF, Franzon P. 3D packaging technology for portable systems Proceedings of the Australian Microelectronics Conference. 221-226.  1
1997 Hsieh HY, Liu W, Franzon P, Cavin R. Clocking Optimization and Distribution in Digital Systems with Scheduled Skews Journal of Vlsi Signal Processing Systems For Signal, Image, and Video Technology. 16: 131-147.  1
1996 Lipa S, Steer MB, Cangellaris AC, Franzon PD. Experimental characterization of transmission lines in thin-film multichip modules Ieee Transactions On Components Packaging and Manufacturing Technology Part A. 19: 122-125. DOI: 10.1109/95.486623  1
1995 Franzon PD, Stanaski A, Tekmen Y, Banerjia S. System Design Optimization for MCM-D/Flip-Chip Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 18: 620-627. DOI: 10.1109/96.475267  1
1995 Basel MS, Steer MB, Franzon PD. Simulation of High Speed Interconnects Using a Convolution-Based Hierarchical Packaging Simulator Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 18: 74-82. DOI: 10.1109/96.365492  1
1995 Glaser AW, Steer MB, Shedd GM, Russell PE, Franzon PD. Method for on-chip interconnect characterization Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 108-110.  1
1994 Simovich S, Mehrotra S, Franzon P, Steer M. Delay and Reflection Noise Macromodeling for Signal Integrity Management of PCBs and MCMs Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 17: 15-21. DOI: 10.1109/96.296426  1
1994 Ma S, Franzon P. Energy Control and Accurate Delay Estimation in the Design of CMOS Buffers Ieee Journal of Solid-State Circuits. 29: 1150-1153. DOI: 10.1109/4.309914  1
1993 Dalal AR, Franzon PD, Lorenzetti MJ. A Layout-Driven Yield Predictor and Fault Generator for VLSI Ieee Transactions On Semiconductor Manufacturing. 6: 77-82. DOI: 10.1109/66.210661  1
1993 Lipa S, Steer MB, Morris AS, Franzon PD. Comparison of Methods for Determining the Capacitance of Planar Transmission Lines with Application to Multichip Module Characterization Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 16: 247-252. DOI: 10.1109/33.232050  1
1993 Franzon PD, Evans RJ. A Multichip Module Design Process for Notebook Computers Computer. 26: 41-49. DOI: 10.1109/2.206512  0.56
1993 Simovich S, Franzon PD, Steer MB. Method for automated waveform analysis of transient responses in digital circuits Electronics Letters. 29: 681-682.  1
1992 Steer MB, Goldberg SB, Franzon PD. Comments on “An Accurate Measurement Technique for Line Properties, Junction Effects, and Dielectric and Magnetic Parameters” Ieee Transactions On Microwave Theory and Techniques. 40: 410-411. DOI: 10.1109/22.120117  1
1991 Goldberg SB, Steer MB, Kasten JS, Franzon PD. Experimental Electrical Characterization of Interconnects and Discontinuities in High-Speed Digital Systems Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 14: 761-765. DOI: 10.1109/33.105130  1
1990 van den Bout D, Franzon P, Paulos J, Miller T, Snyder W, Nagle T, Liu W. Scalable VLSI implementations for neural networks Journal of Vlsi Signal Processing. 1: 367-385. DOI: 10.1007/BF00929928  1
1989 Franzon PD. Modelling interconnect yield in reconfigurable circuits Electronics Letters. 25: 1225-1226.  1
1987 Tewksbury SK, Hatamian M, Franzon P, Hornak LA, Siller CA, Lawrence VB. FIR Digital Filters for High Sample Rate Applications Ieee Communications Magazine. 25: 62-72. DOI: 10.1109/MCOM.1987.1093656  1
1986 Hornak LA, Tewksbury SK, Hatamia M, Ligtenberg A, Sugla B, Franzon P. Through-wafer optical interconnects for multi-wafer wafer-scale integrated architectures Proceedings of Spie - the International Society For Optical Engineering. 679: 57-62. DOI: 10.1117/12.939568  1
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